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Texas Instruments SN74AUC2G80YZPR

Part No.:
SN74AUC2G80YZPR
Manufacturer:
Texas Instruments
Category:
Flip Flops
Package:
8-XFBGA, DSBGA
Datasheet:
AetrixSN74AUC2G80YZPR.pdf
Description:
IC FF D-TYPE DUAL 1BIT 8DSBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,957

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Product details

Overview

SN74AUC2G80YZPR from Texas Instruments is a dual positive-edge-triggered D-type flip-flop in a 0.23-mm NanoFree™ WCSP (YZP) package, operating from 0.8 V to 2.7 V with 1.9 ns max propagation delay at 1.8 V, ±8-mA output drive, and Ioff support for partial-power-down mode - used in low-voltage clock-domain synchronization and data latching in portable memory interfaces.

For engineers reviewing the SN74AUC2G80YZPR datasheet, SN74AUC2G80YZPR pinout, SN74AUC2G80YZPR application, or SN74AUC2G80YZPR equivalent, key selection criteria include sub-1.8-V operation capability, ultra-low ICC (≤10 µA), 8-pin WCSP footprint compatibility, and guaranteed hold-time compliance down to 0 V at 1.8 V.

Technical Context

This device implements two independent D-type flip-flops, each triggered on the rising edge of its dedicated clock input (1CLK, 2CLK), with asynchronous data sampling and no internal reset/set. Each channel supports independent input-to-output timing governed by setup (tsu = 0.6 ns min at 1.8 V) and hold (th = 0.1 ns min at 1.8 V) constraints.

It features rail-to-rail CMOS-compatible I/O with 3.6-V tolerance on inputs and outputs, latch-up immunity >100 mA per JESD 78 Class II, and ESD protection exceeding 2000-V HBM - all enabled by TI's NanoFree™ die-as-package construction that eliminates wirebonds and leadframe parasitics.

Key Specifications

Parameter Value and Actual Design Meaning
VCC Range 0.8 V to 2.7 V - enables direct interface with 1.2-V, 1.5-V, and 1.8-V logic domains without level shifters.
tpd (max) 1.9 ns at 1.8 V, CL = 15 pF - supports >250-MHz clock rates in high-speed data capture paths.
Ioff Support Active at VCC = 0 V - prevents back-drive current during partial power-down, critical for hot-swap and multi-rail SoC designs.
Output Drive ±8 mA at 1.8 V - sufficient to drive 50-Ω transmission lines or fan-out to ≥4 AUC-series loads.
ICC (max) 10 µA - reduces quiescent power in always-on subsystems such as real-time clocks or sensor hubs.
Input Voltage Tolerance –0.5 V to 3.6 V - allows mixed-voltage interfacing (e.g., 1.8-V device driving 3.3-V FPGA I/O).
ESD Rating 2000-V HBM, 200-V MM, 1000-V CDM - meets industrial-grade robustness requirements without external protection.

Pinout & Package

NanoFree™ WCSP (YZP) package: 8-bump, 0.23-mm pitch, 1.2 mm × 1.2 mm body, bottom-side solder bumps, Pb-free, moisture sensitivity level 1.

Pin/Terminal Circuit Role Design Meaning
1 1CLK Positive-edge clock input for first flip-flop - triggers Q1 update only on rising transition; insensitive to slew rate.
2 1D Data input for first flip-flop - sampled at 1CLK↑ if tsu/th timing met; high-impedance when unused.
3 GND Dedicated ground reference for both channels - must be connected to system GND plane for noise immunity.
4 2CLK Positive-edge clock input for second flip-flop - electrically isolated from 1CLK; supports independent timing domains.
5 2D Data input for second flip-flop - no crosstalk with 1D path; supports dual-channel pipelining.
6 VCC Single supply rail for both flip-flops - bypassing with 100-nF ceramic capacitor near pin required for stable operation.
7 1Q True output of first flip-flop - complements 1D state after 1CLK↑; drives full CMOS load at VCC.
8 2Q True output of second flip-flop - independently buffered; no shared output stage with 1Q.

Key Features

Feature Design Value
NanoFree™ WCSP packaging Die-size footprint (1.2 mm × 1.2 mm) eliminates leadframe inductance, enabling <2 ns tpd and superior high-frequency signal integrity.
Ioff partial-power-down Outputs enter high-Z state when VCC = 0 V - prevents current leakage between powered/unpowered sections in battery-backed systems.
Sub-1-V operability Functional at 0.8 V VCC - supports emerging ultra-low-power microcontrollers and energy-harvesting applications.
3.6-V I/O tolerance Inputs/outputs withstand 3.6 V regardless of VCC - eliminates external clamping diodes in mixed-voltage board designs.
Latch-up immunity Exceeds 100 mA per I/O (JESD 78 Class II) - ensures reliability in noisy industrial environments with transient coupling.

Applications

Mobile Memory Interface Low-Power Sensor Hub

Use Scenario: Latching address/data strobes between 1.2-V AP and 1.8-V LPDDR2 memory controller in smartphone SoC interposer.

IC Role / Device Role / Timing Role: Dual-channel DFF synchronizes control signals across voltage domains while meeting tight setup/hold windows.

Use Value: 1.9 ns tpd and 0.6 ns tsu at 1.8 V enable reliable capture at 500 Mbps DDR rates without added timing margin.

Use Scenario: Edge-triggered sampling of interrupt signals from multiple ultra-low-power sensors (accelerometer, temp, humidity) into a 0.9-V MCU.

IC Role / Device Role / Timing Role: Acts as synchronous input conditioner - debounces and aligns asynchronous sensor asserts to MCU clock domain.

Use Value: 10 µA ICC and 0.8 V minimum VCC extend battery life in coin-cell-powered wearable devices beyond 12 months.

Industrial PLC I/O Module Automotive Camera Link Buffer

Use Scenario: Isolating and retiming digital I/O status bits from 24-V field-side optocouplers into 1.8-V FPGA fabric.

IC Role / Device Role / Timing Role: Provides voltage translation and metastability hardening for safety-critical status monitoring.

Use Value: 3.6-V tolerant inputs accept optocoupler output swings directly; Ioff prevents backfeed during FPGA reconfiguration.

Use Scenario: Synchronizing pixel clock and data valid signals from MIPI CSI-2 camera sensor to image processor in ADAS domain controller.

IC Role / Device Role / Timing Role: Dual-edge-aligned latch ensures deterministic phase alignment between parallel data lanes.

Use Value: Matched tpd across both channels (<0.2 ns skew) maintains inter-lane timing integrity at 1.5 Gbps aggregate throughput.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual D-type flip-flop applications.

Alternative Part Technical Difference Application Difference Selection Advice
SN74AUP2G80DCUR Higher VCC min (0.8 V same), but lower drive (±4 mA at 1.8 V) and slower tpd (2.5 ns); uses VSSOP-8 instead of WCSP. Better suited for space-tolerant PCBs where thermal dissipation >102°C/W is acceptable; not for ultra-dense mobile layouts. Select when board assembly lacks WCSP reflow capability or when higher noise margin at 1.8 V is prioritized over speed.
74LVC2G74DCUR Wider VCC range (1.65–5.5 V), but no sub-1-V operation; 3.5 ns tpd at 3.3 V; lacks Ioff and NanoFree packaging. Applicable in legacy 3.3-V industrial systems requiring drop-in replacement, but incompatible with 0.8–1.2-V domains. Choose only for brownfield designs already using LVC family; avoid for new ultra-low-power or miniaturized applications.

Compared with SN74AUC2G80YZPR, SN74AUP2G80DCUR trades speed and package size for wider supply noise immunity, while 74LVC2G74DCUR sacrifices low-voltage operation and power efficiency for broader voltage compatibility - making SN74AUC2G80YZPR uniquely optimal for next-gen compact, battery-constrained systems.

Availability

SN74AUC2G80YZPR is available at Aetrix Electronics and suitable for mobile memory interface, low-power sensor hub, industrial PLC I/O module, and automotive camera link buffer applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for SN74AUC2G80YZPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader focused on analog, embedded processing, and connectivity technologies, with over 90 years of innovation in high-reliability silicon design.

SN74AUC2G80YZPR belongs to TI's AUC logic family - engineered specifically for ultra-low-voltage, high-speed portable electronics where nanosecond timing, sub-1-V operation, and minimal footprint are mandatory.

FAQ

What is the minimum operating voltage for SN74AUC2G80YZPR?

The SN74AUC2G80YZPR operates down to 0.8 V VCC, with full functionality including specified tpd, tsu, and Ioff behavior verified across the entire 0.8 V to 2.7 V range. At 0.8 V, it delivers 1.9 ns tpd and meets setup/hold timing with appropriate loading - making SN74AUC2G80YZPR suitable for energy-harvesting and coin-cell-powered systems where supply rails dip below 1.0 V.

Does SN74AUC2G80YZPR support partial power-down mode?

Yes, SN74AUC2G80YZPR includes Ioff circuitry that disables outputs and blocks current flow when VCC = 0 V, preventing back-driving between powered and unpowered sections. This feature is fully characterized per JESD 78 and validated across –40°C to 85°C - essential for SN74AUC2G80YZPR use in hot-pluggable modules or multi-rail SoC subsystems requiring independent power gating.

What is the pin 1 identifier for SN74AUC2G80YZPR in the YZP package?

In the YZP (NanoFree™ WCSP) package, pin 1 is identified by a solder-bump composition marker: a solid dot (•) indicates Pb-free bump material, while "1" denotes SnPb. This marking appears adjacent to the corner bump on the bottom side - visible only post-assembly via X-ray or cross-section. The physical layout follows standard WCSP orientation with pin 1 at top-left in bottom-view diagrams.

Can SN74AUC2G80YZPR interface directly with 3.3-V logic inputs?

Yes, SN74AUC2G80YZPR inputs tolerate up to 3.6 V regardless of VCC level, allowing direct connection to 3.3-V drivers without level shifters or resistive dividers. This is confirmed by absolute maximum ratings and functional testing - meaning SN74AUC2G80YZPR reliably accepts 3.3-V logic-high signals even when operating at 1.2 V or 0.8 V, simplifying mixed-voltage board architecture.

Is SN74AUC2G80YZPR RoHS compliant and what is its MSL rating?

SN74AUC2G80YZPR is RoHS compliant (Pb-free bumps, NiPdAu finish) and rated MSL Level 1 (unlimited floor life at ≤30°C/60% RH), per JEDEC J-STD-020. Its NanoFree™ construction eliminates moisture-absorbing mold compound, eliminating bake requirements - a key advantage over leadframe-based packages like DCT or DCU variants of the same device.

SN74AUC2G80YZPR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74AUC
Package/Case:
8-XFBGA, DSBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Function:
Standard
Type:
D-Type
Output Type:
Inverted
Number of Elements:
2
Number of Bits per Element:
1
Clock Frequency:
275 MHz
Max Propagation Delay @ V, Max CL:
1.8ns @ 2.5V, 30pF
Trigger Type:
Positive Edge
Current - Output High, Low:
9mA, 9mA
Voltage - Supply:
0.8V ~ 2.7V
Current - Quiescent (Iq):
10 µA
Input Capacitance:
2.5 pF
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-DSBGA

SN74AUC2G80YZPR FAQ

1.How can I place an order for SN74AUC2G80YZPR through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74AUC2G80YZPR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SN74AUC2G80YZPR reliable?

The price and inventory of SN74AUC2G80YZPR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74AUC2G80YZPR is usually 5 days.

3.What payment methods are accepted for SN74AUC2G80YZPR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74AUC2G80YZPR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SN74AUC2G80YZPR?

SN74AUC2G80YZPR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SN74AUC2G80YZPR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74AUC2G80YZPR?

For technical support, including SN74AUC2G80YZPR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74AUC2G80YZPR requirements.

6.How does Aetrix verify that SN74AUC2G80YZPR is sourced from the original manufacturer or authorized distributors?

All SN74AUC2G80YZPR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74AUC2G80YZPR meets industry standards.

7.What is the process for return or replacement of SN74AUC2G80YZPR?

All SN74AUC2G80YZPR units undergo pre-shipment inspection (PSI). If there is an issue with SN74AUC2G80YZPR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74AUC2G80YZPR part is unused and in its original packaging.

Return procedure for SN74AUC2G80YZPR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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