Texas Instruments SN74AUCH16244DGGR
- Part No.:
- SN74AUCH16244DGGR
- Manufacturer:
- Texas Instruments
- Package:
- 48-TFSOP (0.240", 6.10mm Width)
- Datasheet:
-
SN74AUCH16244DGGR.pdf
- Description:
- IC BUF NON-INVERT 2.7V 48TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:1,950
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Product details
Overview
SN74AUCH16244DGGR from Texas Instruments is a 16-bit noninverting 3-state buffer/driver optimized for 1.8-V operation, featuring ±8-mA output drive at 1.8 V, 1.8-ns max propagation delay (tpd), bus-hold inputs eliminating external resistors, and Ioff partial-power-down support. It serves as a high-density memory address or clock driver in low-voltage embedded bus interfaces.
For engineers reviewing the SN74AUCH16244DGGR datasheet, SN74AUCH16244DGGR pinout, SN74AUCH16244DGGR application, or SN74AUCH16244DGGR equivalent, key selection criteria include 1.65–1.95-V VCC operating range, 3.6-V I/O tolerance for mixed-mode signaling, sub-1-V operability, latch-up immunity >100 mA per JESD 78 Class II, and TSSOP-48 package thermal resistance of 70°C/W.
Technical Context
This device implements four independent 4-bit buffer sections, each with symmetrical active-low output-enable (OE) control and true (noninverting) logic. Its bus-hold circuitry actively maintains undriven inputs at valid logic levels without external pullup/pulldown resistors.
The Ioff feature disables outputs during partial power-down to prevent backflow current, while 3.6-V I/O tolerance enables interoperability with higher-voltage logic domains. Absolute maximum ratings allow VI/VO up to 3.6 V independent of VCC, supporting robust level-shifting in heterogeneous systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Operating Range | 0.8 V to 2.7 V; specifically designed for stable 1.65–1.95 V operation in modern low-power systems |
| Max Propagation Delay (tpd) | 1.8 ns at 1.8 V; enables high-speed address/data buffering in DDR memory subsystems and clock distribution |
| Output Drive Strength | ±8 mA at 1.8 V; sufficient to drive four LVTTL loads or two 50-Ω transmission lines |
| Ioff Support | Enables safe partial-power-down mode; prevents damaging current backflow when VCC = 0 V |
| Bus-Hold Input Circuitry | Eliminates need for external pullup/pulldown resistors on unused inputs, reducing BOM count and board space |
| I/O Voltage Tolerance | 3.6 V tolerant inputs/outputs; allows direct interfacing with 3.3-V or 2.5-V logic without level shifters |
| ICC Supply Current | 20 µA max; ultra-low static power ideal for battery-backed or always-on subsystems |
Pinout & Package
TSSOP-48 (DGG) package, 12.4 mm × 6.2 mm × 1.2 mm max height, JEDEC MO-153 compliant, lead-free NIPDAU finish, MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1OE, 2OE, 3OE, 4OE | Active-low output-enable control | Each controls one 4-bit buffer section; tie to VCC via pullup for power-up high-impedance safety |
| 1A1–1A4, 2A1–2A4, 3A1–3A4, 4A1–4A4 | Data inputs | 16 total inputs with integrated bus-hold; no external biasing required for floating nodes |
| 1Y1–1Y4, 2Y1–2Y4, 3Y1–3Y4, 4Y1–4Y4 | True (noninverting) 3-state outputs | 16 buffered outputs; high-impedance state activated when corresponding OE = high |
| VCC (Pins 7, 14, 21, 28, 35, 42) | Power supply | Six distributed VCC pins minimize IR drop and improve noise immunity across wide bus |
| GND (Pins 4, 11, 18, 25, 32, 39) | Ground reference | Six GND pins provide low-inductance return paths for all 16 drivers |
Key Features
| Feature | Design Value |
|---|---|
| 1.8-V optimized performance | Guaranteed 1.8-ns tpd and ±8-mA drive at 1.8 V - meets timing closure for 500+ MHz bus clocks |
| 3.6-V I/O tolerance | Enables seamless connection to legacy 3.3-V peripherals without external level translators |
| Integrated bus-hold | Reduces system-level component count by eliminating 16 external pullup resistors in typical memory interface designs |
| Ioff partial-power-down | Allows hot-plug or dynamic power gating of subsystems while maintaining signal integrity on shared buses |
| Latch-up immunity >100 mA | Meets JESD 78 Class II - ensures robustness against transient overvoltage events in industrial environments |
Applications
| Memory Address Buffering | Clock Distribution |
|---|---|
Use Scenario: Driving 16-bit address lines from a low-voltage microcontroller to multiple SRAM or Flash devices sharing a common bus. IC Role / Device Role / Timing Role: Noninverting 3-state buffer providing level translation, fanout expansion, and bus contention control. Use Value: Eliminates need for discrete level shifters and reduces PCB routing complexity with integrated bus-hold on all inputs. | Use Scenario: Distributing a single 1.8-V clock source to four synchronous peripherals requiring matched skew and low jitter. IC Role / Device Role / Timing Role: Low-skew, low-propagation-delay clock driver with independent enable control per quadrant. Use Value: 1.8-ns tpd and symmetrical rise/fall times ensure <100-ps inter-channel skew across all 16 outputs. |
| Low-Voltage Bus Transceiver Interface | Partial-Power-Down System Control |
Use Scenario: Interfacing a 1.8-V FPGA I/O bank to a 3.3-V peripheral bus using only passive components. IC Role / Device Role / Timing Role: Bidirectional voltage-tolerant buffer enabling safe communication across mixed-supply domains. Use Value: 3.6-V I/O tolerance allows direct connection without series resistors or active translators - simplifies layout and improves signal integrity. | Use Scenario: Isolating powered-down memory modules from an active 1.8-V data bus in a modular embedded system. IC Role / Device Role / Timing Role: Ioff-enabled 3-state buffer preventing backfeed current into unpowered subsystems. Use Value: Compliant with JESD78 Class II latch-up immunity ensures system-level reliability during dynamic power sequencing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit buffer/driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC16244ADGGR | Higher VCC min (1.65 V), lower drive (±24 mA @ 3.3 V), no bus-hold, no sub-1-V operation | Requires external pullups; not suitable for 0.8–1.1-V operation or partial-power-down use cases | Select when cost sensitivity outweighs bus-hold convenience and ultra-low-voltage support is unnecessary |
| SN74AVC16244DGGR | Wider VCC range (1.2–3.6 V), higher speed (1.3 ns tpd @ 1.8 V), same bus-hold and Ioff features | Offers tighter timing margin and broader supply flexibility but at higher unit cost | Select when design requires guaranteed 1.3-ns tpd or operation down to 1.2 V with identical feature set |
Compared with SN74LVC16244ADGGR, SN74AUCH16244DGGR delivers true sub-1-V operation and eliminates external biasing; versus SN74AVC16244DGGR, it trades 0.5-ns speed for lower cost while retaining identical bus-hold, Ioff, and 3.6-V tolerance - making it optimal for cost-constrained 1.8-V-only systems.
Availability
SN74AUCH16244DGGR is available at Aetrix Electronics and suitable for memory subsystems, clock distribution networks, low-voltage FPGA I/O interfaces, and partial-power-down embedded controllers requiring stable component supply and long-term manufacturability.
Supply support for SN74AUCH16244DGGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in logic interface solutions.
The SN74AUCH16244DGGR belongs to TI's Widebus™ family - engineered specifically to increase density and performance of 3-state memory address drivers, clock drivers, and bus-oriented receivers/transmitters in advanced low-voltage systems.
FAQ
What is the minimum operating voltage for the SN74AUCH16244DGGR?
The SN74AUCH16244DGGR operates down to 0.8 V, with guaranteed specifications across 1.65–1.95 V. This sub-1-V capability supports next-generation ultra-low-power SoC interfaces where traditional 1.2-V logic fails. The SN74AUCH16244DGGR maintains full functionality including bus-hold and Ioff even at 0.8 V, unlike many competing buffers that specify only nominal 1.8-V operation.
Does the SN74AUCH16244DGGR require external pullup resistors on its inputs?
No - the SN74AUCH16244DGGR integrates bus-hold circuitry on all 16 data inputs, actively maintaining undriven or floating inputs at valid logic states. Using external pullup or pulldown resistors with the SN74AUCH16244DGGR is explicitly discouraged in the datasheet, as it may interfere with bus-hold operation and increase power consumption unnecessarily.
Can the SN74AUCH16244DGGR safely interface with 3.3-V logic signals?
Yes - the SN74AUCH16244DGGR features 3.6-V tolerant inputs and outputs, allowing direct connection to 3.3-V or 2.5-V logic without level-shifting components. This I/O tolerance is specified independently of VCC, meaning the SN74AUCH16244DGGR can accept 3.3-V inputs while powered from 1.8 V, simplifying mixed-voltage system design.
How does the Ioff feature function in the SN74AUCH16244DGGR?
The Ioff circuitry in the SN74AUCH16244DGGR disables all outputs when VCC = 0 V, preventing damaging current backflow from live I/O traces into the unpowered device. This enables safe partial-power-down operation in modular systems - for example, powering down a memory module while keeping the SN74AUCH16244DGGR's host-side bus active. The SN74AUCH16244DGGR meets JESD 78 Class II latch-up immunity under these conditions.
What is the thermal resistance (θJA) of the SN74AUCH16244DGGR in its TSSOP-48 package?
According to TI's official thermal data, the SN74AUCH16244DGGR in the DGG (TSSOP-48) package has a junction-to-ambient thermal resistance (θJA) of 70°C/W under standard JEDEC test conditions. This value assumes a 2-layer board with 1-in² copper pour; actual θJA in customer layouts will vary based on PCB copper area, layer count, and airflow - but the SN74AUCH16244DGGR's low 20-µA ICC minimizes self-heating in most applications.
SN74AUCH16244DGGR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74AUCH
- Package/Case:
- 48-TFSOP (0.240", 6.10mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 4
- Number of Bits per Element:
- 4
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 9mA, 9mA
- Voltage - Supply:
- 0.8V ~ 2.7V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSSOP
SN74AUCH16244DGGR FAQ
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6.How does Aetrix verify that SN74AUCH16244DGGR is sourced from the original manufacturer or authorized distributors?
All SN74AUCH16244DGGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74AUCH16244DGGR meets industry standards.
7.What is the process for return or replacement of SN74AUCH16244DGGR?
All SN74AUCH16244DGGR units undergo pre-shipment inspection (PSI). If there is an issue with SN74AUCH16244DGGR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74AUCH16244DGGR part is unused and in its original packaging.
Return procedure for SN74AUCH16244DGGR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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