Texas Instruments SN74AUP1G240YFPR

Overview

SN74AUP1G240 from Texas Instruments is a low-power single inverter with 3-state output, designed for voltage-level translation and bus isolation in portable systems. It operates across 0.8 V to 3.6 V, delivers 4.7 ns max propagation delay at 3.3 V, consumes only 0.9 µA max ICC, and supports Ioff partial power-down mode - enabling use in battery-powered medical sensors and industrial IoT edge nodes.

For engineers reviewing the SN74AUP1G240 datasheet, SN74AUP1G240 pinout, SN74AUP1G240 application, or SN74AUP1G240 equivalent, key selection criteria include its ultra-low static/dynamic power (ICC ≤ 0.9 µA, Cpd = 4.2 pF), 3.6-V I/O tolerance, input hysteresis for noise immunity, and verified DSBGA-6 (YFP) package compatibility with high-density PCB layouts.

Technical Context

The SN74AUP1G240 implements a single inverting buffer with active-low 3-state output enable (OE), performing Y = A logic under positive logic convention. Its Ioff circuitry ensures outputs enter high-impedance state when VCC = 0 V, preventing back-current during partial power-down sequences in multi-rail systems.

It features standard CMOS inputs with 1.5 pF typical input capacitance and built-in hysteresis, enabling robust operation with slow or noisy signals without external Schmitt triggers. Output drive is balanced (sinking/sourcing symmetry), optimized for light capacitive loads up to 30 pF while maintaining <10% overshoot/undershoot relative to VCC.

Key Specifications

Pinout & Package

SN74AUP1G240YFPR uses the 6-pin DSBGA (YFP) package, measuring 0.76 mm × 1.16 mm with bottom-side ball layout. This ultra-compact chip-scale package supports fine-pitch routing and thermal performance critical for space-constrained portable designs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar inverter-with-3-state-output applications.

Compared with SN74LVC1G04DBVR and NC7SZ04P5X, SN74AUP1G240YFPR uniquely combines ultra-low ICC, Ioff-enabled partial power-down, and 3.6-V I/O tolerance - making it the only option suitable for battery-powered systems demanding both energy efficiency and robust multi-voltage interoperability.

Availability

SN74AUP1G240YFPR is available at Aetrix Electronics and suitable for medical sensor interface, industrial bus isolation, wearable health monitor, and IoT edge node applications requiring stable component supply across extended product lifecycles.

Supply support for SN74AUP1G240YFPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in low-power logic, precision analog, and high-reliability industrial solutions.

SN74AUP1G240 belongs to TI's AUP (Advanced Ultra-Low-Power) logic family, engineered specifically for battery-operated portable electronics requiring minimal static/dynamic power consumption across wide VCC ranges (0.8–3.6 V).

FAQ

What is the function of the OE pin on the SN74AUP1G240YFPR?

The OE (Output Enable) pin on the SN74AUP1G240YFPR is an active-low control that places the Y output into high-impedance state when driven high. When OE is low, the device performs Y = A inversion. To ensure reliable high-Z behavior during power-up/down, TI recommends tying OE to VCC via a pullup resistor whose value depends on the driver's sink capability - a standard 10-kΩ resistor suffices for most applications. This behavior is explicitly defined in the Function Table of the SN74AUP1G240 datasheet.

Does the SN74AUP1G240YFPR support partial power-down operation?

Yes, the SN74AUP1G240YFPR fully supports partial power-down via its Ioff feature. When VCC = 0 V, both inputs and outputs enter a high-impedance state with leakage current limited to 0.6 µA maximum at +85°C. This prevents current backflow from live buses into the unpowered device - a critical requirement in modular systems like programmable logic controllers where subsystems power up/down independently. The Ioff specification is validated across –40°C to +85°C per the Electrical Characteristics table in the SN74AUP1G240 datasheet.

What is the maximum propagation delay for SN74AUP1G240YFPR at 3.3 V?

The maximum propagation delay (tpd) for SN74AUP1G240YFPR is 4.7 ns at VCC = 3.3 V ± 0.3 V, measured under CL = 5 pF load and TA = –40°C to +85°C conditions. This value is specified in the Switching Characteristics section (Table 6.6) of the official SN74AUP1G240 datasheet. At 25°C and same conditions, typical tpd is 2.7 ns - confirming consistent sub-5-ns performance across temperature and voltage extremes.

Can SN74AUP1G240YFPR accept 3.3-V input signals while operating at 1.2 V VCC?

Yes, SN74AUP1G240YFPR supports 3.6-V I/O tolerance, meaning its inputs (A and OE) can safely accept voltages up to 3.6 V regardless of VCC level - including when VCC = 1.2 V. This capability is explicitly documented in the Features list and Recommended Operating Conditions table of the SN74AUP1G240 datasheet. It enables direct interfacing between 3.3-V peripherals and sub-1.8-V logic domains without external level shifters.

What package type does SN74AUP1G240YFPR use, and what are its dimensions?

SN74AUP1G240YFPR uses the 6-ball DSBGA (Die Size Ball Grid Array) package, designated YFP in TI's ordering nomenclature. Its nominal body size is 0.76 mm × 1.16 mm with a 0.4-mm ball pitch. This ultra-compact chip-scale package is optimized for high-density portable PCBs and is detailed in the Mechanical, Packaging, and Orderable Information section of the SN74AUP1G240 datasheet, including JEDEC-standard footprint and solder mask recommendations.