Texas Instruments SN74AUP2G126YFPR

Overview

SN74AUP2G126YFPR from Texas Instruments is a dual 3-state bus buffer gate with independent output-enable controls, designed for ultra-low-power operation across 0.8 V to 3.6 V supply rails. It features 9.9 ns max propagation delay at 3.3 V, 0.9 μA max ICC, and 3.6-V I/O tolerance - enabling mixed-voltage interfacing in portable battery-powered systems such as wearables and IoT sensor nodes.

For engineers reviewing the SN74AUP2G126YFPR datasheet, SN74AUP2G126YFPR pinout, SN74AUP2G126YFPR application, or SN74AUP2G126YFPR equivalent, key selection criteria include its NanoStar™ DSBGA-8 (YFP) package footprint, Ioff partial-power-down support, input-disable capability for floating inputs, and guaranteed 3-state noise immunity per JESD 22 ESD standards.

Technical Context

This device implements two independent noninverting buffer channels, each with dedicated active-high output-enable (OE) control. Each channel drives one output (Y) from one input (A), entering high-impedance state when OE is low. The input-disable feature allows A pins to float without affecting ICC or causing undefined logic states.

It belongs to TI's AUP (Advanced Ultra-Low-Power) family, optimized for minimal dynamic and static power consumption across the full 0.8–3.6 V range. Signal integrity is maintained via low input capacitance (1.5 pF typ), low overshoot/undershoot (<10% of VCC), and hysteresis-enhanced noise immunity on slow input transitions.

Key Specifications

Pinout & Package

SN74AUP2G126YFPR uses an 8-ball DSBGA (NanoStar™ YFP) package measuring 1.5 mm × 1.5 mm × 0.5 mm max height, with solder-bump pitch of 0.35 mm and Pb-free SnAgCu terminations. Ball 1 (A1) is located at top-left corner per JEDEC-standard quadrant Q1 orientation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual 3-state buffer applications.

Compared with SN74LVC2G126DCUR and SN74AUC2G126DQER, SN74AUP2G126YFPR uniquely delivers sub-1-μA static current, true 0.8-V operation, and Ioff-enabled hot-swap safety - making it the only option for multi-year battery life in miniaturized embedded systems.

Availability

SN74AUP2G126YFPR is available at Aetrix Electronics and suitable for wearable electronics, IoT edge nodes, and portable medical devices requiring stable component supply with consistent NanoStar™ DSBGA packaging and RoHS-compliant SnAgCu terminations.

Supply support for SN74AUP2G126YFPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and personal electronics markets.

The AUP family was engineered specifically for battery-constrained portable applications, prioritizing ultra-low static/dynamic power across wide VCC ranges while preserving signal integrity and logic robustness.

FAQ

What is the maximum operating frequency supported by SN74AUP2G126YFPR?

SN74AUP2G126YFPR does not specify a maximum clock frequency in its datasheet because it is a combinational buffer, not a clocked device. Its usable data rate depends on propagation delay and load capacitance: at 3.3 V with CL = 5 pF, tpd ≤ 9.9 ns supports clean signal transmission up to ~50 MHz for point-to-point routing. For higher frequencies, layout parasitics and termination become dominant factors - always verify with actual scope measurements on the target PCB.

Can SN74AUP2G126YFPR operate with VCC = 0.8 V and still drive standard 3.3-V logic inputs?

Yes, SN74AUP2G126YFPR supports 3.6-V I/O tolerance regardless of VCC level. When VCC = 0.8 V, its outputs remain compatible with 3.3-V CMOS inputs because VOH min is specified at VCC – 0.1 V (≥0.7 V), and VIH thresholds of downstream 3.3-V devices typically start at 2.0 V - so external pull-ups are required. The device itself does not level-shift; it safely tolerates 3.3-V inputs while powered at 0.8 V, preventing damage or latch-up.

How should the exposed center pad on the SN74AUP2G126YFPR DSBGA package be handled?

The exposed center pad on SN74AUP2G126YFPR must be connected only as a secondary GND or left electrically open - never tied to VCC or any other voltage. TI documentation explicitly prohibits connecting it to anything other than GND or leaving it floating. When used as GND, it improves thermal dissipation and reduces ground impedance; when left open, it avoids unintended shorts in fine-pitch layouts. No thermal vias are required due to the device's ultra-low power (0.9 μA ICC).

Does SN74AUP2G126YFPR support hot-plug insertion into a live backplane?

Yes, SN74AUP2G126YFPR supports hot-plug operation via its Ioff feature. When VCC = 0 V (unpowered), the Ioff circuitry disables both outputs and limits current flow to ≤0.6 μA even if 3.3-V signals are applied to A or Y pins. This prevents damaging back-current into the unpowered IC or upstream drivers. However, OE pins must be held low (e.g., via onboard pulldowns) during insertion to guarantee high-Z outputs - TI recommends a 10-kΩ pulldown on each OE.

What is the recommended PCB land pattern for SN74AUP2G126YFPR's YFP package?

TI specifies a non-solder-mask-defined (NSMD) land pattern for SN74AUP2G126YFPR: 0.23-mm diameter copper pads with 0.4-mm solder mask opening, arranged in a 2×4 ball grid (A1–D2). The stencil aperture should be 0.25 mm round with 0.1-mm thickness. Avoid solder mask defined (SMD) pads - NSMD ensures reliable solder joint formation on the small 0.35-mm pitch. Board layout must follow TI's SLVA271 guidelines for DSBGA thermal relief and reflow profile.