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Texas Instruments SN74AUC2G34YEPR

Part No.:
SN74AUC2G34YEPR
Manufacturer:
Texas Instruments
Category:
Buffers, Drivers, Receivers, Transceivers
Package:
6-XFBGA, DSBGA
Datasheet:
AetrixSN74AUC2G34YEPR.pdf
Description:
IC BUFFER NON-INVERT 2.7V 6DSBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,774

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Product details

Overview

SN74AUC2G34YEPR from Texas Instruments is a dual non-inverting buffer gate IC designed for ultra-low-voltage, high-speed logic interfacing in space-constrained applications. It operates from 0.8 V to 2.7 V (optimized for 1.65–1.95 V), delivers ±8 mA output drive at 1.8 V, achieves 1.6 ns max propagation delay at 1.8 V, and features Ioff support for partial-power-down mode - enabling use in battery-powered mobile I/O expansion and level-shifting between mixed-voltage domains.

For engineers reviewing the SN74AUC2G34YEPR datasheet, SN74AUC2G34YEPR pinout, SN74AUC2G34YEPR application, or SN74AUC2G34YEPR equivalent, key selection considerations include its sub-1-V operability, 3.6-V I/O tolerance, NanoFree™ DSBGA package footprint, latch-up immunity (>100 mA), and ESD robustness (2000-V HBM).

Technical Context

This device implements two independent positive-logic buffers (Y = A) with rail-to-rail CMOS output swing and no internal feedback or enable control. Its architecture supports simultaneous operation across dual channels without crosstalk, and the Ioff circuitry actively disables outputs during power-down to prevent backflow current when VCC = 0 V.

The SN74AUC2G34YEPR uses advanced low-threshold CMOS process technology to achieve sub-1-V functionality while maintaining full 3.6-V I/O tolerance - enabling safe interfacing between 1.8-V core logic and legacy 3.3-V peripherals without external level shifters.

Key Specifications

Parameter Value and Actual Design Meaning
VCC Range 0.8 V to 2.7 V - enables operation in ultra-low-power systems including single-cell Li-ion and energy-harvesting nodes.
Max tpd @ 1.8 V 1.6 ns - supports >500-MHz signal integrity in high-speed data paths such as memory interface buffers and clock distribution.
Output Drive ±8 mA @ 1.8 V - sufficient to drive 50-Ω transmission lines or fan-out to ≥10 LVTTL loads without external buffering.
Ioff Current ±10 µA @ 2.7 V - ensures safe isolation during hot-insertion or partial power-down in modular systems with mixed supply domains.
ESD Rating 2000-V HBM - meets industrial-grade robustness requirements for handheld and portable electronics assembly environments.
Latch-Up Immunity >100 mA per JESD 78 Class II - guarantees fault resilience under transient overvoltage or ground-bounce conditions.
Input Capacitance 2 pF - minimizes capacitive loading on upstream drivers, preserving edge rate and reducing dynamic power in high-frequency switching.

Pinout & Package

SN74AUC2G34YEPR is packaged in a 6-ball NanoFree™ DSBGA (YZP) - a die-size ball grid array with 0.5-mm pitch, 1.4 mm × 1.4 mm body, and Pb-free SnAgCu solder bumps. The package eliminates leadframe and mold compound, minimizing parasitic inductance and thermal resistance (θJA = 123°C/W).

Pin/Terminal Circuit Role Design Meaning
1Y Output of Buffer 1 CMOS-compatible rail-to-rail output; sinks or sources up to ±8 mA at 1.8 V; supports 3.6-V tolerant I/O.
VCC Power Supply Single supply input for both buffers; must be decoupled locally; supports 0.8–2.7 V operation range.
2Y Output of Buffer 2 Independent output identical to 1Y; no internal coupling - allows asynchronous channel operation.
2A Input of Buffer 2 CMOS input with hysteresis-free threshold; VIH = 0.65×VCC, VIL = 0.35×VCC; accepts 0–3.6 V signals.
GND Ground Reference Common return path for VCC and all I/O; requires low-inductance connection to minimize ground bounce.
1A Input of Buffer 1 CMOS input electrically identical to 2A; unused inputs must be tied to VCC or GND to prevent floating states.

Key Features

Feature Design Value
NanoFree™ DSBGA packaging Dies-as-packages reduce board area by >50% vs. SOT-23; eliminate bond wires and leadframe parasitics for improved signal integrity.
Ioff partial-power-down support Enables live insertion into powered-backplane systems; prevents reverse current flow when VCC = 0 V and I/O pins are driven externally.
3.6-V I/O tolerance Allows direct connection to 3.3-V or 2.5-V buses without level translators - simplifies voltage-domain bridging in mixed-supply SoC interfaces.
Sub-1-V operability Functional down to 0.8 V VCC - supports emerging ultra-low-power microcontrollers and energy-harvesting sensor nodes.
Low ICC quiescent current 10 µA typical at 1.8 V - extends battery life in always-on monitoring circuits and wearable devices.

Applications

Mobile I/O Expansion Low-Power Sensor Interface

Use Scenario: Adding GPIOs to an ARM Cortex-M0+ MCU operating at 1.8 V while interfacing with 3.3-V analog sensors and digital switches.

IC Role / Device Role / Timing Role: Dual buffer isolates MCU I/O from higher-voltage peripherals and provides clean, fast signal translation without timing skew.

Use Value: Eliminates need for discrete level shifters; 1.6 ns tpd preserves timing margins in 20-MHz SPI or I²C bus extension.

Use Scenario: Signal conditioning and buffering for MEMS accelerometers and temperature sensors in a coin-cell–powered IoT node.

IC Role / Device Role / Timing Role: Buffers weak sensor output signals before ADC sampling; maintains logic levels during deep-sleep wake-up transitions.

Use Value: 10 µA ICC and Ioff support <1 µA system standby current; sub-1-V operation aligns with buck-boost regulator output ripple.

Wearable Display Driver Support USB-C Sideband Use Detection

Use Scenario: Driving segment-select lines in a monochrome OLED display module powered from a 1.8-V LDO in a smartwatch.

IC Role / Device Role / Timing Role: Provides current gain and noise immunity for display control signals; dual-channel layout matches common display pinout patterns.

Use Value: ±8 mA drive capability directly drives display segments; NanoFree™ YZP footprint fits tight bezel constraints (<1.5 mm² PCB area).

Use Scenario: Detecting CC1/CC2 pin states in USB-C receptacles to determine plug orientation and source/sink role.

IC Role / Device Role / Timing Role: Buffers analog comparator outputs before microcontroller GPIO sampling; rejects noise from hot-plug transients.

Use Value: 2000-V HBM ESD rating withstands repeated connector insertion; 3.6-V I/O tolerance handles ±20-V USB-C fault conditions safely.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual buffer gate applications.

Alternative Part Technical Difference Application Difference Selection Advice
SN74AUC2G34DBVR SOT-23-6 package (1.45 mm height); 165°C/W θJA; same electrical specs and pinout. Preferred where manual assembly, rework, or thermal margin >123°C/W is required; larger footprint but higher reliability in high-temp environments. Select DBVR for prototyping, thermal-critical industrial controls, or when DSBGA reflow capability is unavailable.
SN74AUC2G34DCKR SC-70-6 package (1.1 mm height); 259°C/W θJA; identical logic function and DC specs; slightly longer tpd (1.8 ns @ 1.8 V, CL=30 pF). Better suited for cost-sensitive consumer wearables where DSBGA handling infrastructure is not available; moderate thermal performance. Choose DCKR when balancing cost, assembly yield, and moderate speed requirements - avoids NanoFree™ process complexity.

Compared with SN74AUC2G34DBVR and SN74AUC2G34DCKR, the SN74AUC2G34YEPR offers the smallest PCB footprint and lowest thermal resistance, making it optimal for miniaturized, thermally dense designs - though it requires advanced DSBGA placement and reflow processes.

Availability

SN74AUC2G34YEPR is available at Aetrix Electronics and suitable for mobile I/O expansion, low-power sensor interface, wearable display driver support, and USB-C sideband use detection requiring stable component supply across production lifecycles.

Supply support for SN74AUC2G34YEPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in high-reliability, low-power IC design.

The SN74AUC2G34YEPR belongs to TI's AUC logic family - engineered for ultra-low-voltage operation and high-speed performance in portable, battery-powered, and space-constrained electronic systems.

FAQ

What is the minimum supply voltage at which SN74AUC2G34YEPR remains fully functional?

The SN74AUC2G34YEPR is fully specified down to 0.8 V VCC, with guaranteed operation across the entire recommended range of 0.8 V to 2.7 V. At 0.8 V, it maintains valid logic thresholds (VIH = 0 V, VIL = 0 V), 10 µA ICC, and functional output drive - making SN74AUC2G34YEPR suitable for energy-harvesting and ultra-low-power brownout scenarios.

Does SN74AUC2G34YEPR support hot-swapping or partial-power-down modes?

Yes, SN74AUC2G34YEPR includes Ioff circuitry that disables outputs when VCC = 0 V, limiting Ioff to ±10 µA at 2.7 V. This prevents damaging backflow current when SN74AUC2G34YEPR is inserted into a live backplane or when only part of a system is powered - a critical feature for modular instrumentation and field-upgradeable hardware.

Can SN74AUC2G34YEPR safely interface between 1.8-V and 3.3-V logic domains?

Yes, SN74AUC2G34YEPR has 3.6-V I/O tolerance, meaning its inputs and outputs can withstand up to 3.6 V regardless of VCC level. When powered at 1.8 V, SN74AUC2G34YEPR accepts 3.3-V inputs and drives 3.3-V loads without damage or level-shifter components - enabling direct interconnection in mixed-voltage systems like FPGA I/O banks or PMIC-controlled subsystems.

What is the significance of the NanoFree™ package used in SN74AUC2G34YEPR?

The NanoFree™ DSBGA (YZP) package in SN74AUC2G34YEPR replaces traditional leadframes and molding with the silicon die itself as the package - resulting in a 1.4 mm × 1.4 mm footprint, 0.5-mm ball pitch, and 123°C/W thermal resistance. This reduces parasitic inductance, improves high-frequency signal fidelity, and saves >50% PCB area versus SOT-23 - essential for SN74AUC2G34YEPR deployment in wearables and compact modules.

How does the propagation delay of SN74AUC2G34YEPR vary with supply voltage and load capacitance?

SN74AUC2G34YEPR achieves 1.6 ns max tpd at 1.8 V with CL = 15 pF. Delay increases to 2.4 ns at 1.8 V with CL = 30 pF, and degrades to 6.4 ns at 0.8 V (CL = 15 pF). These values are measured per JEDEC standards and reflect real-world trade-offs between voltage scaling and timing closure - critical for SN74AUC2G34YEPR use in adaptive voltage scaling architectures.

SN74AUC2G34YEPR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74AUC
Package/Case:
6-XFBGA, DSBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Logic Type:
Buffer, Non-Inverting
Number of Elements:
2
Number of Bits per Element:
1
Input Type:
-
Output Type:
Push-Pull
Current - Output High, Low:
9mA, 9mA
Voltage - Supply:
0.8V ~ 2.7V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
6-DSBGA

SN74AUC2G34YEPR FAQ

1.How can I place an order for SN74AUC2G34YEPR through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74AUC2G34YEPR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SN74AUC2G34YEPR reliable?

The price and inventory of SN74AUC2G34YEPR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74AUC2G34YEPR is usually 5 days.

3.What payment methods are accepted for SN74AUC2G34YEPR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74AUC2G34YEPR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SN74AUC2G34YEPR?

SN74AUC2G34YEPR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SN74AUC2G34YEPR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74AUC2G34YEPR?

For technical support, including SN74AUC2G34YEPR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74AUC2G34YEPR requirements.

6.How does Aetrix verify that SN74AUC2G34YEPR is sourced from the original manufacturer or authorized distributors?

All SN74AUC2G34YEPR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74AUC2G34YEPR meets industry standards.

7.What is the process for return or replacement of SN74AUC2G34YEPR?

All SN74AUC2G34YEPR units undergo pre-shipment inspection (PSI). If there is an issue with SN74AUC2G34YEPR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74AUC2G34YEPR part is unused and in its original packaging.

Return procedure for SN74AUC2G34YEPR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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