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Texas Instruments SN74AUP2G125YFPR

Part No.:
SN74AUP2G125YFPR
Manufacturer:
Texas Instruments
Category:
Buffers, Drivers, Receivers, Transceivers
Package:
8-XFBGA, DSBGA
Datasheet:
AetrixSN74AUP2G125YFPR.pdf
Description:
IC BUF NON-INVERT 3.6V 8DSBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:9,972

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Product details

Overview

SN74AUP2G125YFPR from Texas Instruments is a dual 3-state bus buffer gate optimized for ultra-low-power operation across 0.8 V to 3.6 V supply rails, featuring 5.4 ns max propagation delay at 3.3 V, 1.5 pF typical input capacitance, and Ioff support for partial-power-down mode - deployed in battery-powered portable electronics, sensor interface buses, and low-voltage logic level translation.

For engineers reviewing the SN74AUP2G125YFPR datasheet, SN74AUP2G125YFPR pinout, SN74AUP2G125YFPR application, or SN74AUP2G125YFPR equivalent, key selection criteria include its 0.8–3.6 V VCC range, 3-state output control per channel, NanoStar™ DSBGA-8 (YFP) package with 0.23-mm solder bumps, and verified Ioff performance enabling safe back-drive prevention during power sequencing.

Technical Context

This device implements two independent noninverting buffer channels, each with dedicated output-enable (OE) control and 3-state output capability. Its AUP-family architecture delivers sub-1 µA static ICC at 3.3 V and supports mixed-mode signal operation via 3.6-V-tolerant I/Os, enabling interoperability between 1.2-V, 1.8-V, 2.5-V, and 3.3-V domains without level shifters.

The input-disable feature allows floating inputs without leakage-induced state instability, while hysteresis on inputs improves noise immunity for slow-rising signals. The Ioff circuitry actively disables outputs when VCC = 0 V, blocking current flow from powered sections into unpowered logic - critical for hot-plug and multi-rail system designs.

Key Specifications

ParameterValue and Actual Design Meaning
VCC Range0.8 V to 3.6 V - enables single-supply operation across multiple voltage domains including 1.2 V, 1.8 V, 2.5 V, and 3.3 V systems
tpd Max5.4 ns at 3.3 V, CL = 5 pF - ensures timing-critical point-to-point buffering with minimal latency
ICC Max0.9 mA at 3.6 V - guarantees ultra-low static power for extended battery life in portable devices
CI Typ1.5 pF - reduces capacitive loading on driving sources, preserving signal integrity in high-speed traces
Ioff Max0.6 mA at 3.6 V - prevents damaging back-current during partial power-down, supporting robust system-level power sequencing
IOH/IOL±4 mA at 3.0 V - provides sufficient drive strength for fanout of 2–4 standard CMOS loads without external buffers
ESD Rating2000-V HBM, 1000-V CDM - meets industrial-grade reliability requirements for handling and board assembly

Pinout & Package

SN74AUP2G125YFPR uses the YFP package: an 8-ball NanoStar™ DSBGA (Die Size Ball Grid Array) with 0.23-mm Pb-free solder bumps, 1.59 mm × 1.53 mm body size, and 0.5 mm max height. Pin 1 is located at the A1 corner (top-left), with ball layout matching the YFP top-view diagram.

Pin/TerminalCircuit RoleDesign Meaning
1 (A1)1OEActive-low enable for Channel 1 - drives 1Y high-impedance when logic high
2 (A2)1AInput for Channel 1 buffer - accepts 0.8–3.6 V logic levels with hysteresis
3 (B1)GNDGround reference - must be connected; exposed center pad may be left open or tied to GND
4 (B2)2YOutput for Channel 2 - 3-state, 3.6-V tolerant, supports Ioff
5 (C1)VCCSupply rail - decoupling capacitor required within 1 cm for stable operation
6 (C2)2OEActive-low enable for Channel 2 - independent control enables asymmetric channel gating
7 (D1)1YOutput for Channel 1 - noninverting, 3-state, compatible with mixed-voltage signaling
8 (D2)2AInput for Channel 2 - electrically identical to 1A, supports floating-input disable mode

Key Features

FeatureDesign Value
Ultra-low static powerICC ≤ 0.9 mA max at 3.6 V - extends runtime in coin-cell or energy-harvesting systems
Wide VCC compatibilityOperates from 0.8 V to 3.6 V - eliminates need for separate voltage regulators in multi-rail SoC interfaces
3.6-V I/O toleranceInputs/outputs withstand up to 3.6 V regardless of VCC - enables direct connection to higher-voltage peripherals
Input-disable capabilityFloating inputs do not cause leakage or undefined states - simplifies PCB routing and reduces pull-up/pull-down count
Ioff partial-power-downOutputs disabled and isolated when VCC = 0 V - prevents backflow current in hot-swap or sleep-mode applications

Applications

Mobile Sensor Hub InterfaceWearable Biometric Data Bus

Use Scenario: Interfacing multiple low-power analog sensors (accelerometer, gyroscope, HRM) to an ARM Cortex-M0+ MCU in a smartwatch.

IC Role / Device Role / Timing Role: Dual-channel 3-state buffer isolating sensor data lines during MCU sleep, enabling selective wake-up without bus contention.

Use Value: Enables zero-current leakage during deep-sleep mode via Ioff, extending battery life by >12% versus standard buffers.

Use Scenario: Routing biometric ADC outputs and touch controller signals through a shared low-pin-count interposer flex cable.

IC Role / Device Role / Timing Role: Level-translating and direction-controlling buffer for bidirectional SPI-like sensor communication at 1.8 V logic.

Use Value: 1.5 pF input capacitance minimizes trace reflections on 40-mm flex routes, maintaining signal fidelity up to 10 MHz.

IoT Edge Node Power SequencingPortable Medical Diagnostic Module

Use Scenario: Managing power-up sequence between RF transceiver (3.3 V), microcontroller (1.8 V), and flash memory (2.7 V) in a LoRaWAN node.

IC Role / Device Role / Timing Role: Isolating reset and clock distribution paths during staggered rail activation using independent OE controls.

Use Value: Independent 1OE/2OE pins allow precise timing control of signal isolation windows, preventing metastability during rail ramp-up.

Use Scenario: Buffering ECG front-end amplifier outputs to a 12-bit SAR ADC in a handheld patient monitor with strict EMC limits.

IC Role / Device Role / Timing Role: Low-noise, low-overshoot bus driver minimizing switching transients that could couple into analog signal chains.

Use Value: Overshoot/undershoot <10% of VCC suppresses conducted emissions, easing Class B CISPR 32 compliance without added filtering.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual 3-state buffer applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SN74LVC2G125DCURHigher ICC (max 10 µA vs. 0.9 mA), faster tpd (3.8 ns), but no Ioff or input-disable featuresSuitable only for always-powered systems; cannot safely isolate unpowered sectionsSelect when speed > power savings and full-system power cycling is guaranteed
74AHC1G125SE-7Single-channel, SOT-353 package, 2–5.5 V VCC, no Ioff, higher drive (±8 mA)Requires two units for dual-channel function; lacks partial-power-down safetyChoose for space-constrained single-line isolation where cost-per-channel is prioritized over system-level safety

Compared with SN74LVC2G125DCUR and 74AHC1G125SE-7, SN74AUP2G125YFPR uniquely combines ultra-low ICC, Ioff-enabled power sequencing, and input-disable - making it the only option qualified for battery-operated, multi-rail, and hot-pluggable embedded systems requiring guaranteed isolation during rail transitions.

Availability

SN74AUP2G125YFPR is available at Aetrix Electronics and suitable for mobile sensor hubs, wearable biometric data buses, IoT edge node power sequencing, and portable medical diagnostic modules requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant DSBGA packaging.

Supply support for SN74AUP2G125YFPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in low-power logic design and advanced packaging.

The AUP family - including SN74AUP2G125YFPR - was engineered specifically for battery-powered portable applications, delivering industry-leading static/dynamic power efficiency across 0.8–3.6 V while maintaining signal integrity and system-level robustness.

FAQ

What is the maximum operating temperature range for SN74AUP2G125YFPR?

The SN74AUP2G125YFPR is rated for continuous operation from –40°C to +85°C ambient temperature, validated per JEDEC JESD22-A104 thermal cycling and JESD22-A108 high-temperature operating life standards. This range supports deployment in consumer wearables, industrial handhelds, and automotive cabin electronics where thermal margins are constrained.

Does SN74AUP2G125YFPR support true 1.2-V logic operation?

Yes, SN74AUP2G125YFPR fully supports 1.2-V VCC operation with guaranteed parameters: VIH ≤ 0.65 × VCC (≤0.78 V), VIL ≥ 0.35 × VCC (≥0.42 V), tpd ≤ 19.5 ns (CL = 5 pF), and ICC ≤ 0.5 µA - enabling direct integration with 1.2-V core logic in modern ultra-low-power MCUs without level translation.

Can SN74AUP2G125YFPR be used with 5-V-tolerant microcontrollers?

No - SN74AUP2G125YFPR inputs are rated for absolute maximum VI = –0.5 V to 4.6 V, but functional operation is specified only up to 3.6 V. While 3.6-V I/O tolerance allows interfacing with 3.3-V peripherals, direct connection to 5-V logic violates recommended operating conditions and risks parametric failure or accelerated wear-out.

How is the exposed center pad on SN74AUP2G125YFPR handled in PCB layout?

The exposed center pad on SN74AUP2G125YFPR (YFP package) must be connected only as a secondary GND or left electrically open - it is not internally connected to any signal or power net. TI's recommended land pattern uses a non-solder-mask-defined (NSMD) copper pad with 0.23-mm openings, and thermal vias are optional since power dissipation is <5 mW under typical operation.

Is SN74AUP2G125YFPR pin-compatible with other AUP-family dual buffers?

Yes - SN74AUP2G125YFPR shares identical pinout and functionality with SN74AUP2G125DCUR (VSSOP), SN74AUP2G125DQER (X2SON), and SN74AUP2G125RSER (UQFN) variants. All use the same 8-pin dual-channel 3-state buffer topology with matching A1–D2 ball/pad mapping, enabling drop-in replacement across package types without layout changes.

SN74AUP2G125YFPR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74AUP
Package/Case:
8-XFBGA, DSBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Logic Type:
Buffer, Non-Inverting
Number of Elements:
2
Number of Bits per Element:
1
Input Type:
-
Output Type:
3-State
Current - Output High, Low:
4mA, 4mA
Voltage - Supply:
0.8V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-DSBGA

SN74AUP2G125YFPR FAQ

1.How can I place an order for SN74AUP2G125YFPR through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74AUP2G125YFPR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of SN74AUP2G125YFPR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74AUP2G125YFPR is usually 5 days.

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SN74AUP2G125YFPR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SN74AUP2G125YFPR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74AUP2G125YFPR?

For technical support, including SN74AUP2G125YFPR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74AUP2G125YFPR requirements.

6.How does Aetrix verify that SN74AUP2G125YFPR is sourced from the original manufacturer or authorized distributors?

All SN74AUP2G125YFPR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74AUP2G125YFPR meets industry standards.

7.What is the process for return or replacement of SN74AUP2G125YFPR?

All SN74AUP2G125YFPR units undergo pre-shipment inspection (PSI). If there is an issue with SN74AUP2G125YFPR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74AUP2G125YFPR part is unused and in its original packaging.

Return procedure for SN74AUP2G125YFPR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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