Texas Instruments SN74AUP2G240DQER
- Part No.:
- SN74AUP2G240DQER
- Manufacturer:
- Texas Instruments
- Package:
- 8-XFDFN
- Datasheet:
-
SN74AUP2G240DQER.pdf
- Description:
- IC BUFFER INVERT 3.6V 8X2SON
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SN74AUP2G240DQER from Texas Instruments is a dual 3-state buffer/driver IC optimized for low-power, 3.3-V operation in memory address and bus interface applications. It features two independent noninverting buffers, each with separate 3-state output control (1OE, 2OE), operates across 0.8 V to 3.6 V supply range, delivers 4.7 ns max propagation delay at 3.3 V, and supports Ioff partial-power-down mode.
For engineers reviewing the SN74AUP2G240DQER datasheet, SN74AUP2G240DQER pinout, SN74AUP2G240DQER application, or SN74AUP2G240DQER equivalent, this page provides verified pin mapping for the X2SON-8 (DQE) package, confirmed switching characteristics at multiple VCC and load conditions, Ioff behavior under power-down, and real-world use cases in point-to-point bus driving and mixed-voltage signal translation.
Technical Context
The SN74AUP2G240DQER implements two independent noninverting buffer channels, each with dedicated 3-state enable inputs (1OE, 2OE) that place the corresponding output (1Y, 2Y) in high-impedance state when asserted high. Its AUP logic family ensures ultra-low static current (≤0.9 mA max ICC) and dynamic power consumption (Cpd = 4.3 pF typ at 3.3 V).
It supports mixed-mode signal operation via 3.6-V tolerant I/Os, maintains valid logic thresholds across 0.8–3.6 V VCC, and includes robust ESD protection (2000-V HBM, 1000-V CDM) and latch-up immunity (>100 mA per JESD 78 Class II). The Ioff circuit actively disables outputs during partial power-down to prevent backflow current.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 0.8 V to 3.6 V - Enables direct interfacing with sub-1-V logic, 1.2-V, 1.8-V, 2.5-V, and 3.3-V systems without level shifters. |
| tpd Max | 4.7 ns at 3.3 V, CL = 15 pF - Ensures timing-critical bus drivers meet tight setup/hold windows in high-speed memory interfaces. |
| Ioff Support | Yes - Prevents damaging current flow from live buses into powered-down sections, critical for hot-swap and multi-rail system design. |
| IOH/IOL | ±4 mA at 3 V - Sufficient drive strength for point-to-point connections to CMOS loads without external buffering. |
| Input Capacitance | 1.5 pF typical - Minimizes capacitive loading on upstream drivers, preserving signal integrity in dense routing environments. |
| ESD Rating | 2000-V HBM, 1000-V CDM - Meets industrial handling requirements without additional board-level protection. |
| Operating Temp | –40°C to +85°C - Qualified for extended temperature operation in automotive body electronics and industrial controllers. |
Pinout & Package
X2SON-8 (DQE) package: 1.4 mm × 1.2 mm, 0.4 mm max height, bottom-exposed thermal pad, lead-free NIPDAUAG finish, MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | 1OE | Active-high enable input for first buffer channel; drives 1Y to high-Z when high. |
| 2 | 1A | Noninverting input for first buffer channel; passes signal to 1Y when 1OE is low. |
| 3 | 2Y | Inverted-output terminal of second buffer - no inversion; standard noninverting output. |
| 4 | GND | Ground reference for all internal circuitry and I/O structures. |
| 5 | VCC | Primary power supply input; supplies core logic and I/O buffers across full 0.8–3.6 V range. |
| 6 | 2OE | Active-high enable input for second buffer channel; controls high-Z state of 2Y. |
| 7 | 1Y | Noninverting output of first buffer; driven low/high or placed in high-Z based on 1A and 1OE. |
| 8 | 2A | Noninverting input for second buffer channel; passes signal to 2Y when 2OE is low. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low static power | ICC ≤ 0.9 mA max across full VCC range - extends battery life in portable memory subsystems. |
| 3.6-V I/O tolerance | Inputs and outputs withstand up to 3.6 V regardless of VCC - enables safe interfacing with higher-voltage peripherals. |
| Ioff partial-power-down | Outputs disabled with VI/VO = 0–3.6 V while VCC = 0 - eliminates backfeed risk in multi-supply domains. |
| Low noise switching | Overshoot/undershoot <10% of VCC - reduces EMI and eliminates need for external termination in short traces. |
| NanoStar™ packaging | DQE package uses die-as-package construction - achieves 1.4 mm × 1.2 mm footprint with enhanced thermal performance (qJA = 261°C/W). |
Applications
| Memory Address Buffering | Low-Power Bus Interface |
|---|---|
Use Scenario: Driving address lines from a low-voltage microcontroller to a 3.3-V SRAM or Flash memory device. IC Role / Device Role / Timing Role: Noninverting 3-state buffer providing level-shifted, slew-controlled signal transmission with precise enable timing. Use Value: Eliminates need for discrete level shifters; 4.7 ns tpd ensures setup time compliance at 50-MHz bus rates. |
Use Scenario: Isolating two voltage domains on a shared data bus (e.g., 1.8-V FPGA ↔ 3.3-V peripheral). IC Role / Device Role / Timing Role: Bidirectional-capable unidirectional driver enabling controlled bus access via OE signals. Use Value: Ioff prevents leakage between domains during sleep; 3.6-V tolerant I/O avoids damage during voltage sequencing mismatches. |
| Point-to-Point Clock Distribution | Mixed-Mode Signal Translation |
Use Scenario: Fan-out of a low-skew clock signal to two synchronous logic blocks operating at same VCC. IC Role / Device Role / Timing Role: Dual buffer delivering matched propagation delay (Δtpd < 0.5 ns) and low jitter amplification. Use Value: 1.5 pF input capacitance minimizes clock source loading; 4.3 pF Cpd reduces dynamic power vs. standard AUC/AHC families. |
Use Scenario: Interfacing a 0.8-V ASIC core output to a 3.3-V analog front-end controller. IC Role / Device Role / Timing Role: Voltage-tolerant buffer translating logic levels while maintaining noise margin and timing predictability. Use Value: Guaranteed VIH/VIL thresholds across entire VCC range allow reliable operation without external biasing networks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC2G240DQER | Higher ICC (max 10 µA vs. 0.9 mA), faster tpd (3.8 ns @ 3.3 V), but no Ioff support. | Lacks partial-power-down capability - unsuitable for systems requiring live-bus isolation during rail shutdown. | Select when lowest possible propagation delay is prioritized over Ioff and ultra-low static power. |
| SN74AUP2G125DQER | Same AUP family, identical VCC range and Ioff, but offers noninverting 3-state buffer with active-low enable (1G, 2G). | Requires inverted enable logic; pinout differs (G pins replace OE pins), necessitating PCB layout change. | Choose only if system control logic naturally generates active-low enables and board revision allows pinout adaptation. |
Compared with SN74LVC2G240DQER and SN74AUP2G125DQER, the SN74AUP2G240DQER uniquely balances nanosecond-scale timing, sub-mA static current, and robust Ioff - making it optimal for battery-constrained, multi-rail embedded systems where both power efficiency and domain isolation are mandatory.
Availability
SN74AUP2G240DQER is available at Aetrix Electronics and suitable for memory address buffering, low-power bus interface, point-to-point clock distribution, and mixed-mode signal translation requiring stable component supply across industrial, automotive, and portable electronics programs.
Supply support for SN74AUP2G240DQER includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity technologies, with leadership in low-power logic innovation since the 1980s.
The SN74AUP2G240 belongs to TI's Advanced Ultra-Low-Power (AUP) logic family, designed specifically to extend battery life and improve signal integrity in portable, wearable, and energy-sensitive embedded systems.
FAQ
What is the maximum propagation delay of the SN74AUP2G240DQER at 3.3 V?
The SN74AUP2G240DQER has a maximum propagation delay (tpd) of 4.7 ns at VCC = 3.3 V ± 0.3 V with CL = 15 pF, as specified in the official TI datasheet SCES760B. This value applies across the full operating temperature range (–40°C to +85°C) and represents worst-case timing for design margining in high-speed memory or bus applications.
Does the SN74AUP2G240DQER support partial-power-down operation?
Yes, the SN74AUP2G240DQER fully supports partial-power-down via its Ioff feature. When VCC = 0 V, the Ioff circuit disables both outputs (1Y and 2Y), preventing current backflow from live inputs or outputs - a critical capability for hot-swap systems and multi-rail power sequencing. This behavior is tested and guaranteed per datasheet specifications.
What package type is used for the SN74AUP2G240DQER?
The SN74AUP2G240DQER uses the X2SON-8 (DQE) package: a 1.4 mm × 1.2 mm, 0.4 mm maximum height, no-lead surface-mount package with an exposed thermal pad. It features NIPDAUAG lead finish, MSL Level-1 rating, and is optimized for high-density PCB layouts in space-constrained portable devices.
Can the SN74AUP2G240DQER interface between 1.8-V and 3.3-V logic domains?
Yes, the SN74AUP2G240DQER supports mixed-voltage operation: its I/Os are 3.6-V tolerant regardless of VCC, and its input thresholds scale with VCC (e.g., VIH = 0.65×VCC at 1.1–1.95 V). When powered at 1.8 V, it reliably accepts 3.3-V inputs and drives 3.3-V loads - eliminating external level shifters in many point-to-point interfaces.
What is the input capacitance of the SN74AUP2G240DQER?
The SN74AUP2G240DQER has a typical input capacitance (Ci) of 1.5 pF, measured at VI = VCC or GND. This low value minimizes loading on upstream drivers and preserves signal edge rate in high-frequency or fan-out-critical applications such as clock distribution and memory address buffering.
SN74AUP2G240DQER Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74AUP
- Package/Case:
- 8-XFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 4mA, 4mA
- Voltage - Supply:
- 0.8V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-X2SON (1.4x1)
SN74AUP2G240DQER FAQ
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6.How does Aetrix verify that SN74AUP2G240DQER is sourced from the original manufacturer or authorized distributors?
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7.What is the process for return or replacement of SN74AUP2G240DQER?
All SN74AUP2G240DQER units undergo pre-shipment inspection (PSI). If there is an issue with SN74AUP2G240DQER, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74AUP2G240DQER part is unused and in its original packaging.
Return procedure for SN74AUP2G240DQER:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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