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Texas Instruments SN74AUC2G34YZPR
- Part No.:
- SN74AUC2G34YZPR
- Manufacturer:
- Texas Instruments
- Package:
- 6-XFBGA, DSBGA
- Datasheet:
-
SN74AUC2G34YZPR.pdf
- Description:
- IC BUFFER NON-INVERT 2.7V 6DSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,378
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Product details
Overview
SN74AUC2G34YZPR from Texas Instruments is a dual non-inverting buffer gate IC designed for ultra-low-voltage, high-speed logic translation in space-constrained applications. It operates from 0.8 V to 2.7 V (optimized for 1.65–1.95 V), delivers ±8-mA output drive at 1.8 V, achieves 1.6 ns max propagation delay at 1.8 V, and features Ioff support for partial-power-down mode. It is used in mobile SoC I/O bridging, low-power sensor interface buffering, and battery-powered FPGA configuration paths.
For engineers reviewing the SN74AUC2G34YZPR datasheet, SN74AUC2G34YZPR pinout, SN74AUC2G34YZPR application, or SN74AUC2G34YZPR equivalent, key selection criteria include sub-1.8-V operation capability, NanoFree™ DSBGA package footprint (1.02 × 1.52 mm), Ioff-enabled power sequencing, ±8-mA drive strength at 1.8 V, and 1.6 ns tpd performance under 15-pF load.
Technical Context
This device implements two independent positive-logic buffers (Y = A) with rail-to-rail input thresholds and CMOS-compatible outputs. Its architecture supports mixed-mode signal operation across voltage domains up to 3.6 V I/O tolerance, enabling level-shifting between 1.2-V, 1.5-V, and 1.8-V logic rails without external biasing.
The integrated Ioff circuitry actively disables outputs during power-down, blocking current backflow when VCC = 0 V-critical for hot-plug and multi-rail system integrity. Absolute maximum ratings include –0.5 V to 4.1 V on inputs/outputs and ±20 mA continuous output current, ensuring robustness in transient-prone environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 0.8 V to 2.7 V - supports single-supply operation across ultra-low-voltage nodes including 0.9-V, 1.2-V, and 1.8-V domains. |
| tpd (max) | 1.6 ns at 1.8 V, CL = 15 pF - enables timing-critical signal buffering in high-frequency digital interfaces (e.g., SPI clock lines). |
| Ioff Support | Active at VCC = 0 V - prevents back-driving and latch-up during partial power-down, essential for PCIe/USB hot-swap and battery-backed subsystems. |
| Output Drive | ±8 mA at 1.8 V - sufficient to drive 50-Ω transmission lines or fan-out to ≥10 LVTTL loads without external termination. |
| IOFF Current | ±10 µA at VI/VO = 2.7 V - ensures negligible leakage during power gating, preserving standby current budgets in portable devices. |
| ESD Rating | 2000-V HBM, 200-V MM, 1000-V CDM - meets industrial-grade ESD immunity requirements without external protection diodes. |
| Package | DSBGA (YZP), 1.02 mm × 1.52 mm, 0.4-mm pitch, 6-ball array - smallest footprint among TI's dual buffer offerings, optimized for <1.5-mm² PCB area. |
Pinout & Package
SN74AUC2G34YZPR uses a 6-ball NanoFree™ DSBGA (YZP) package with bottom-side solder bumps. Pin 1 is identified by a solder-bump composition marker (• = Pb-free). The package height is ≤0.5 mm, compatible with thin-profile mobile assemblies.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Ball A1 | 1A (Input of Buffer 1) | Primary logic input for first buffer; accepts 0.8–2.7 V signals with hysteresis-free CMOS threshold. |
| Ball A2 | VCC (Supply) | Single supply rail for both buffers; must be decoupled locally due to high-speed switching current demands. |
| Ball B1 | 1Y (Output of Buffer 1) | Inverting-buffered replica of 1A; drives capacitive loads up to 15 pF within 1.6 ns tpd at 1.8 V. |
| Ball B2 | 2A (Input of Buffer 2) | Independent second input; electrically isolated from 1A/1Y-supports dual-channel signal conditioning. |
| Ball C1 | GND (Ground) | Reference return path for all I/O and supply currents; requires low-inductance connection to minimize ground bounce. |
| Ball C2 | 2Y (Output of Buffer 2) | Second buffered output; identical timing and drive specs to 1Y-enables matched dual-path routing. |
Key Features
| Feature | Design Value |
|---|---|
| NanoFree™ DSBGA packaging | Dies-as-package construction eliminates leadframe and mold compound, reducing size to 1.02 × 1.52 mm and thermal resistance to 123°C/W. |
| Sub-1-V operability | Functional down to 0.8 V VCC - enables direct integration with emerging sub-1-V processor I/O and ultra-low-power microcontrollers. |
| 3.6-V I/O tolerance | Inputs and outputs withstand up to 4.1 V - allows safe interfacing with legacy 3.3-V peripherals without level shifters. |
| Latch-up immunity | Exceeds 100 mA per JESD 78 Class II - guarantees robust operation in noisy industrial or automotive power environments. |
| Low ICC quiescent current | 10 µA at 1.8 V - minimizes static power draw in always-on sensor hubs and real-time clock domains. |
Applications
| Mobile SoC I/O Expansion | FPGA Configuration Interface |
|---|---|
|
Use Scenario: Expanding limited GPIO count on application processors for touch controller, PMIC, or display timing signals. IC Role / Device Role / Timing Role: Dual buffer isolates and strengthens weak SoC output drivers while maintaining nanosecond-level timing alignment. Use Value: Enables reliable 10-MHz+ I²C/SPI signal extension over 30-mm PCB traces without added capacitance or skew. |
Use Scenario: Driving FPGA configuration pins (e.g., INIT_B, PROGRAM_B) from low-voltage microcontrollers during cold boot. IC Role / Device Role / Timing Role: Provides noise-immune, rail-to-rail buffering with Ioff to prevent backfeed during FPGA power ramp. Use Value: Eliminates need for discrete pull-up resistors and external power sequencing logic, reducing BOM count by 3 components. |
| Wearable Sensor Hub Interface | Battery-Powered IoT Node |
|
Use Scenario: Level-shifting analog sensor ADC outputs (1.2 V) to 1.8-V MCU inputs while suppressing EMI coupling. IC Role / Device Role / Timing Role: Acts as low-noise, low-capacitance signal conditioner with 2-pF input capacitance and 1.6-ns tpd. Use Value: Maintains signal integrity for 12-bit ADC sampling at 1 MHz without timing jitter or cross-talk degradation. |
Use Scenario: Isolating BLE radio reset line and wake-up interrupt from ultra-low-power MCU in deep-sleep mode. IC Role / Device Role / Timing Role: Dual buffer provides glitch-free reset assertion and fast wake-up propagation with Ioff disabled-state isolation. Use Value: Reduces system standby current by 15 µA versus standard buffers, extending coin-cell battery life by >12 months. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual buffer gate applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74AUC2G34DCKR | SC-70-6 package (2.0 × 1.25 mm); 259°C/W θJA; same electrical specs and pinout. | Higher thermal resistance and larger footprint - suitable for prototyping or non-space-constrained designs. | Select when board reworkability or hand-soldering is prioritized over miniaturization. |
| SN74LVC2G34YZPR | Same YZP package but LVC family: 1.65–5.5 V VCC range; 32-mA drive at 3.3 V; 3.8 ns tpd at 3.3 V. | Higher voltage operation and drive, but slower speed and higher ICC - fits mixed 3.3-V/1.8-V systems needing stronger drive. | Choose when interfacing with 3.3-V peripherals is required and 1.6 ns tpd is not critical. |
Compared with SN74AUC2G34DCKR, SN74AUC2G34YZPR saves >70% board area and improves thermal performance; compared with SN74LVC2G34YZPR, it delivers 2.3× faster propagation and 50% lower ICC at 1.8 V, making it optimal for battery-sensitive, high-speed edge nodes.
Availability
SN74AUC2G34YZPR is available at Aetrix Electronics and suitable for mobile SoC expansion, wearable sensor hub design, and battery-powered IoT node development requiring stable component supply, long-term lifecycle assurance, and consistent NanoFree™ package availability.
Supply support for SN74AUC2G34YZPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with over 50 years of innovation in high-reliability, low-power IC design.
The SN74AUC2G34YZPR belongs to TI's AUC ultra-high-speed logic family, engineered specifically for sub-1.8-V, nanosecond-timing applications in portable and space-constrained electronics.
FAQ
What is the minimum operating voltage for SN74AUC2G34YZPR?
The SN74AUC2G34YZPR operates down to 0.8 V VCC, with guaranteed functionality across the full 0.8–2.7 V range. At 0.8 V, it maintains valid logic thresholds and output drive, enabling direct use with emerging sub-1-V microcontrollers and energy-harvesting systems where SN74AUC2G34YZPR serves as a critical interface enabler.
Does SN74AUC2G34YZPR support hot-plug or partial-power-down operation?
Yes, SN74AUC2G34YZPR features Ioff circuitry that disables outputs when VCC = 0 V, preventing damaging current backflow from live I/O lines into a powered-down domain. This makes SN74AUC2G34YZPR ideal for USB-C accessory detection, PCIe hot-plug controllers, and modular battery systems where SN74AUC2G34YZPR ensures safe power sequencing.
What is the thermal resistance (θJA) of the YZP package used in SN74AUC2G34YZPR?
The DSBGA (YZP) package of SN74AUC2G34YZPR has a thermal resistance of 123°C/W, measured per JESD 51-7. This value reflects its superior heat dissipation versus SC-70 (259°C/W) and SOT-23 (165°C/W) variants, allowing SN74AUC2G34YZPR to sustain higher switching frequencies in thermally dense mobile PCB layouts without derating.
Can SN74AUC2G34YZPR interface between 1.2-V and 3.3-V logic domains?
Yes, SN74AUC2G34YZPR supports 3.6-V I/O tolerance, meaning its inputs accept voltages up to 4.1 V and outputs drive up to VCC + 0.5 V. When powered at 1.2 V, SN74AUC2G34YZPR safely receives 3.3-V signals without damage and outputs rail-to-rail 1.2-V logic-making SN74AUC2G34YZPR a robust, single-chip solution for bidirectional level translation.
Is SN74AUC2G34YZPR RoHS compliant and lead-free?
Yes, SN74AUC2G34YZPR is RoHS-compliant and uses SnAgCu (SAC) ball metallurgy per the YZP package specification. Its marking "U9N" and MSL Level-1 rating confirm full compliance with JEDEC J-STD-020, supporting lead-free reflow profiles up to 260°C peak temperature-ensuring SN74AUC2G34YZPR meets global environmental and manufacturing standards.
SN74AUC2G34YZPR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74AUC
- Package/Case:
- 6-XFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- Push-Pull
- Current - Output High, Low:
- 9mA, 9mA
- Voltage - Supply:
- 0.8V ~ 2.7V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-DSBGA
SN74AUC2G34YZPR FAQ
1.How can I place an order for SN74AUC2G34YZPR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74AUC2G34YZPR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74AUC2G34YZPR reliable?
The price and inventory of SN74AUC2G34YZPR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74AUC2G34YZPR is usually 5 days.
3.What payment methods are accepted for SN74AUC2G34YZPR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74AUC2G34YZPR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SN74AUC2G34YZPR?
SN74AUC2G34YZPR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74AUC2G34YZPR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74AUC2G34YZPR?
For technical support, including SN74AUC2G34YZPR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74AUC2G34YZPR requirements.
6.How does Aetrix verify that SN74AUC2G34YZPR is sourced from the original manufacturer or authorized distributors?
All SN74AUC2G34YZPR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74AUC2G34YZPR meets industry standards.
7.What is the process for return or replacement of SN74AUC2G34YZPR?
All SN74AUC2G34YZPR units undergo pre-shipment inspection (PSI). If there is an issue with SN74AUC2G34YZPR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74AUC2G34YZPR part is unused and in its original packaging.
Return procedure for SN74AUC2G34YZPR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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