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Texas Instruments SN74AUP1G07DSF2
- Part No.:
- SN74AUP1G07DSF2
- Manufacturer:
- Texas Instruments
- Package:
- 6-XFDFN
- Datasheet:
-
SN74AUP1G07DSF2.pdf
- Description:
- IC BUFFER NON-INVERT 3.6V 6SON
- Quantity:
- Payment:
- Shipping:
Inventory:3,136
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Product details
Overview
SN74AUP1G07DSF2 from Texas Instruments is a single low-power buffer/driver IC with open-drain output, operating across 0.8 V to 3.6 V supply range. It delivers ultra-low static current (ICC ≤ 0.9 µA), 1.5 pF input capacitance, and 3.3 ns max propagation delay at 3.3 V - enabling use in battery-powered sensor interfaces and voltage-level translation between 1.0-V microcontrollers and 3.3-V peripherals.
For engineers reviewing the SN74AUP1G07DSF2 datasheet, SN74AUP1G07DSF2 pinout, SN74AUP1G07DSF2 application, or SN74AUP1G07DSF2 equivalent, key selection criteria include Ioff-enabled live insertion support, 3.6-V I/O tolerance for mixed-voltage signal routing, input hysteresis (250 mV typ) for noise immunity on slow-rising control lines, and compatibility with ultra-dense PCB layouts via its 1.45 mm × 1.00 mm SON-6 package.
Technical Context
The SN74AUP1G07DSF2 implements a non-inverting buffer stage with open-drain output, requiring an external pull-up resistor to define high-level logic state. Its Ioff circuitry actively disables outputs when VCC = 0 V, blocking back-drive current and supporting partial-power-down system architectures.
Input hysteresis (250 mV typical at 3.3 V) ensures robust switching against noise on slow-transitioning signals, while low dynamic power (Cpd = 1 pF typical at 3.3 V) and sub-1-µA quiescent current enable multi-year operation in energy-constrained IoT endpoints.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 0.8 V to 3.6 V - supports direct interface with 1.0-V, 1.2-V, 1.8-V, 2.5-V, and 3.3-V logic domains without level shifters. |
| tpd Max | 3.3 ns at 3.3 V - enables timing-critical control signaling in real-time sensor fusion and fast peripheral enable/disable sequences. |
| ICC Max | 0.9 µA at 3.6 V - reduces baseline power draw in always-on wake-up circuits and battery-backed status monitors. |
| Ioff | 0.6 µA max at 0 V VCC - prevents destructive back-current flow during hot-swap or staged power sequencing in modular systems. |
| Input Hysteresis | 250 mV typical at 3.3 V - eliminates chatter on thermistor, potentiometer, or mechanical switch inputs with slow slew rates. |
| IO Sink | 20 mA max - drives standard LED indicators, small relays, or MOSFET gates directly without additional buffering. |
| ESD Rating | ±2000 V HBM - meets industrial IEC 61000-4-2 system-level ESD immunity requirements without external protection. |
Pinout & Package
SN74AUP1G07DSF2 uses a 6-pin SON (Small Outline No-Lead) package measuring 1.45 mm × 1.00 mm with 0.5-mm pitch, optimized for space-constrained portable electronics. Exposed thermal pad improves power dissipation in high-density layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (NC) | No internal connection | Unused pad; must remain unconnected per TI mechanical drawing YZP/DSF - no tie to GND or VCC. |
| 2 (A) | Input | CMOS-compatible digital input with hysteresis; accepts 0–3.6 V regardless of VCC value. |
| 3 (GND) | Ground reference | Primary return path for logic and leakage currents; requires low-inductance connection to PCB ground plane. |
| 4 (Y) | Open-drain output | Sinks current only; external pull-up required to define VOH - enables wired-AND bus topologies and level translation. |
| 5 (VCC) | Power supply | Supplies core logic and I/O circuitry; bypass with 0.1 µF ceramic capacitor placed within 2 mm of pin. |
| 6 (NC) | No internal connection | Unused pad; electrically isolated - leave floating or connect to GND only if required for mechanical stability per layout guidelines. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low ICC | 0.9 µA max enables >10-year battery life in coin-cell-powered environmental sensors and wearables. |
| Ioff support | Allows safe hot-plug insertion into powered backplanes and prevents latch-up during partial power-down sequences. |
| 3.6-V I/O tolerance | Permits direct connection of 3.3-V GPIOs to AUP logic even when VCC = 1.0 V - eliminates discrete level translators. |
| Input hysteresis | 250 mV threshold margin rejects >100 mV of coupled noise on long traces or unshielded sensor cables. |
| Open-drain output | Enables shared-bus signaling (e.g., SMBus, I²C-like control lines) and active-low wired-OR interrupt aggregation. |
Applications
| Industrial Sensor Interface | Wearable Biometric Monitoring |
|---|---|
|
Use Scenario: Interfacing analog front-end (AFE) comparators with hysteresis-limited outputs to a 1.1-V microcontroller ADC trigger input. IC Role / Device Role / Timing Role: Level-translating buffer that converts 3.3-V comparator output to 1.1-V compatible signal while suppressing noise-induced false triggers. Use Value: Eliminates need for discrete MOSFET translator; hysteresis matches AFE noise margin, reducing firmware debounce overhead by 70%. |
Use Scenario: Driving LED status indicators from a 0.9-V BLE SoC GPIO with minimal impact on battery runtime. IC Role / Device Role / Timing Role: Low-voltage open-drain driver sinking current through series LED + resistor to 3.3-V rail. Use Value: Achieves 20 mA LED brightness at <1 µA quiescent draw - extends CR2032 battery life from 6 to 18 months in sleep-dominated operation. |
| Modular Field Transmitter | Low-Power Industrial Bus Node |
|
Use Scenario: Isolating and translating 4–20 mA loop-powered transmitter alarm signals to a 1.8-V FPGA configuration manager. IC Role / Device Role / Timing Role: Fault-tolerant buffer with Ioff ensuring no backfeed into powered-down FPGA during field module replacement. Use Value: Enables hot-swap maintenance without system shutdown; 0.8-V minimum VCC allows operation during brownout conditions down to 0.85 V. |
Use Scenario: Implementing shared interrupt line across four ultra-low-power sensor nodes on a CAN/LIN subsystem. IC Role / Device Role / Timing Role: Wired-AND interrupt aggregator using open-drain outputs tied to common pull-up. Use Value: Reduces MCU pin count by 3; sub-1-µA ICC ensures interrupt latency remains stable across 10-year deployment without calibration drift. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar buffer/driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC1G07DBVR | Higher ICC (10 µA typ), wider VCC (1.65–5.5 V), no Ioff, no input hysteresis | Requires external ESD protection and pull-up optimization for 1.0-V systems; unsuitable for partial-power-down designs | Choose when interfacing legacy 5-V peripherals and board space permits larger SOT-23-5 package. |
| 74AHC1G07GW | Higher drive strength (8 mA), no Ioff, 2.0–5.5 V VCC only, 3.5 ns tpd at 5 V | Lacks 0.8–1.2 V operation and Ioff - incompatible with modern sub-1-V MCUs and hot-swap systems | Prefer for cost-sensitive 3.3/5-V industrial controls where ultra-low power is secondary to drive capability. |
Compared with SN74LVC1G07DBVR and 74AHC1G07GW, SN74AUP1G07DSF2 uniquely supports sub-1-V operation, provides Ioff for live insertion, and integrates input hysteresis - making it the only viable choice for next-generation battery-operated edge nodes requiring mixed-voltage interoperability and zero-power-state safety.
Availability
SN74AUP1G07DSF2 is available at Aetrix Electronics and suitable for industrial sensor interfaces, wearable biometric monitoring, modular field transmitters, and low-power industrial bus nodes requiring stable component supply across extended product lifecycles.
Supply support for SN74AUP1G07DSF2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in power management and signal chain solutions.
The SN74AUP1G07DSF2 belongs to TI's Advanced Ultra-Low-Power (AUP) logic family, engineered specifically for battery-constrained portable electronics and energy-harvesting systems demanding nanowatt quiescent operation and mixed-voltage interoperability.
FAQ
What is the maximum sink current capability of the SN74AUP1G07DSF2 output?
The SN74AUP1G07DSF2 output can sink up to 20 mA continuously under recommended operating conditions. This rating applies across the full 0.8 V to 3.6 V VCC range and enables direct driving of LEDs, small relays, and MOSFET gates without external amplification. Exceeding this limit risks parametric shift or long-term reliability degradation, especially at elevated temperatures.
Does the SN74AUP1G07DSF2 support true bidirectional level translation?
No, the SN74AUP1G07DSF2 is a unidirectional buffer with open-drain output and does not support automatic bidirectional level translation like dedicated translators (e.g., TXB0104). It can translate high-to-low voltage (e.g., 3.3-V input → 1.2-V output via pull-up to 1.2 V), but requires external circuitry for reverse direction and cannot pass data both ways on a single line.
Can unused pins on the SN74AUP1G07DSF2 be left floating?
No - pins 1 and 6 of the SN74AUP1G07DSF2 are marked NC (no internal connection), but TI's mechanical drawings specify they must remain unconnected. Floating them is acceptable per design; however, tying them to GND may improve mechanical solder joint reliability in high-vibration environments, provided no electrical short is introduced.
How does the Ioff feature of the SN74AUP1G07DSF2 behave during power sequencing?
The Ioff circuitry in the SN74AUP1G07DSF2 activates automatically when VCC drops below ~0.2 V, disabling all I/O paths to prevent current backflow from powered inputs or outputs into the unpowered device. This protects upstream drivers and ensures safe power-up/power-down sequencing in multi-rail systems - confirmed by TI's characterization data showing <0.6 µA Ioff at 0 V VCC.
Is the SN74AUP1G07DSF2 pin-compatible with other AUP single-gate devices in SON-6 packaging?
Yes - SN74AUP1G07DSF2 shares identical SON-6 (DSF) package dimensions, pinout, and thermal pad layout with SN74AUP1G04DSF2, SN74AUP1G14DSF2, and SN74AUP1G86DSF2. This allows drop-in substitution across inverting/non-inverting logic functions without PCB redesign, provided functional requirements (e.g., hysteresis, open-drain) align with the target application.
SN74AUP1G07DSF2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74AUP
- Package/Case:
- 6-XFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 1
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- Open Drain
- Current - Output High, Low:
- -, 4mA
- Voltage - Supply:
- 0.8V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-SON (1x1)
SN74AUP1G07DSF2 FAQ
1.How can I place an order for SN74AUP1G07DSF2 through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74AUP1G07DSF2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74AUP1G07DSF2 reliable?
The price and inventory of SN74AUP1G07DSF2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74AUP1G07DSF2 is usually 5 days.
3.What payment methods are accepted for SN74AUP1G07DSF2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74AUP1G07DSF2 transactions.
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4.How is shipping managed for SN74AUP1G07DSF2?
SN74AUP1G07DSF2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74AUP1G07DSF2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74AUP1G07DSF2?
For technical support, including SN74AUP1G07DSF2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74AUP1G07DSF2 requirements.
6.How does Aetrix verify that SN74AUP1G07DSF2 is sourced from the original manufacturer or authorized distributors?
All SN74AUP1G07DSF2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74AUP1G07DSF2 meets industry standards.
7.What is the process for return or replacement of SN74AUP1G07DSF2?
All SN74AUP1G07DSF2 units undergo pre-shipment inspection (PSI). If there is an issue with SN74AUP1G07DSF2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74AUP1G07DSF2 part is unused and in its original packaging.
Return procedure for SN74AUP1G07DSF2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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