Texas Instruments SN74AUP2G125YZPR

Overview

SN74AUP2G125YZPR from Texas Instruments is a dual 3-state bus buffer gate optimized for ultra-low-power operation across 0.8 V to 3.6 V supply rails, featuring 5.4 ns max propagation delay at 3.3 V, 1.5 pF typical input capacitance, and I_off support for partial-power-down mode. It enables bidirectional signal isolation in battery-powered portable interfaces such as sensor-to-MCU data paths.

For engineers reviewing the SN74AUP2G125YZPR datasheet, SN74AUP2G125YZPR pinout, SN74AUP2G125YZPR application, or SN74AUP2G125YZPR equivalent, key selection criteria include its 0.9 mA max ICC at 3.3 V, 3.6-V I/O tolerance for mixed-voltage interfacing, input-disable capability for floating inputs, and YZP DSBGA package with 0.23-mm solder bumps.

Technical Context

This device implements two independent noninverting buffers, each with an active-low output-enable (OE) control enabling high-impedance tri-state outputs. The AUP family uses advanced CMOS process technology to achieve sub-1 µA static current and low dynamic power consumption via minimized C_pd (4 pF typ at 3.3 V).

Input hysteresis improves noise immunity against slow-rising signals, while I_off circuitry blocks current backflow during power-down. The YZP package is a 0.5-mm-height die-size ball grid array with 8 solder bumps arranged in a 2×4 layout, requiring board-level thermal pad connection per TI SLUA271 guidelines.

Key Specifications

Pinout & Package

The SN74AUP2G125YZPR uses a DSBGA (YZP) package: 8-ball, 2×4 array, 0.5 mm max height, 0.23 mm solder bump diameter, 0.4 mm pitch, with ball A1 marked by a corner chamfer. The exposed center pad is optional and must be left electrically open or connected only as secondary GND.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual 3-state buffer applications.

Compared with SN74LVC2G125DCUR and SN74AUC2G125YZPR, the SN74AUP2G125YZPR uniquely delivers sub-1 mA ICC across 0.8–3.6 V while maintaining 5.4 ns t_pd, making it the sole choice for battery-constrained systems requiring universal voltage scalability.

Availability

SN74AUP2G125YZPR is available at Aetrix Electronics and suitable for wearable sensor hubs, portable medical diagnostics, IoT edge node voltage translation, and low-power MCU expansion buses requiring stable component supply across extended product lifecycles.

Supply support for SN74AUP2G125YZPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader focused on analog and embedded processing technologies, with decades of expertise in low-power logic design and advanced packaging.

The AUP family was engineered specifically for battery-powered portable electronics, delivering industry-leading static/dynamic power efficiency without sacrificing speed or signal integrity across wide V_CC ranges.

FAQ

What is the minimum V_CC voltage supported by the SN74AUP2G125YZPR?

The SN74AUP2G125YZPR operates down to 0.8 V, enabling direct integration with energy-harvesting circuits and ultra-low-voltage microcontrollers. This specification is validated across –40°C to 85°C and confirmed in the Recommended Operating Conditions table of the SCES688D datasheet. At 0.8 V, t_pd increases to 23.0 ns (CL = 5 pF), and ICC remains ≤0.5 mA.

Does the SN74AUP2G125YZPR require external pull-up resistors on OE pins?

Yes - the SN74AUP2G125YZPR does not include internal pull-ups on the 1OE and 2OE pins. To ensure outputs remain in high-impedance state during power-up/power-down, TI recommends connecting each OE to V_CC via an external pull-up resistor; minimum value depends on driver sink capability but typically ranges from 10 kΩ to 100 kΩ. This requirement is explicitly stated in the datasheet's "Power-Up/Down Considerations" section.

Can the SN74AUP2G125YZPR drive a 5-pF load with guaranteed timing at 3.3 V?

Yes - the SN74AUP2G125YZPR guarantees t_pd ≤5.4 ns and t_en/t_dis ≤5.8 ns/4.6 ns when driving a 5-pF load at 3.3 V, as specified in the Switching Characteristics table (TA = –40°C to 85°C). These values are measured under controlled conditions per Figure 3 load circuit and are production-tested parameters, not typical-only figures.

Is the exposed thermal pad on the YZP package mandatory to connect?

No - the exposed center pad on the SN74AUP2G125YZPR YZP package may be left electrically open or connected only as a secondary GND. TI documentation states it must not be used for primary grounding or power routing. Board layout should follow SLUA271 guidelines: use non-solder-mask-defined (NSMD) land pattern with thermal vias to inner ground planes if connected, but functionality is preserved without connection.

How does the input-disable feature of the SN74AUP2G125YZPR improve system reliability?

The input-disable feature allows unused inputs of the SN74AUP2G125YZPR to float safely without causing excessive ICC or undefined output states - a critical advantage in reconfigurable designs where pin functions change dynamically. This behavior is enabled by internal circuitry that clamps leakage current to ≤0.5 mA even when VI is near V_CC or GND, eliminating need for external pull resistors and reducing BOM count and board space.