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Texas Instruments SN74AUC2G241YZPR
- Part No.:
- SN74AUC2G241YZPR
- Manufacturer:
- Texas Instruments
- Package:
- 8-XFBGA, DSBGA
- Datasheet:
-
SN74AUC2G241YZPR.pdf
- Description:
- IC BUFFER NON-INVERT 2.7V 8DSBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
SN74AUC2G241YZPR from Texas Instruments is a dual 1-bit noninverting buffer/driver with independent 3-state outputs, designed for 1.65–1.95 V operation and 3.6-V I/O tolerance. It delivers ±8-mA output drive at 1.8 V, achieves 1.9 ns max propagation delay (tpd), and consumes only 10 µA ICC at 1.8 V. It supports sub-1-V operation and is used in low-voltage memory address buffering, clock distribution, and bus interface applications.
For engineers reviewing the SN74AUC2G241YZPR datasheet, SN74AUC2G241YZPR pinout, SN74AUC2G241YZPR application, or SN74AUC2G241YZPR equivalent, key selection criteria include its NanoFree™ DSBGA-8 (YZP) package, Ioff partial-power-down support, 3.6-V tolerant I/O, latch-up immunity (>100 mA), and ESD robustness (2000-V HBM).
Technical Context
This device implements two independent noninverting buffers, each with dedicated output-enable (1OE, 2OE) control. Each channel passes A→Y when OE is active low (1OE = L for Channel 1; 2OE = L for Channel 2), and enters high-impedance state when OE is inactive high. The logic is positive-true enable with active-low assertion.
It uses advanced AUC (Advanced Ultra-CMOS) process technology optimized for ultra-low voltage operation (0.8–2.7 V VCC), with full specification across 1.65–1.95 V. Its Ioff circuitry actively disables outputs during power-down to prevent backflow current, enabling safe hot-insertion and mixed-voltage system interfacing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 0.8 V to 2.7 V - supports sub-1-V operation and interoperability with 1.2-V/1.5-V/1.8-V domains. |
| Max tpd @ 1.8 V | 1.9 ns - enables high-speed timing-critical paths in memory and clock trees. |
| Output Drive | ±8 mA @ 1.65 V - sufficient to drive 15-pF loads with fast edge rates in dense PCB layouts. |
| Ioff Support | Yes - prevents damaging current flow when VCC = 0 V, critical for partial-power-down systems. |
| IOH/IOL Accuracy | VOH ≥ VCC – 0.1 V, VOL ≤ 0.2 V @ 1.65 V - ensures clean logic levels under load and temperature variation. |
| ESD Rating | 2000-V HBM, 200-V MM, 1000-V CDM - exceeds JEDEC standards for board-level reliability. |
| Latch-Up Immunity | >100 mA per JESD 78 Class II - guarantees robust operation in noisy industrial environments. |
Pinout & Package
SN74AUC2G241YZPR uses the NanoFree™ DSBGA-8 (YZP) package - a die-size ball grid array with 0.4-mm pitch, 0.23-mm solder bumps, and 1.918 mm × 1.858 mm footprint. Pin 1 is marked by a corner bump with distinct composition (• = Pb-free). The package has no leads; all connections are bottom-side solder balls.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 (Ball A1) | 1A - Input of Channel 1 | Noninverting data input; accepts 0–3.6 V signals regardless of VCC. |
| A2 (Ball B1) | 1OE - Output Enable for Channel 1 | Active-low control; pulls Y1 to high-Z when high; ties to VCC via pullup for power-up safety. |
| A3 (Ball C1) | 2A - Input of Channel 2 | Independent noninverting data input; electrically isolated from Channel 1. |
| A4 (Ball D1) | 2OE - Output Enable for Channel 2 | Active-low control; enables/disables Y2 independently of Y1. |
| B4 (Ball D2) | GND - Ground Reference | Primary return path for all I/O and internal logic; must be low-inductance connection. |
| C4 (Ball D3) | VCC - Supply Voltage | Single supply input (0.8–2.7 V); powers both channels and I/O buffers. |
| C3 (Ball C3) | 1Y - Output of Channel 1 | 3-state noninverting output; driven high/low when 1OE = L; high-Z when 1OE = H. |
| C2 (Ball B3) | 2Y - Output of Channel 2 | 3-state noninverting output; functionally identical to 1Y but controlled by 2OE. |
Key Features
| Feature | Design Value |
|---|---|
| NanoFree™ Packaging | Diesize DSBGA-8 (YZP) eliminates package parasitics, reduces board area by >70% vs. SSOP, and improves thermal resistance (θJA = 102°C/W). |
| 3.6-V I/O Tolerance | Inputs and outputs withstand up to 3.6 V regardless of VCC - enables direct interfacing with 3.3-V peripherals without level shifters. |
| Sub-1-V Operability | Functional down to 0.8 V VCC - supports emerging ultra-low-power microcontroller and sensor interface designs. |
| Low Dynamic Power | 17 pF typical power dissipation capacitance (Cpd) at 10 MHz - minimizes switching noise and supply current spikes. |
| High-Speed Enable Control | ten = 1.7 ns, tdis = 2.3 ns @ 1.8 V/30 pF - ensures precise timing control for burst-mode bus arbitration and clock gating. |
Applications
| Memory Address Buffering | Low-Voltage Clock Distribution |
|---|---|
|
Use Scenario: Driving address lines between a 1.8-V microcontroller and 3.3-V parallel NOR flash memory. IC Role / Device Role / Timing Role: Level-shifting, fanout buffering, and 3-state isolation during memory read/write cycles. Use Value: Eliminates external level shifters; ±8-mA drive ensures signal integrity across 5-cm traces; Ioff prevents backfeed during MCU sleep mode. |
Use Scenario: Distributing a 100-MHz system clock to multiple 1.8-V logic blocks with synchronized enable control. IC Role / Device Role / Timing Role: Low-skew, low-jitter clock fanout buffer with independent gating per branch. Use Value: 1.9 ns tpd and <10 ps inter-channel skew maintain timing margins; 3.6-V I/O tolerates clock source variations. |
| Hot-Swappable I/O Expansion | Ultra-Low-Power Sensor Interface |
|
Use Scenario: Isolating I²C or GPIO lines on a PCIe add-in card that may be inserted while host is powered. IC Role / Device Role / Timing Role: Bidirectional bus isolator with power-fail-safe 3-state behavior. Use Value: Ioff blocks current flow when VCC is unpowered; 2000-V HBM protects against insertion transients; YZP package fits tight connector zones. |
Use Scenario: Interfacing a 0.9-V analog sensor output to a 1.8-V ADC input with minimal power overhead. IC Role / Device Role / Timing Role: Sub-1-V signal conditioning buffer with rail-to-rail input compatibility. Use Value: Operates at 0.8 V VCC; 10 µA ICC avoids loading battery-sensitive nodes; 2.5 pF CI minimizes sensor loading. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74AUC2G125YZPR | Inverting logic (A → Y̅), same VCC range, drive, and package. | Requires logic inversion in signal path; unsuitable where polarity must be preserved. | Select when system-level inversion is acceptable or required for timing alignment. |
| SN74LVC2G241DCUR | VCC = 1.65–5.5 V; higher ICC (10 µA vs. 10 µA typical but wider spec); larger DCU package (2.4 mm × 2.2 mm vs. 1.92 mm × 1.86 mm). | Better for mixed 3.3-V/5-V systems; less suitable for space-constrained ultra-portable designs. | Choose when broader voltage flexibility or legacy VSSOP footprint compatibility is prioritized over size and sub-1-V operation. |
Compared with SN74AUC2G241YZPR, SN74AUC2G125YZPR provides identical performance in an inverting configuration-ideal for polarity-aware timing paths-while SN74LVC2G241DCUR trades NanoFree™ miniaturization and sub-1-V capability for wider voltage range and mature packaging, making it better suited for industrial control over portable electronics.
Availability
SN74AUC2G241YZPR is available at Aetrix Electronics and suitable for high-density memory subsystems, low-power clock trees, and hot-pluggable peripheral interfaces requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant sourcing.
Supply support for SN74AUC2G241YZPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of leadership in logic, power management, and precision analog ICs.
The SN74AUC2G241YZPR belongs to TI's AUC Little Logic family, engineered specifically for ultra-low-voltage, high-speed, space-constrained applications in portable computing, wearables, and battery-powered IoT endpoints.
FAQ
What is the minimum operating voltage for SN74AUC2G241YZPR?
The SN74AUC2G241YZPR is fully specified down to 0.8 V VCC and functional as low as 0.8 V - confirmed in Recommended Operating Conditions and Electrical Characteristics tables. At 0.8 V, it maintains valid VOH/VOL levels and meets tpd limits under CL = 15 pF. This sub-1-V capability enables direct integration with emerging ultra-low-power cores and sensors.
Does SN74AUC2G241YZPR support hot-swap or partial-power-down operation?
Yes, SN74AUC2G241YZPR includes Ioff circuitry that actively disables outputs when VCC = 0 V, preventing damaging current backflow from live I/O lines into the unpowered device. This feature is explicitly tested and guaranteed per JESD 78 Class II latch-up and JESD 22 ESD standards, making it suitable for hot-pluggable modules and multi-rail power sequencing.
What is the pin 1 identifier on the SN74AUC2G241YZPR YZP package?
On the SN74AUC2G241YZPR DSBGA-8 (YZP) package, pin 1 is identified by a corner solder bump with distinct composition: a dot (•) indicates Pb-free finish. This marking is visible under magnification and aligns with the mechanical drawing YZP0008 - not a printed silkscreen, but a physical bump characteristic.
Can SN74AUC2G241YZPR interface directly with 3.3-V devices?
Yes, SN74AUC2G241YZPR features 3.6-V I/O tolerance - meaning its inputs and outputs safely accept and drive up to 3.6 V regardless of VCC (0.8–2.7 V). This allows direct connection to 3.3-V peripherals without external level shifters, verified in Absolute Maximum Ratings and I/O voltage specifications.
What is the thermal resistance (θJA) of SN74AUC2G241YZPR in its YZP package?
The SN74AUC2G241YZPR in the NanoFree™ DSBGA-8 (YZP) package has a junction-to-ambient thermal resistance (θJA) of 102°C/W, per TI's Package Thermal Impedance data. This value is significantly lower than SSOP (220°C/W) or VSSOP (227°C/W) variants, enabling higher sustained drive current in compact layouts without thermal derating.
SN74AUC2G241YZPR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74AUC
- Package/Case:
- 8-XFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 9mA, 9mA
- Voltage - Supply:
- 0.8V ~ 2.7V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-DSBGA
SN74AUC2G241YZPR FAQ
1.How can I place an order for SN74AUC2G241YZPR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74AUC2G241YZPR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74AUC2G241YZPR reliable?
The price and inventory of SN74AUC2G241YZPR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74AUC2G241YZPR is usually 5 days.
3.What payment methods are accepted for SN74AUC2G241YZPR?
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4.How is shipping managed for SN74AUC2G241YZPR?
SN74AUC2G241YZPR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74AUC2G241YZPR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74AUC2G241YZPR?
For technical support, including SN74AUC2G241YZPR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74AUC2G241YZPR requirements.
6.How does Aetrix verify that SN74AUC2G241YZPR is sourced from the original manufacturer or authorized distributors?
All SN74AUC2G241YZPR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74AUC2G241YZPR meets industry standards.
7.What is the process for return or replacement of SN74AUC2G241YZPR?
All SN74AUC2G241YZPR units undergo pre-shipment inspection (PSI). If there is an issue with SN74AUC2G241YZPR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74AUC2G241YZPR part is unused and in its original packaging.
Return procedure for SN74AUC2G241YZPR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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