Texas Instruments SN74AUP1G126DRLR
- Part No.:
- SN74AUP1G126DRLR
- Manufacturer:
- Texas Instruments
- Package:
- SOT-553
- Datasheet:
-
SN74AUP1G126DRLR.pdf
- Description:
- IC BUFFER NON-INVERT 3.6V SOT5
- Quantity:
- Payment:

- Shipping:

Inventory:2,396
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Product details
Overview
SN74AUP1G126DRLR from Texas Instruments is a single low-power bus buffer gate with tri-state output, designed for point-to-point signal routing in battery-powered portable systems. It operates across 0.8 V to 3.6 V supply, delivers 4.6 ns max propagation delay at 3.3 V, consumes ≤0.9 µA static current, and supports Ioff partial-power-down mode for system-level power sequencing - used in SSDs, tablets, and wireless peripherals.
For engineers reviewing the SN74AUP1G126DRLR datasheet, SN74AUP1G126DRLR pinout, SN74AUP1G126DRLR application, or SN74AUP1G126DRLR equivalent, key selection criteria include its ultra-low ICC (0.9 µA max), 3.6-V I/O tolerance for mixed-voltage interfacing, input-disable capability for floating inputs, and SOT-5X3 package (1.60 mm × 1.20 mm) optimized for space-constrained PCB layouts.
Technical Context
This device implements a non-inverting buffer (Y = A) with active-high output enable (OE), enabling precise control of signal flow on shared buses or interconnect lines. Its balanced CMOS push-pull output drives both high and low states symmetrically, supporting clean edge transitions into light capacitive loads up to 30 pF.
The AUP family architecture integrates input hysteresis for noise immunity against slow input transitions, clamp diodes for ESD robustness (2000-V HBM), and Ioff circuitry that isolates inputs/outputs during power-down - preventing back-current damage when VCC = 0 V while maintaining ≤0.6 µA leakage over –40°C to +85°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 0.8 V to 3.6 V - enables direct interface with 1.2-V, 1.8-V, 2.5-V, and 3.3-V logic domains without level shifters |
| tpd Max | 4.6 ns at 3.3 V, CL = 5 pF - ensures sub-5-ns timing margin for high-speed control signals in portable SoC interfaces |
| ICC Max | 0.9 µA at –40°C to +85°C - extends battery life in always-on subsystems like audio docks and wireless headsets |
| Ioff Max | 0.6 µA at –40°C to +85°C - guarantees safe isolation during hot-swap or partial-power-down sequences in SSD and tablet designs |
| Ci Typ | 1.5 pF - minimizes loading on driving MCU GPIOs, preserving signal integrity in dense, high-pin-count layouts |
| IOZ Max | 0.5 µA at 3.6 V - maintains true high-impedance state in tri-state mode, preventing bus contention in shared data paths |
| VIO Tolerance | 3.6-V I/O tolerant - allows 3.3-V signals to be safely driven into the device even when VCC = 1.8 V or lower |
Pinout & Package
SOT-5X3 (5-pin) package: ultra-compact 1.60 mm × 1.20 mm footprint with 0.5-mm pitch, using TI's NanoStar™ die-as-package technology for minimal board area and thermal resistance (RθJA = 295.1°C/W).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 - OE | Input | Active-high output enable; must be pulled low via resistor during power-up/down to guarantee tri-state default |
| 2 - A | Input | Buffer input with hysteresis; accepts floating or slow-transition signals without oscillation |
| 3 - GND | Power | Ground reference; decoupling capacitor required within 2 mm for stable low-noise operation |
| 4 - Y | Output | Tri-state buffered output; sinks/sourses ±4 mA at 3 V, exhibits <10% overshoot/undershoot |
| 5 - VCC | Power | Supply input; supports 0.8–3.6 V; requires local 100-nF ceramic bypass capacitor |
Key Features
| Feature | Design Value |
|---|---|
| Input-disable capability | Allows A input to float without causing undefined output or increased ICC - critical for unconnected test points or unused channels |
| Ioff partial-power-down | Disables all I/Os when VCC = 0 V, limiting back-current to ≤0.6 µA - enables safe insertion/removal in live backplanes |
| Wide VCC range (0.8–3.6 V) | Eliminates need for external voltage translators between legacy 1.8-V peripherals and modern 3.3-V controllers |
| Low Cpd (4 pF typ) | Reduces dynamic switching power by >50% vs. older AUC/AHC families - essential for thermally constrained handheld enclosures |
| ESD robustness (2000-V HBM) | Meets Class II latch-up immunity (>100 mA) - simplifies handling and assembly in standard ESD-safe manufacturing lines |
Applications
| Audio Dock Interface | SSD Host Interface |
|---|---|
Use Scenario: Signal buffering between portable audio source (e.g., smartphone) and dock's DAC/amp stage. IC Role / Device Role / Timing Role: Tri-state buffer isolating source data lines during USB enumeration or sleep mode transitions. Use Value: Prevents signal contention during hot-plug events; 0.9 µA ICC extends dock standby time beyond 30 days on coin-cell backup. | Use Scenario: Level-shifting and bus isolation between NAND flash controller and DRAM cache in client SSD modules. IC Role / Device Role / Timing Role: Single-line driver enabling/disabling DRAM address/data strobes under firmware control. Use Value: 4.6 ns tpd meets JEDEC DDR3L timing budgets; 3.6-V I/O tolerance accommodates 3.3-V controller outputs at 1.2-V VCC. |
| Tablet Power Sequencing | Wireless Peripheral Hub |
Use Scenario: Controlling enable signals for PMIC rails during multi-stage boot or suspend/resume cycles. IC Role / Device Role / Timing Role: Output-enabled buffer gating reset or enable lines to subsystems (e.g., display, camera, modem). Use Value: Ioff mode prevents backfeed from powered-down rails into active ones - eliminates need for discrete blocking diodes. | Use Scenario: Managing LED status indicators and button scan lines in Bluetooth keyboards/mice. IC Role / Device Role / Timing Role: Low-power buffer driving LEDs directly from MCU GPIOs with configurable on/off timing. Use Value: 1.5 pF Ci reduces GPIO loading; input hysteresis rejects EMI from RF sections - improves button debounce reliability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC1G126DBVR | Higher ICC (10 µA typ), narrower VCC range (1.65–5.5 V), no Ioff support | Not suitable for partial-power-down systems; requires external pull-down on OE for safe power sequencing | Choose only if operating exclusively at ≥2.5 V and full-rail shutdown is not required |
| NC7SZ126P5X | Lower drive strength (±2.6 mA), no input hysteresis, 1.65–5.5 V VCC, no Ioff | Lacks noise immunity for slow-switching inputs; unsuitable for floating-input or mixed-voltage hot-swap scenarios | Select only for cost-sensitive, fixed 3.3-V applications where hysteresis and Ioff are unnecessary |
Compared with SN74LVC1G126DBVR and NC7SZ126P5X, SN74AUP1G126DRLR uniquely combines sub-µA static power, 0.8-V minimum operation, Ioff isolation, and input hysteresis - making it the only option for battery-critical, multi-rail, and thermally constrained portable designs.
Availability
SN74AUP1G126DRLR is available at Aetrix Electronics and suitable for audio docks, SSDs, tablets, and wireless peripherals requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for SN74AUP1G126DRLR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog and embedded processing solutions, with core expertise in low-power logic, precision analog, and high-reliability automotive ICs.
The AUP family - including SN74AUP1G126DRLR - was engineered specifically for ultra-low-power portable electronics, targeting extended battery life, mixed-voltage interoperability, and robust operation in thermally constrained handheld and wearable devices.
FAQ
What is the maximum propagation delay of SN74AUP1G126DRLR at 3.3 V?
The maximum propagation delay (tpd) of SN74AUP1G126DRLR is 4.6 ns at VCC = 3.3 V ± 0.3 V, CL = 5 pF, and TA = –40°C to +85°C - measured from A to Y under worst-case process/voltage/temperature conditions per TI SCES596G.
Does SN74AUP1G126DRLR support partial-power-down operation?
Yes, SN74AUP1G126DRLR fully supports partial-power-down via its Ioff feature: when VCC = 0 V, all I/Os enter high-impedance state with ≤0.6 µA leakage over –40°C to +85°C, preventing back-current damage during hot-swap or staged power sequencing.
What package type is used for SN74AUP1G126DRLR?
SN74AUP1G126DRLR uses the SOT-5X3 (5-pin) package - a 1.60 mm × 1.20 mm NanoStar™ package where the silicon die serves as the mechanical substrate, minimizing footprint and thermal resistance (RθJA = 295.1°C/W).
Can SN74AUP1G126DRLR accept input voltages higher than its supply voltage?
Yes, SN74AUP1G126DRLR features overvoltage-tolerant inputs rated up to 4.6 V absolute maximum - allowing 3.3-V signals to be safely applied even when VCC = 1.2 V, enabling mixed-voltage interfacing without external level shifters.
How should the OE pin be handled during power-up to ensure tri-state default?
To guarantee high-impedance output at power-up/power-down, OE must be tied to GND through a pulldown resistor; TI specifies minimum resistance based on driver sink capability - typically 10 kΩ suffices for most MCU-driven implementations of SN74AUP1G126DRLR.
SN74AUP1G126DRLR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74AUP
- Package/Case:
- SOT-553
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 1
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 4mA, 4mA
- Voltage - Supply:
- 0.8V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOT-5
SN74AUP1G126DRLR FAQ
1.How can I place an order for SN74AUP1G126DRLR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74AUP1G126DRLR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74AUP1G126DRLR reliable?
The price and inventory of SN74AUP1G126DRLR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74AUP1G126DRLR is usually 5 days.
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5.How can I obtain technical support or documentation for SN74AUP1G126DRLR?
For technical support, including SN74AUP1G126DRLR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74AUP1G126DRLR requirements.
6.How does Aetrix verify that SN74AUP1G126DRLR is sourced from the original manufacturer or authorized distributors?
All SN74AUP1G126DRLR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74AUP1G126DRLR meets industry standards.
7.What is the process for return or replacement of SN74AUP1G126DRLR?
All SN74AUP1G126DRLR units undergo pre-shipment inspection (PSI). If there is an issue with SN74AUP1G126DRLR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74AUP1G126DRLR part is unused and in its original packaging.
Return procedure for SN74AUP1G126DRLR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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