Texas Instruments SN74AUC34RGYR

Overview

SN74AUC34RGYR from Texas Instruments is a hex non-inverting buffer gate IC designed for ultra-low-voltage, high-speed logic interfacing in 1.65-V to 1.95-V systems. It delivers 1.8 ns max propagation delay at 1.8 V, ±8-mA output drive, 10-µA max ICC, and Ioff support for partial-power-down operation. It is used in voltage-level translation between 1.8-V logic domains and mixed-mode signal interfaces in portable and battery-powered digital systems.

For engineers reviewing the SN74AUC34RGYR datasheet, SN74AUC34RGYR pinout, SN74AUC34RGYR application, or SN74AUC34RGYR equivalent, key selection criteria include sub-2-ns timing at 1.8 V, 3.6-V I/O tolerance, Ioff-enabled bus isolation, and VQFN-14 thermal-pad package compatibility with high-density PCB layouts.

Technical Context

This device implements six independent non-inverting buffer functions (Y = A) in a single monolithic CMOS IC. Each channel operates across 0.8-V to 2.7-V VCC but is optimized for 1.65-V to 1.95-V supply rails, enabling compatibility with advanced low-power microcontrollers and FPGAs.

The Ioff circuitry actively disables outputs during power-down, blocking current backflow when VCC = 0 V while inputs/outputs remain biased up to 3.6 V. Input transition rate is specified at 10–20 ns/V, supporting clean edge integrity in fast-switching environments without external termination.

Key Specifications

Pinout & Package

VQFN-14 (RGY) package: 3.5 mm × 3.5 mm body, 0.5-mm pitch, 1-mm max height, exposed thermal pad (must be soldered to PCB ground plane for thermal and mechanical reliability).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar hex buffer applications.

Compared with SN74LVC34APW and SN74AUP1G34DBVR, the SN74AUC34RGYR uniquely combines hex integration, 1.8-ns timing, Ioff, and 3.6-V I/O tolerance - making it optimal for compact, mixed-voltage, power-sequenced digital subsystems where timing, safety, and density are jointly constrained.

Availability

SN74AUC34RGYR is available at Aetrix Electronics and suitable for mobile baseband interfaces, FPGA I/O expansion, USB Type-C port controllers, and industrial sensor hub interfaces requiring stable component supply, consistent tape-and-reel packaging (3000 pcs/reel), and long-term industrial temperature support (–40°C to 85°C).

Supply support for SN74AUC34RGYR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions with over 50 years of innovation in high-reliability, low-power IC design.

The SN74AUC34RGYR belongs to TI's AUC ultra-high-speed CMOS logic family, engineered specifically for sub-2-ns performance in 1.8-V systems while maintaining backward compatibility with legacy voltage domains.

FAQ

What is the minimum operating voltage for the SN74AUC34RGYR?

The SN74AUC34RGYR operates down to 0.8 V VCC, enabling use in ultra-low-power wake-on-event circuits and energy-harvesting applications. However, its timing and drive specifications are guaranteed only from 1.65 V to 1.95 V - the intended operational window for optimal 1.8-ns propagation delay and ±8-mA output capability. Below 1.65 V, functionality remains but parameters degrade predictably per the datasheet curves.

Does the SN74AUC34RGYR support hot-swap or partial-power-down operation?

Yes, the SN74AUC34RGYR integrates Ioff circuitry that disables outputs when VCC = 0 V, preventing damaging current backflow from live I/O pins into the unpowered device. This feature is explicitly validated per JESD 78 Class II latch-up testing and supports safe hot-plug insertion in modular systems - a key differentiator versus standard LVC-family buffers like SN74LVC34APW which lack Ioff.

What is the recommended PCB layout for the thermal pad on the SN74AUC34RGYR VQFN package?

The SN74AUC34RGYR's exposed thermal pad (Pin 7 GND) must be soldered to a solid PCB ground plane using an 80% solder paste coverage stencil aperture. TI recommends a 3.3 mm × 3.3 mm thermal pad with eight 0.5-mm-diameter thermal vias (filled or capped) connecting directly to inner-layer ground planes. This ensures both mechanical anchoring and thermal dissipation - critical for maintaining <1.8 ns tpd stability under continuous 8-mA output loading.

Can the SN74AUC34RGYR safely interface a 1.8-V microcontroller with a 3.3-V peripheral?

Yes, the SN74AUC34RGYR supports 3.6-V I/O tolerance on all inputs and outputs regardless of VCC (1.8 V). This allows direct connection of its outputs to 3.3-V CMOS inputs without level-shifting components, while its inputs accept 3.3-V signals safely - provided VCC remains within 0.8–2.7 V. The device maintains full logic functionality and timing specs under this mixed-mode condition, as verified in TI's SCES474 test data.

How many independent buffer channels does the SN74AUC34RGYR provide?

The SN74AUC34RGYR provides six independent non-inverting buffer channels (A1→Y1 through A6→Y6), each with identical electrical characteristics and timing behavior. All six channels share a common VCC and GND, enabling synchronous signal distribution across multiple data or control lines - ideal for parallel bus buffering, GPIO expansion, or clock fanout in space-constrained designs.