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Texas Instruments SN74AUC2G126DCUR
- Part No.:
- SN74AUC2G126DCUR
- Manufacturer:
- Texas Instruments
- Package:
- 8-VFSOP (0.091", 2.30mm Width)
- Datasheet:
-
SN74AUC2G126DCUR.pdf
- Description:
- IC BUFFER NON-INVERT 2.7V 8VSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:27,971
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Product details
Overview
SN74AUC2G126DCUR from Texas Instruments is a dual 3-state bus buffer gate optimized for 1.65–1.95 V operation, delivering ±8 mA output drive at 1.8 V, sub-1.9 ns propagation delay, and 10 µA quiescent current. It serves as a level-shifting bidirectional interface in low-voltage memory and logic subsystems of portable computing and battery-powered instrumentation.
For engineers reviewing the SN74AUC2G126DCUR datasheet, SN74AUC2G126DCUR pinout, SN74AUC2G126DCUR application, or SN74AUC2G126DCUR equivalent, key selection criteria include its 1.8-V I/O tolerance, Ioff partial-power-down support, 3.6-V absolute max rating, and VSSOP-8 (DCU) package compatibility with high-density PCB layouts.
Technical Context
This device implements two independent noninverting buffers, each with an active-high output-enable (OE) control enabling true 3-state output behavior. Its AUC logic family ensures sub-1-V operability down to 0.8 V while maintaining rail-to-rail input thresholds defined by VCC-dependent VIH/VIL ratios.
The Ioff circuitry actively disables outputs during power-down, blocking reverse current flow even when VCC = 0 V and I/O pins are biased to 3.6 V. Thermal resistance is 227°C/W (θJA), and ESD protection exceeds JESD 22-A114 (2000-V HBM), A115 (200-V MM), and C101 (1000-V CDM) standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 0.8 V to 2.7 V; supports mixed-mode voltage translation between 1.2-V, 1.5-V, and 1.8-V domains |
| tpd @ 1.8 V | 1.9 ns max; enables timing-critical data paths in DDR memory interfaces and FPGA I/O expansion |
| Output Drive | ±8 mA @ 1.8 V; sufficient to drive 15-pF loads across 2-kΩ terminations without signal degradation |
| Ioff Current | ±10 µA max @ 2.7 V bias; prevents backflow damage during hot-insertion or staggered power sequencing |
| Input Capacitance | 2.5 pF @ 2.5 V; minimizes loading on upstream drivers in high-speed clock or data buses |
| ESD Rating | 2000-V HBM; meets industrial-grade robustness requirements for handheld and field-deployable equipment |
| Quiescent ICC | 10 µA @ 1.8 V; extends battery life in always-on sensor nodes and low-power MCU peripherals |
Pinout & Package
VSSOP-8 (DCU) package: 2.0 mm × 1.25 mm body, 0.5-mm lead pitch, 0.9-mm max height, exposed pad not present, RoHS-compliant NiPdAu lead finish, MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | 1A (Buffer 1 Input) | Noninverting data input for first buffer; accepts 0.8–3.6 V logic levels |
| 2 | 1Y (Buffer 1 Output) | 3-state noninverting output; high-impedance when 1OE = L |
| 3 | 1OE (Buffer 1 Output Enable) | Active-high enable; must be pulled low via resistor during power-up to ensure Hi-Z default state |
| 4 | GND | Digital ground reference; shared return path for both buffers and OE controls |
| 5 | 2A (Buffer 2 Input) | Noninverting data input for second buffer; electrically isolated from 1A path |
| 6 | 2Y (Buffer 2 Output) | 3-state noninverting output; independently controlled by 2OE |
| 7 | 2OE (Buffer 2 Output Enable) | Active-high enable; decoupled from 1OE to allow asymmetric bus gating |
| 8 | VCC | Supply rail; powers both buffers and OE logic; tolerant to 3.6 V transient overvoltage |
Key Features
| Feature | Design Value |
|---|---|
| NanoFree™ packaging | Dies-as-package construction eliminates bond wires and mold compound, reducing parasitic inductance and enabling 0.5-mm pitch routing |
| Ioff partial-power-down | Enables safe operation in systems where VCC may be unpowered while I/O lines remain live (e.g., PCIe hot-plug, modular backplanes) |
| 3.6-V I/O tolerance | Allows direct connection to 3.3-V or 2.5-V logic without external level shifters in mixed-supply SoC interfaces |
| Sub-1-V operability | Functional down to 0.8 V VCC, supporting ultra-low-power modes in energy-harvesting and coin-cell applications |
| Latch-up immunity | Exceeds 100 mA per JESD 78 Class II, ensuring reliability in noisy industrial environments with ground bounce |
Applications
| Memory Interface Expansion | FPGA I/O Bridging |
|---|---|
|
Use Scenario: Expanding address/data bus width between microcontroller and parallel NOR flash or SRAM. IC Role / Device Role / Timing Role: Dual-directional bus buffer providing 3-state isolation during read/write arbitration and chip-select transitions. Use Value: Enables clean signal integrity at 100+ MHz with <1.9 ns tpd and 2.5 pF input capacitance, eliminating bus contention in multi-master systems. |
Use Scenario: Interfacing low-voltage FPGA I/O banks (1.2/1.5/1.8 V) to legacy 3.3-V peripheral controllers. IC Role / Device Role / Timing Role: Voltage-tolerant level shifter with independent OE control per channel for dynamic bus direction management. Use Value: Eliminates discrete resistor networks and saves board space using single 2.0 × 1.25 mm VSSOP-8 package with 3.6-V I/O tolerance. |
| Battery-Powered Sensor Hub | Industrial PLC Digital I/O Module |
|
Use Scenario: Aggregating digital sensor outputs (I²C, SPI, GPIO) into a low-power MCU with shared interrupt lines. IC Role / Device Role / Timing Role: Low-quiescent-current (10 µA) bus isolator enabling selective wake-up of sensor clusters without system-wide power cycling. Use Value: Extends coin-cell battery life beyond 5 years in always-on monitoring mode while maintaining sub-2 ns timing margins. |
Use Scenario: Isolating field-side digital inputs/outputs from PLC controller logic under EMI-heavy factory conditions. IC Role / Device Role / Timing Role: Robust 3-state buffer with 2000-V HBM ESD and >100 mA latch-up immunity for noise-immune signal conditioning. Use Value: Prevents false triggering and latch-up failures in 24-V DC industrial environments without requiring external TVS or current-limiting resistors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC2G126DCUR | Higher ICC (10 µA vs. 20 µA typical), slower tpd (2.5 ns @ 1.8 V), 1.65–5.5 V VCC range | Preferred where 5-V tolerance is required but sub-1.9 ns speed is not critical | Select SN74LVC2G126DCUR only if system requires 5-V I/O compatibility and can accept 30% higher propagation delay. |
| 74AUP2G126GM,115 | Lower ICC (0.9 µA), slower tpd (3.4 ns @ 1.2 V), 0.8–3.6 V VCC, smaller XSON-8 (1.35 × 1.35 mm) package | Better suited for ultra-low-power wearables where size and static current dominate timing needs | Choose 74AUP2G126GM,115 when board area is constrained and maximum speed is ≤50 MHz; avoid for >100 MHz data paths. |
Compared with SN74AUC2G126DCUR, SN74LVC2G126DCUR trades speed for wider voltage flexibility, while 74AUP2G126GM,115 sacrifices performance for minimal footprint and nanoamp quiescent draw-neither offers pin-compatible replacement without layout revision due to differing thermal pads and land patterns.
Availability
SN74AUC2G126DCUR is available at Aetrix Electronics and suitable for memory interface expansion, FPGA I/O bridging, and battery-powered sensor hub designs requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for SN74AUC2G126DCUR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with over 50 years of innovation in high-reliability IC design and manufacturing.
The SN74AUC2G126DCUR belongs to TI's AUC Little Logic family, engineered specifically for sub-1-V to 1.8-V portable and battery-constrained applications demanding ultra-low power, high speed, and mixed-voltage interoperability.
FAQ
What is the minimum recommended pull-down resistor value for OE pins on the SN74AUC2G126DCUR?
The SN74AUC2G126DCUR datasheet specifies that OE pins should be tied to GND through a pulldown resistor during power-up to guarantee high-impedance outputs. The minimum resistor value depends on the driver's current-sourcing capability; for standard CMOS drivers, 10 kΩ is commonly used and ensures reliable Hi-Z assertion without excessive current draw. Always verify against your specific upstream driver's VOH/IOL specs when selecting the exact value for SN74AUC2G126DCUR.
Does the SN74AUC2G126DCUR support true bidirectional data flow?
No-the SN74AUC2G126DCUR is a dual noninverting buffer with independent 3-state outputs, not a bidirectional transceiver. Each channel (1A→1Y and 2A→2Y) operates unidirectionally. To implement bidirectional bus control, external logic or separate transmit/receive paths must be used. The SN74AUC2G126DCUR does not contain internal direction control or bus turnaround circuitry; its function is strictly one-way signal buffering with output enable.
Can SN74AUC2G126DCUR operate reliably at 1.2 V VCC?
Yes-SN74AUC2G126DCUR is fully specified from 0.8 V to 2.7 V VCC, with guaranteed performance including tpd ≤ 3.5 ns and ±5 mA drive at 1.2 V. Its AUC logic family is explicitly designed for sub-1.5 V operation, making SN74AUC2G126DCUR suitable for energy-harvesting systems and ultra-low-power MCUs running at scaled voltages.
Is the VSSOP-8 (DCU) package of SN74AUC2G126DCUR compatible with standard SSOP-8 footprints?
No-SN74AUC2G126DCUR uses the VSSOP-8 (DCU) package (2.0 mm × 1.25 mm, 0.5-mm pitch), which is physically smaller and incompatible with standard SSOP-8 (DCT) footprints (3.0 mm × 2.9 mm, 0.65-mm pitch). Attempting to mount SN74AUC2G126DCUR in an SSOP-8 land pattern will result in misalignment and solder joint failure. Always use the DCU-specific footprint per TI's DCU0008A mechanical drawing.
How does Ioff functionality protect the SN74AUC2G126DCUR during partial power-down?
The Ioff circuitry in SN74AUC2G126DCUR disables all outputs when VCC = 0 V, limiting leakage current to ±10 µA even if I/O pins are biased up to 3.6 V. This prevents damaging reverse current flow from powered downstream circuits into the unpowered SN74AUC2G126DCUR die-critical for hot-swap modules, modular backplanes, and systems with staggered power sequencing where SN74AUC2G126DCUR may be unpowered while adjacent logic remains active.
SN74AUC2G126DCUR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74AUC
- Package/Case:
- 8-VFSOP (0.091", 2.30mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 9mA, 9mA
- Voltage - Supply:
- 0.8V ~ 2.7V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-VSSOP
SN74AUC2G126DCUR FAQ
1.How can I place an order for SN74AUC2G126DCUR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74AUC2G126DCUR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74AUC2G126DCUR reliable?
The price and inventory of SN74AUC2G126DCUR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74AUC2G126DCUR is usually 5 days.
3.What payment methods are accepted for SN74AUC2G126DCUR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74AUC2G126DCUR transactions.
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4.How is shipping managed for SN74AUC2G126DCUR?
SN74AUC2G126DCUR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74AUC2G126DCUR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74AUC2G126DCUR?
For technical support, including SN74AUC2G126DCUR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74AUC2G126DCUR requirements.
6.How does Aetrix verify that SN74AUC2G126DCUR is sourced from the original manufacturer or authorized distributors?
All SN74AUC2G126DCUR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74AUC2G126DCUR meets industry standards.
7.What is the process for return or replacement of SN74AUC2G126DCUR?
All SN74AUC2G126DCUR units undergo pre-shipment inspection (PSI). If there is an issue with SN74AUC2G126DCUR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74AUC2G126DCUR part is unused and in its original packaging.
Return procedure for SN74AUC2G126DCUR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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