Texas Instruments SN74AUP1T34DSFR

Overview

SN74AUP1T34DSFR from Texas Instruments is a 1-bit unidirectional voltage-level translator with dual configurable supply rails (VCCA and VCCB), enabling bidirectional voltage translation between 0.9 V and 3.6 V logic domains. It features balanced propagation delays (e.g., 3.39 ns typical at 3 V → 3 V, CL = 5 pF), ±6-mA output drive at 3 V, Ioff partial-power-down support, and VCC isolation. It is used in Bluetooth/WiFi/baseband module interconnects where low-voltage, low-power signal bridging is required.

For engineers reviewing the SN74AUP1T34DSFR datasheet, SN74AUP1T34DSFR pinout, SN74AUP1T34DSFR application, or SN74AUP1T34DSFR equivalent, key selection criteria include its 0.9–3.6 V dual-rail flexibility, sub-4 ns propagation delay at 3 V, 1.0 mm × 1.0 mm SON-6 package, Ioff-enabled power sequencing safety, and input hysteresis for noise immunity on slow edges.

Technical Context

The SN74AUP1T34DSFR implements a noninverting unidirectional A→B translation architecture with independent VCCA (input-side) and VCCB (output-side) supplies, each supporting 0.9 V to 3.6 V. Its internal circuitry includes Ioff protection that disables outputs during power-down and VCC isolation logic that forces both ports into high-impedance when either VCCA or VCCB is near GND.

Input hysteresis provides robust switching against noise on slow-rising/falling signals (up to 200 ns/V), while balanced tPLH/tPHL ensures symmetrical timing behavior across voltage combinations - critical for clock-forwarding or data-strobe interfaces in mixed-voltage SoC subsystems.

Key Specifications

Pinout & Package

SN74AUP1T34DSFR uses a 6-pin SON (Small Outline No-Lead) package with 1.00 mm × 1.00 mm body size and 0.5-mm pitch. The exposed thermal pad is electrically connected to GND and must be soldered for thermal performance and EMI control.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar voltage-level translation applications.

Compared with SN74LVC1T34DSFR and TXS0101DCKR, the SN74AUP1T34DSFR uniquely combines ultra-low ICC (5.2 µA), Ioff, VCC isolation, and sub-4 ns delay - making it optimal for power-sensitive, mixed-rail, unidirectional interfaces where sequencing safety and timing precision are critical.

Availability

SN74AUP1T34DSFR is available at Aetrix Electronics and suitable for Bluetooth module design, WiFi baseband integration, and industrial sensor hub development requiring stable component supply and guaranteed long-term manufacturability.

Supply support for SN74AUP1T34DSFR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions, with leadership in low-power logic, precision analog, and high-reliability interface ICs.

The SN74AUP1T34DSFR belongs to TI's AUP (Advanced Ultra-Low-Power) logic family, designed specifically for energy-efficient voltage translation in portable, battery-operated, and multi-rail embedded systems.

FAQ

What is the maximum supported data rate for SN74AUP1T34DSFR in a 3.3-V to 3.3-V configuration?

The SN74AUP1T34DSFR achieves a typical propagation delay of 3.39 ns at VCCA = VCCB = 3 V with CL = 5 pF. Assuming setup/hold margins of 2 ns and negligible board trace skew, this supports clean signal transmission up to ≈150 Mbps in point-to-point links. For higher rates or loaded buses, verify timing with actual layout parasitics using the device's AC characterization curves in the datasheet. SN74AUP1T34DSFR performance remains stable across temperature and voltage corners per TI's production test data.

Can SN74AUP1T34DSFR translate from 1.0 V to 2.5 V, and what are the input threshold requirements?

Yes, SN74AUP1T34DSFR supports 1.0 V → 2.5 V translation. With VCCA = 1.0 V, VIH(min) = 0.65 × VCCA = 0.65 V and VIL(max) = 0.3 × VCCA = 0.3 V - compatible with standard 1.0-V logic families. At VCCB = 2.5 V, VOH(min) = VCCB – 0.2 V = 2.3 V and VOL(max) = 0.1 V, meeting 2.5-V CMOS thresholds. SN74AUP1T34DSFR maintains these specs across –40°C to +85°C ambient per its recommended operating conditions.

Does SN74AUP1T34DSFR require power-supply sequencing, and how does VCC isolation behave during power-down?

No sequencing is required: VCCA and VCCB may be powered up or down in any order. When VCCA is pulled to GND (or <0.4 V), the VCC isolation feature forces the B port into high-impedance regardless of A input state - preventing false logic assertion on the 3.3-V bus. Similarly, if VCCB = GND, A-side inputs cause no leakage. This behavior is verified in the SN74AUP1T34DSFR functional modes table and confirmed in TI's production test flow.

Is the NC pin on SN74AUP1T34DSFR required to be grounded or left floating?

The NC pin on SN74AUP1T34DSFR must be left unconnected and floating - it is not internally bonded and has no electrical function. TI's mechanical drawings and package addendum explicitly prohibit routing, soldering, or grounding this pin. Doing so may compromise thermal performance or introduce parasitic coupling. The SN74AUP1T34DSFR datasheet states "NC - No Connect. Leave floating." in the Pin Functions table.

How does the Ioff feature of SN74AUP1T34DSFR protect the system during partial power-down?

The Ioff circuitry in SN74AUP1T34DSFR disables both A and B port outputs when either VCCA or VCCB is at 0 V, limiting off-state current to ±5 µA max. This prevents damaging backflow current from an active 3.3-V bus into a powered-down 1.2-V subsystem - a common failure mode in modular hardware. SN74AUP1T34DSFR's Ioff is tested per JESD78 Class II latch-up standards and is guaranteed over full temperature range, unlike passive resistor-based solutions.