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Home > Products > Integrated Circuits (ICs) > Logic > Buffers, Drivers, Receivers, Transceivers

Texas Instruments SN74AUCH32244ZKER

Name: SN74AUCH32244ZKER
Brand: Texas Instruments
SKU: SN74AUCH32244ZKER
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: SN74AUCH32244ZKER

Manufacturer:: Texas Instruments

Category:: Buffers, Drivers, Receivers, Transceivers

Package:: 96-LFBGA

Datasheet:: SN74AUCH32244ZKER.pdf

Description:: IC BUFFER NON-INVERT 2.7V 96PBGA

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Product details

Overview

SN74AUCH32244ZKER from Texas Instruments is a 32-bit noninverting buffer/driver with 3-state outputs, designed for 1.65-V to 1.95-V V_CC operation and 3.6-V I/O tolerant signaling. It delivers ±8-mA output drive at 1.8 V, sub-2-ns propagation delay (1.8 ns max), and bus-hold inputs eliminating external resistors - deployed in high-density memory address and clock distribution systems.

For engineers reviewing the SN74AUCH32244ZKER datasheet, SN74AUCH32244ZKER pinout, SN74AUCH32244ZKER application, or SN74AUCH32244ZKER equivalent, key selection criteria include I_off-enabled partial-power-down support, 1.8-V optimized timing, 32-bit bus isolation capability, and LFBGA-96 (GKE) package compatibility with space-constrained DDR/DDR2 memory subsystems.

Technical Context

This device implements eight independent 4-bit buffers, each with symmetrical active-low output-enable (OE) control and true (noninverting) logic polarity. All 32 outputs enter high-impedance state when any OE is high, enabling flexible partitioning as one 32-bit, two 16-bit, four 8-bit, or eight 4-bit drivers.

Its bus-hold circuitry actively maintains valid logic levels on undriven inputs without external components, while I_off protection blocks reverse current flow during partial power-down - critical for mixed-voltage SoC interconnects where V_CC domains power up/down asynchronously.

Key Specifications

Parameter	Value and Actual Design Meaning
V_CC Range	0.8 V to 2.7 V; fully specified for 1.65–1.95 V operation - enables direct interface with 1.8-V core logic and 3.3-V I/O rails via 3.6-V-tolerant inputs/outputs.
t_pd Max	1.8 ns at 1.8 V - supports >500-MHz data rates in memory address/clock fanout paths with deterministic timing margins.
I_OH/I_OL	±8 mA at 1.8 V - drives standard 50-Ω transmission lines or multiple CMOS loads without signal degradation.
I_CC Max	40 µA - ultra-low static power enables use in always-on system management and low-duty-cycle buffering applications.
Bus-Hold Current	IBHL = 20 µA at 1.65 V; IBHH = –20 µA - sustains stable logic states on floating inputs without pullup/pulldown resistors, reducing BOM count and board area.
I_off	±10 µA at 2.7 V - prevents backflow current when V_CC = 0 V, allowing safe hot-insertion and domain-isolated power sequencing.
ESD Rating	HBM = 2000 V; MM = 200 V; CDM = 1000 V - meets industrial-grade robustness requirements for automated assembly and field-replaceable modules.

Pinout & Package

LFBGA-96 (GKE) package, 6.0 mm × 6.0 mm, 0.5-mm pitch, 96-terminal grid array with exposed thermal pad. Pin assignments follow JEDEC MO-245 standard layout; top-side marking "MK244".

Pin/Terminal	Circuit Role	Design Meaning
1Y1–1Y4, 2Y1–2Y4, ..., 8Y1–8Y4 (64 pins)	True buffered output	32 total outputs grouped in eight 4-bit banks; each Yx driven by corresponding Ax input when OE is low.
1A1–1A4, 2A1–2A4, ..., 8A1–8A4 (64 pins)	Noninverting data input	32 total inputs; bus-hold enabled by default - no external termination required for unused inputs.
1OE–8OE (8 pins)	Active-low output enable	Independent control per 4-bit bank; tie to V_CC via pullup resistor to ensure Hi-Z at power-up.
V_CC (12 pins)	Supply voltage	Distributed across package for low-impedance power delivery; decoupling required near each V_CC pair.
GND (20 pins)	Ground reference	Multiple GND connections minimize ground bounce and improve noise immunity in high-speed switching.

Key Features

Feature	Design Value
3.6-V I/O Tolerance	Allows interfacing with higher-voltage peripherals (e.g., 3.3-V FPGAs or ASICs) while operating from 1.8-V supply - eliminates level shifters in mixed-signal memory subsystems.
Sub-1-V Operability	Functional down to 0.8-V V_CC - supports future ultra-low-voltage memory controllers and adaptive voltage scaling schemes.
Low t_pd / High Speed	1.8-ns max propagation delay at 1.8 V enables reliable operation in DDR2/DDR3 address/command buses with tight setup/hold windows.
I_off Protection	Blocks current flow when V_CC = 0 V - essential for hot-plug memory modules and multi-rail power sequencing in servers and telecom line cards.
Integrated Bus-Hold	Eliminates need for 32 external pullup/pulldown resistors - reduces PCB layer count, improves signal integrity, and cuts assembly cost in high-pin-count designs.

Applications

Memory Address Buffering	Clock Distribution
Use Scenario: Driving row/column addresses from a memory controller to multiple DDR SDRAM chips in a dense server DIMM module. IC Role / Device Role / Timing Role: 32-bit noninverting buffer with per-bank OE control isolates address bus segments and synchronizes timing across parallel DRAM ranks. Use Value: 1.8-ns t_pd ensures setup margin compliance at 400+ MHz clock rates; 3.6-V I/O tolerance accommodates 3.3-V legacy controllers without level shifters.	Use Scenario: Fanout of system clock or strobe signals to multiple memory devices or FPGA clock inputs in an embedded baseband processor. IC Role / Device Role / Timing Role: Low-skew, high-drive buffer replicating clock edges with matched propagation delay across all 32 outputs. Use Value: ±8-mA drive strength sustains signal integrity over 50-Ω traces; bus-hold prevents metastability during clock gating or sleep mode transitions.
Hot-Swappable Module Interface	Mixed-Voltage SoC Interconnect
Use Scenario: Enabling/disabling data paths between hot-pluggable storage modules and host controller in enterprise NAS enclosures. IC Role / Device Role / Timing Role: 3-state isolation gate controlled by module presence detection logic, powered independently from main system rail. Use Value: I_off protection prevents backfeed into unpowered modules; 3.6-V I/O tolerance handles 3.3-V module-side signaling safely.	Use Scenario: Bridging 1.8-V CPU core logic to 2.5-V or 3.3-V peripheral interfaces in automotive ADAS SoCs with strict power-domain isolation. IC Role / Device Role / Timing Role: Voltage-level agnostic buffer providing bidirectional signal integrity across power domain boundaries with minimal latency. Use Value: Sub-2-ns delay preserves timing closure; 0.8–2.7-V V_CC range supports dynamic voltage scaling while maintaining interoperability.

Memory Address Buffering

Clock Distribution

Use Scenario: Driving row/column addresses from a memory controller to multiple DDR SDRAM chips in a dense server DIMM module.

IC Role / Device Role / Timing Role: 32-bit noninverting buffer with per-bank OE control isolates address bus segments and synchronizes timing across parallel DRAM ranks.

Use Value: 1.8-ns t_pd ensures setup margin compliance at 400+ MHz clock rates; 3.6-V I/O tolerance accommodates 3.3-V legacy controllers without level shifters.

Use Scenario: Fanout of system clock or strobe signals to multiple memory devices or FPGA clock inputs in an embedded baseband processor.

IC Role / Device Role / Timing Role: Low-skew, high-drive buffer replicating clock edges with matched propagation delay across all 32 outputs.

Use Value: ±8-mA drive strength sustains signal integrity over 50-Ω traces; bus-hold prevents metastability during clock gating or sleep mode transitions.

Hot-Swappable Module Interface

Mixed-Voltage SoC Interconnect

Use Scenario: Enabling/disabling data paths between hot-pluggable storage modules and host controller in enterprise NAS enclosures.

IC Role / Device Role / Timing Role: 3-state isolation gate controlled by module presence detection logic, powered independently from main system rail.

Use Value: I_off protection prevents backfeed into unpowered modules; 3.6-V I/O tolerance handles 3.3-V module-side signaling safely.

Use Scenario: Bridging 1.8-V CPU core logic to 2.5-V or 3.3-V peripheral interfaces in automotive ADAS SoCs with strict power-domain isolation.

IC Role / Device Role / Timing Role: Voltage-level agnostic buffer providing bidirectional signal integrity across power domain boundaries with minimal latency.

Use Value: Sub-2-ns delay preserves timing closure; 0.8–2.7-V V_CC range supports dynamic voltage scaling while maintaining interoperability.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit 3-state buffer applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SN74AVCH32244ZKER	Higher drive (±12 mA at 1.8 V), faster t_pd (1.4 ns typ), supports 1.2–3.6-V V_CC; no bus-hold circuitry.	Requires external pullup/pulldown resistors on unused inputs; better suited for high-speed, low-latency clock trees where bus-hold is unnecessary.	Select when maximum speed and drive strength outweigh bus-hold convenience; verify input termination strategy.
SN74LVC32244ZKER	3.3-V optimized (1.65–3.6-V V_CC), lower drive (±24 mA at 3.3 V), no I_off, no bus-hold; higher ICC (100 µA).	Not suitable for partial-power-down systems; requires external termination; intended for legacy 3.3-V-only designs.	Choose only for cost-sensitive 3.3-V applications where 1.8-V operation and I_off are not required.

Compared with SN74AVCH32244ZKER and SN74LVC32244ZKER, the SN74AUCH32244ZKER uniquely balances ultra-low power (40 µA ICC), integrated bus-hold, and I_off protection - making it optimal for power-aware, high-density memory subsystems requiring zero external termination and safe hot-swap behavior.

Availability

SN74AUCH32244ZKER is available at Aetrix Electronics and suitable for memory address buffering, clock distribution, hot-swappable module interfaces, and mixed-voltage SoC interconnects requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for SN74AUCH32244ZKER includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of innovation in high-speed interface and power-efficient logic families.

The SN74AUCH32244ZKER belongs to TI's Widebus+™ family - engineered specifically to increase density and performance of 3-state memory address drivers, clock drivers, and bus-oriented receivers/transmitters in advanced computing and communications platforms.

FAQ

What is the recommended operating voltage range for the SN74AUCH32244ZKER?

The SN74AUCH32244ZKER is fully specified for 1.65-V to 1.95-V V_CC operation, though it remains functional from 0.8 V to 2.7 V. For guaranteed timing and drive performance, design must target the 1.65–1.95-V window - this ensures compliance with the 1.8-ns max t_pd, ±8-mA output drive, and bus-hold specifications stated in the SCES412B datasheet.

Does the SN74AUCH32244ZKER require external pullup or pulldown resistors on its inputs?

No. The SN74AUCH32244ZKER integrates active bus-hold circuitry on all data (A) and output-enable (OE) inputs, which maintains valid logic states without external resistors. Using pullup/pulldown resistors with bus-hold enabled is explicitly discouraged in the datasheet, as it may cause contention and increased power draw - the SN74AUCH32244ZKER is designed for resistor-free operation.

How does the I_off feature function in the SN74AUCH32244ZKER?

The I_off circuitry in the SN74AUCH32244ZKER disables all outputs and blocks current flow when V_CC = 0 V, preventing damaging back-current from live I/O lines into a powered-down device. This allows safe partial-power-down operation in multi-rail systems - for example, when memory modules are hot-swapped or SoC domains power up/down asynchronously - and is validated per JESD 78 Class II latch-up standards.

What package type and pin count does the SN74AUCH32244ZKER use?

The SN74AUCH32244ZKER uses the LFBGA-96 (GKE) package: a 6.0 mm × 6.0 mm, 0.5-mm pitch, 96-terminal grid array with exposed thermal pad. It contains 32 input pins (A1–A4 per bank), 32 output pins (Y1–Y4 per bank), 8 OE pins, 12 V_CC, and 20 GND terminals - totaling 96 connections as confirmed in the SCES412B terminal assignment diagram.

Can the SN74AUCH32244ZKER be used in DDR2 or DDR3 memory subsystems?

Yes. The SN74AUCH32244ZKER is widely deployed in DDR2/DDR3 memory subsystems for address and command buffering due to its 1.8-ns max t_pd at 1.8 V, ±8-mA drive strength, and 3.6-V I/O tolerance - enabling direct interface with both 1.8-V controllers and 3.3-V legacy components. Its bus-hold and I_off features further enhance reliability in high-density, multi-rank DIMM designs.

SN74AUCH32244ZKER Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: 74AUCH

Package/Case:: 96-LFBGA

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Logic Type:: Buffer, Non-Inverting

Number of Elements:: 8

Number of Bits per Element:: 4

Input Type:: -

Output Type:: 3-State

Current - Output High, Low:: 9mA, 9mA

Voltage - Supply:: 0.8V ~ 2.7V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 96-PBGA MICROSTAR (13.6x5.6)

SN74AUCH32244ZKER FAQ

1.How can I place an order for SN74AUCH32244ZKER through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74AUCH32244ZKER on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SN74AUCH32244ZKER reliable?

The price and inventory of SN74AUCH32244ZKER are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74AUCH32244ZKER is usually 5 days.

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SN74AUCH32244ZKER orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SN74AUCH32244ZKER order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74AUCH32244ZKER?

For technical support, including SN74AUCH32244ZKER datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74AUCH32244ZKER requirements.

6.How does Aetrix verify that SN74AUCH32244ZKER is sourced from the original manufacturer or authorized distributors?

All SN74AUCH32244ZKER products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74AUCH32244ZKER meets industry standards.

7.What is the process for return or replacement of SN74AUCH32244ZKER?

All SN74AUCH32244ZKER units undergo pre-shipment inspection (PSI). If there is an issue with SN74AUCH32244ZKER, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74AUCH32244ZKER part is unused and in its original packaging.

Return procedure for SN74AUCH32244ZKER:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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