Texas Instruments SN74AUCH244RGYR
- Part No.:
- SN74AUCH244RGYR
- Manufacturer:
- Texas Instruments
- Package:
- 20-VFQFN Exposed Pad
- Datasheet:
-
SN74AUCH244RGYR.pdf
- Description:
- IC BUFFER NON-INVERT 2.7V 20VQFN
- Quantity:
- Payment:

- Shipping:

Inventory:5,687
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Product details
Overview
SN74AUCH244RGYR from Texas Instruments is an octal noninverting buffer/driver IC designed for low-voltage, high-speed bus interface applications. It features two independent 4-bit sections with separate output-enable (OE) controls, operates from 0.8 V to 2.7 V (optimized at 1.8 V), delivers ±8-mA drive strength, achieves 1.9-ns max propagation delay at 1.8 V, and includes bus-hold circuitry to eliminate external pull resistors - used in portable memory interfaces and low-power FPGA I/O bridging.
For engineers reviewing the SN74AUCH244RGYR datasheet, SN74AUCH244RGYR pinout, SN74AUCH244RGYR application, or SN74AUCH244RGYR equivalent, key selection criteria include its 1.8-V optimized timing performance, Ioff-enabled partial-power-down capability, 3.6-V I/O tolerance for mixed-mode signal interfacing, and VQFN-20 (RGY) package compatibility with space-constrained PCB layouts.
Technical Context
This device implements dual 4-bit noninverting buffers with active-low OE control per section, enabling independent enable/disable of each 4-bit group. Its bus-hold inputs maintain valid logic states without external biasing, and the Ioff circuitry actively disables outputs during power-down to prevent back-current flow.
The SN74AUCH244RGYR uses a CMOS process optimized for sub-1.8-V operation, supports 3.6-V tolerant I/Os across the full VCC range (0.8–2.7 V), and meets JESD 78 Class II latch-up immunity (>100 mA) and JESD 22 ESD ratings (2000-V HBM, 200-V MM, 1000-V CDM).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 0.8 V to 2.7 V - enables direct integration with 1.8-V core logic and mixed-voltage systems |
| Max tpd @ 1.8 V | 1.9 ns - ensures sub-2-ns signal propagation for high-speed data buffering in memory and FPGA interfaces |
| Output Drive | ±8 mA @ 1.8 V - provides sufficient current to drive 50-Ω transmission lines or multiple CMOS loads |
| Ioff Support | Yes - prevents damaging backflow current when VCC = 0 V, critical for hot-swap and partial-power-down systems |
| I/O Tolerance | 3.6 V - allows safe interfacing with 3.3-V peripherals while powered from 1.8-V supply |
| Bus-Hold | Integrated on all A inputs - eliminates need for external pullup/pulldown resistors, reducing BOM count and board area |
| ICC Max | 20 µA - ultra-low quiescent current supports battery-powered and always-on system modules |
Pinout & Package
VQFN-20 (RGY) package: 3.5 mm × 4.5 mm, 0.5-mm pitch, 1-mm max height, exposed thermal pad (Pin 21) requiring PCB solder connection for thermal and mechanical integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4, 17, 18, 19, 20 | A1–A4, 2A1–2A4 Inputs | Data inputs for each 4-bit buffer section; internally connected to bus-hold circuitry |
| 5, 6, 7, 8, 12, 13, 14, 15 | Y1–Y4, 2Y1–2Y4 Outputs | Noninverting buffered outputs; high-impedance when corresponding OE is high |
| 9, 16 | 1OE, 2OE | Active-low output-enable controls - tie to VCC via pullup for power-up high-Z safety |
| 10 | VCC | Supply voltage input (0.8–2.7 V); decoupling capacitor required near pin |
| 11 | GND | Ground reference; must be low-impedance connection to PCB ground plane |
| 21 | Thermal Pad | Exposed copper pad - must be soldered to solid PCB thermal plane for reliability and thermal dissipation |
Key Features
| Feature | Design Value |
|---|---|
| Sub-1-V operability | Functional down to 0.8 V VCC - supports emerging ultra-low-power microcontroller and sensor node designs |
| 3.6-V I/O tolerance | Input/output pins withstand up to 3.6 V regardless of VCC - enables robust level-shifting without external translators |
| Partial-power-down support | Ioff limits off-state leakage to ±10 µA - essential for PCIe add-in cards and modular embedded systems with dynamic rail sequencing |
| Bus-hold circuitry | Self-biasing on all A inputs - maintains stable logic state during signal float, eliminating 8–16 external resistors per device |
| ESD robustness | 2000-V HBM, 200-V MM, 1000-V CDM - exceeds industrial requirements and reduces system-level ESD protection overhead |
Applications
| Memory Interface Buffering | FPGA I/O Expansion |
|---|---|
Use Scenario: Isolating and driving address/data buses between low-voltage SoC and 3.3-V parallel NOR flash or SRAM. IC Role / Device Role / Timing Role: Noninverting buffer with 1.9-ns tpd and 3.6-V I/O tolerance acts as voltage-level translator and fanout extender. Use Value: Eliminates discrete level shifters and reduces propagation delay versus legacy 74-series buffers by >40% at 1.8 V. | Use Scenario: Extending I/O count from a compact FPGA to external sensors, displays, or communication peripherals in handheld medical devices. IC Role / Device Role / Timing Role: Octal buffer provides controlled drive strength and bus-hold stability for unconnected FPGA pins during configuration. Use Value: Reduces external passive count by eight pull resistors per SN74AUCH244RGYR, saving >2 mm² PCB area per device. |
| Hot-Swappable Module Interface | Battery-Powered Data Acquisition |
Use Scenario: Enabling safe insertion/removal of mezzanine cards in industrial PLC backplanes with staggered power sequencing. IC Role / Device Role / Timing Role: Ioff-enabled buffer isolates powered-down modules from live backplane signals, preventing backfeed damage. Use Value: Guarantees <±10 µA off-state current, meeting IEC 61000-4-2 system-level hot-swap compliance without auxiliary circuitry. | Use Scenario: Interfacing ultra-low-power MCU GPIOs to external ADCs and serial EEPROMs in wireless sensor nodes. IC Role / Device Role / Timing Role: Low ICC (20 µA max) buffer maintains signal integrity while contributing negligible standby current to total system budget. Use Value: Enables >10-year battery life in coin-cell-powered nodes by avoiding 100+ µA leakage typical of non-Ioff buffers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar octal buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC244APWR | Wider VCC range (1.65–3.6 V); no bus-hold; higher ICC (max 10 µA vs. 20 µA) | Lacks Ioff and bus-hold - requires external pull resistors and cannot safely isolate unpowered rails | Select only if operating strictly at ≥1.65 V and external biasing is acceptable |
| SN74AUC244RGYR | Same RGY package and pinout; identical bus-hold and Ioff; differs only in top-side marking (MT244 vs. MT244A) | No functional difference - documented as functionally equivalent in TI's cross-reference matrix | Valid drop-in replacement with identical electrical and thermal behavior |
Compared with SN74AUCH244RGYR, SN74LVC244APWR lacks critical low-voltage features (sub-1-V operation, Ioff, bus-hold), while SN74AUC244RGYR is a functionally identical variant confirmed by TI as pin-and-function compatible - making it the only true drop-in alternative.
Availability
SN74AUCH244RGYR is available at Aetrix Electronics and suitable for portable computing interfaces, industrial PLC I/O expansion, and battery-powered sensor node designs requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for SN74AUCH244RGYR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with over 90 years of innovation in industrial, automotive, and consumer electronics.
The SN74AUCH244RGYR belongs to TI's AUCH logic family - engineered specifically for ultra-low-voltage, high-speed digital interfacing in space- and power-constrained applications such as mobile SoCs and IoT edge nodes.
FAQ
What is the minimum operating voltage for SN74AUCH244RGYR?
The SN74AUCH244RGYR operates down to 0.8 V VCC, with guaranteed functionality across the full 0.8–2.7 V range. At 0.8 V, it maintains valid logic thresholds and specified output drive (±0.7 mA), enabling use in emerging sub-1-V microcontroller domains where traditional logic families fail. This capability is explicitly validated in the recommended operating conditions table of the SCES433 datasheet.
Does SN74AUCH244RGYR support hot-swap or partial-power-down operation?
Yes, SN74AUCH244RGYR supports partial-power-down via its Ioff circuitry, which limits off-state current to ±10 µA when VCC = 0 V and any I/O is biased. This prevents damaging back-current flow in modular systems like PCIe cards or field-replaceable units. The feature is tested per JESD 78 Class II and documented in the absolute maximum ratings and electrical characteristics sections of the datasheet.
How does the bus-hold function work on SN74AUCH244RGYR inputs?
The bus-hold circuitry on SN74AUCH244RGYR inputs actively maintains the last-valid logic state when inputs float, using internal feedback transistors with sustaining currents (IBHL/IBHH) ranging from ±10 µA to ±275 µA depending on VCC. It eliminates need for external pull resistors - but using external bias with bus-hold is discouraged as it may cause contention or increased power draw, per the functional description in the datasheet.
What is the thermal pad (Pin 21) requirement for SN74AUCH244RGYR?
The exposed thermal pad (Pin 21) of SN74AUCH244RGYR must be soldered to a dedicated PCB copper pour connected to GND for mechanical stability and thermal dissipation. TI's SLUA271 application note specifies minimum solder coverage (78% of pad area) and recommends via-in-pad design with filled/plugged vias. Failure to connect this pad risks thermal overstress and solder joint reliability failure under continuous 8-mA output loading.
Is SN74AUCH244RGYR pin-compatible with other 20-pin VQFN octal buffers?
SN74AUCH244RGYR has a unique pinout defined in the RGY package drawing (SCES433, page 1), with OE controls on Pins 9 and 16, VCC on Pin 10, and GND on Pin 11. It is not pin-compatible with SN74LVC244APWR (TSSOP-20) or SN74AUC244RGYR (same RGY pinout but different marking). Always verify against the official TI RGY mechanical drawing - no generic "20-pin VQFN" assumption is valid.
SN74AUCH244RGYR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74AUCH
- Package/Case:
- 20-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 4
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 9mA, 9mA
- Voltage - Supply:
- 0.8V ~ 2.7V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-VQFN (3.5x4.5)
SN74AUCH244RGYR FAQ
1.How can I place an order for SN74AUCH244RGYR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74AUCH244RGYR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74AUCH244RGYR reliable?
The price and inventory of SN74AUCH244RGYR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74AUCH244RGYR is usually 5 days.
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Once your SN74AUCH244RGYR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74AUCH244RGYR?
For technical support, including SN74AUCH244RGYR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74AUCH244RGYR requirements.
6.How does Aetrix verify that SN74AUCH244RGYR is sourced from the original manufacturer or authorized distributors?
All SN74AUCH244RGYR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74AUCH244RGYR meets industry standards.
7.What is the process for return or replacement of SN74AUCH244RGYR?
All SN74AUCH244RGYR units undergo pre-shipment inspection (PSI). If there is an issue with SN74AUCH244RGYR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74AUCH244RGYR part is unused and in its original packaging.
Return procedure for SN74AUCH244RGYR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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