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Texas Instruments SN74AUC2G241YEPR
- Part No.:
- SN74AUC2G241YEPR
- Manufacturer:
- Texas Instruments
- Package:
- 8-XFBGA, DSBGA
- Datasheet:
-
SN74AUC2G241YEPR.pdf
- Description:
- IC BUFFER NON-INVERT 2.7V 8DSBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
SN74AUC2G241YEPR from Texas Instruments is a dual 1-bit noninverting buffer/driver with independent 3-state outputs, designed for 1.65-V to 1.95-V operation. It delivers ±8-mA output drive at 1.8 V, achieves 1.9 ns max propagation delay (tpd), and consumes only 10 µA ICC at 1.8 V. It supports mixed-mode signal operation up to 3.6-V I/O tolerance and enables partial-power-down via Ioff.
For engineers reviewing the SN74AUC2G241YEPR datasheet, SN74AUC2G241YEPR pinout, SN74AUC2G241YEPR application, or SN74AUC2G241YEPR equivalent, key selection considerations include sub-1-V operability, 3-state bus isolation capability, low-noise 1.8-V logic compatibility, and NanoFree™ WCSP package suitability for ultra-dense portable designs.
Technical Context
This device implements two independent noninverting buffers, each with dedicated output-enable (1OE, 2OE) control. Each channel passes data from A input to Y output when its OE is active low (1OE = L for Channel 1; 2OE = L for Channel 2), and enters high-impedance state when OE is inactive high.
It features Ioff circuitry that disables outputs during power-down to prevent backflow current, and operates across 0.8-V to 2.7-V VCC - though optimized specifically for 1.65–1.95 V. Input thresholds scale with VCC (VIH = 0.65×VCC, VIL = 0.35×VCC), ensuring robust noise margins in low-voltage systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 0.8 V to 2.7 V - supports sub-1-V startup and 1.8-V core logic; rated for 1.65–1.95 V optimal operation. |
| Max tpd | 1.9 ns at 1.8 V, CL = 30 pF - enables high-speed interface timing in memory address and clock distribution paths. |
| Output Drive | ±8 mA at 1.8 V - sufficient to drive multiple 1.8-V CMOS loads without external buffering. |
| Ioff Support | Active at VCC = 0 V - prevents current backflow during partial power-down, critical for hot-swap and power-gated systems. |
| I/O Voltage Tolerance | 3.6-V tolerant inputs/outputs - allows safe interfacing with higher-voltage peripherals in mixed-supply domains. |
| ICC (Quiescent) | 10 µA at 1.8 V - minimizes static power in battery-powered and always-on subsystems. |
| ESD Rating | 2000-V HBM, 200-V MM, 1000-V CDM - exceeds JEDEC standards for robust board-level handling and system reliability. |
Pinout & Package
SN74AUC2G241YEPR is packaged in an 8-ball NanoFree™ DSBGA (YZP) - a die-size package where solder bumps serve as terminals. Dimensions: 1.5 mm × 1.5 mm, 0.5 mm max height, 0.4-mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A | Channel 1 input | Noninverting data input for first buffer; accepts 0.8–3.6 V signals. |
| 2A | Channel 2 input | Noninverting data input for second buffer; electrically isolated from Channel 1. |
| 1Y | Channel 1 output | 3-state noninverting output; high-Z when 1OE = H. |
| 2Y | Channel 2 output | 3-state noninverting output; high-Z when 2OE = H. |
| 1OE | Channel 1 output-enable | Active-low control; pulls 1Y to high-Z when high; requires pullup to VCC for power-up safety. |
| 2OE | Channel 2 output-enable | Active-low control; pulls 2Y to high-Z when high; requires pullup to VCC for power-up safety. |
| VCC | Supply voltage | Core logic supply (0.8–2.7 V); powers internal circuitry and defines logic thresholds. |
| GND | Ground reference | Return path for all currents; must be low-impedance for noise-sensitive 1.8-V operation. |
Key Features
| Feature | Design Value |
|---|---|
| NanoFree™ WCSP packaging | 1.5 mm × 1.5 mm footprint - eliminates package parasitics and saves PCB area in space-constrained wearables and IoT sensors. |
| Sub-1-V operability | Functional down to 0.8 V VCC - enables direct integration with emerging ultra-low-power microcontrollers and energy-harvesting systems. |
| 3.6-V I/O tolerance | Safe interface with 3.3-V or 2.5-V peripherals without level shifters - reduces BOM count and routing complexity. |
| Independent 3-state control | Separate 1OE and 2OE pins - allows dynamic bus arbitration and selective channel isolation in multi-drop configurations. |
| Ioff partial-power-down | Outputs disabled when VCC = 0 V - prevents back-current damage during hot-plug or staggered power sequencing. |
Applications
| Memory Address Buffering | Low-Voltage Clock Distribution |
|---|---|
|
Use Scenario: Driving address lines from a 1.8-V MCU to multiple low-voltage SRAM or flash devices on a shared bus. IC Role / Device Role / Timing Role: Dual noninverting buffer providing fanout and 3-state isolation between controller and memory banks. Use Value: Enables clean address propagation with 1.9 ns tpd and ±8-mA drive while preventing bus contention during memory bank switching. |
Use Scenario: Distributing a 1.8-V system clock to multiple peripherals (e.g., ADC, sensor hub, RF transceiver) with independent enable control. IC Role / Device Role / Timing Role: Low-skew clock driver with per-channel 3-state enable for dynamic clock gating. Use Value: Reduces clock network loading and eliminates glitches during sleep/wake transitions using Ioff and fast enable/disable times (1.1–2.8 ns). |
| USB Peripheral Interface | Wearable Sensor Hub Interconnect |
|
Use Scenario: Level-shifting and buffering USB 2.0 D+/D− control signals between a 1.8-V application processor and 3.3-V USB PHY. IC Role / Device Role / Timing Role: Bidirectional 3-state buffer supporting mixed-voltage signaling without external translators. Use Value: Leverages 3.6-V I/O tolerance and sub-1-V operability to simplify USB companion chip interface while maintaining signal integrity. |
Use Scenario: Aggregating I²C/SPI signals from multiple ultra-low-power sensors (e.g., accelerometer, gyroscope, ambient light) to a 1.8-V host MCU. IC Role / Device Role / Timing Role: Compact dual buffer enabling space-efficient interconnect in coin-cell-powered wearable form factors. Use Value: NanoFree™ 1.5 mm × 1.5 mm DSBGA package minimizes PCB real estate; 10 µA ICC extends battery life in always-on sensing modes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74AUC2G125YEPR | Inverting logic (A → Y̅), same VCC range, drive, and package. | Requires logic inversion in signal path; unsuitable where polarity must be preserved. | Select only if system-level inversion is acceptable or required for timing alignment. |
| SN74LVC2G241DCUR | VCC range 1.65–5.5 V; higher ICC (10 µA vs. 10 µA typical but not guaranteed sub-1-V); larger VSSOP-8 package (2.3 mm × 2.0 mm). | Better suited for 3.3-V legacy interfaces; lacks sub-1-V operation and NanoFree™ size advantage. | Choose when 5-V tolerance or existing VSSOP layout reuse is prioritized over minimal footprint and ultra-low-V operation. |
Compared with SN74AUC2G241YEPR, SN74AUC2G125YEPR provides identical performance in an inverting configuration - useful for phase-aligned enable chains but incompatible where signal polarity matters. SN74LVC2G241DCUR offers broader voltage flexibility and mature package support but sacrifices sub-1-V capability and 60% smaller board area.
Availability
SN74AUC2G241YEPR is available at Aetrix Electronics and suitable for memory address buffering, low-voltage clock distribution, USB peripheral interfacing, and wearable sensor hub interconnect requiring stable component supply, long-term lifecycle assurance, and consistent NanoFree™ WCSP sourcing.
Supply support for SN74AUC2G241YEPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of innovation in low-power and high-integration IC design.
SN74AUC2G241YEPR belongs to TI's AUC Sub-1-V Little Logic family - engineered for ultra-low-voltage operation, minimal footprint, and high-speed performance in portable, battery-powered, and space-constrained electronics.
FAQ
What is the recommended power-up sequence for SN74AUC2G241YEPR?
TI recommends tying both 1OE and 2OE to VCC through pullup resistors (value determined by driver strength) and to GND through pulldown resistors to ensure high-impedance outputs during power-up or power-down. This prevents bus contention before the host controller asserts valid logic levels. The SN74AUC2G241YEPR datasheet specifies this as mandatory for reliable operation.
Does SN74AUC2G241YEPR support true bidirectional data flow?
No - SN74AUC2G241YEPR is a unidirectional noninverting buffer: data flows only from A inputs to Y outputs. It does not implement automatic direction control or bus transceiver functionality. For bidirectional applications, discrete direction-control logic or a dedicated transceiver like SN74LVC245 must be used alongside SN74AUC2G241YEPR.
Can SN74AUC2G241YEPR operate reliably at 1.2 V VCC?
Yes - SN74AUC2G241YEPR is fully specified from 0.8 V to 2.7 V VCC. At 1.2 V, it delivers guaranteed VOL ≤ 0.3 V and VOH ≥ 0.85 V under 3-mA load, with tpd ≤ 3.5 ns (CL = 15 pF). Its sub-1-V architecture ensures functional correctness and timing predictability across this range, unlike standard AHC or LVC families.
What is the thermal resistance (θJA) of the YZP package used in SN74AUC2G241YEPR?
The YZP (DSBGA) package for SN74AUC2G241YEPR has a θJA of 102°C/W, measured per JESD 51-7. This low value results from direct die-to-PCB thermal coupling in the NanoFree™ construction, enabling higher power efficiency and improved thermal margin in compact layouts compared to SSOP or VSSOP alternatives.
Is SN74AUC2G241YEPR pin-compatible with other 8-pin AUC dual buffers?
Yes - SN74AUC2G241YEPR shares identical pinout (1A, 2A, 1Y, 2Y, 1OE, 2OE, VCC, GND) and YZP package dimensions with SN74AUC2G125YEPR and SN74AUC2G34YEPR. All three are functionally distinct (noninverting buffer, inverting buffer, and dual buffer without 3-state, respectively), but mechanical and layout compatibility is maintained across the YZP-based AUC2G series.
SN74AUC2G241YEPR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74AUC
- Package/Case:
- 8-XFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 9mA, 9mA
- Voltage - Supply:
- 0.8V ~ 2.7V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-DSBGA
SN74AUC2G241YEPR FAQ
1.How can I place an order for SN74AUC2G241YEPR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74AUC2G241YEPR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74AUC2G241YEPR reliable?
The price and inventory of SN74AUC2G241YEPR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74AUC2G241YEPR is usually 5 days.
3.What payment methods are accepted for SN74AUC2G241YEPR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74AUC2G241YEPR transactions.
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4.How is shipping managed for SN74AUC2G241YEPR?
SN74AUC2G241YEPR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74AUC2G241YEPR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74AUC2G241YEPR?
For technical support, including SN74AUC2G241YEPR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74AUC2G241YEPR requirements.
6.How does Aetrix verify that SN74AUC2G241YEPR is sourced from the original manufacturer or authorized distributors?
All SN74AUC2G241YEPR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74AUC2G241YEPR meets industry standards.
7.What is the process for return or replacement of SN74AUC2G241YEPR?
All SN74AUC2G241YEPR units undergo pre-shipment inspection (PSI). If there is an issue with SN74AUC2G241YEPR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74AUC2G241YEPR part is unused and in its original packaging.
Return procedure for SN74AUC2G241YEPR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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