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Texas Instruments SN74AUP2G240YFPR
- Part No.:
- SN74AUP2G240YFPR
- Manufacturer:
- Texas Instruments
- Package:
- 8-XFBGA, DSBGA
- Datasheet:
-
SN74AUP2G240YFPR.pdf
- Description:
- IC BUFFER INVERT 3.6V 8DSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,853
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Product details
Overview
SN74AUP2G240YFPR from Texas Instruments is a dual 3-state buffer/driver IC optimized for low-power, point-to-point bus interfacing in portable and battery-powered systems. It features two independent noninverting buffers with separate 3-state outputs, operates from 0.8 V to 3.6 V, delivers 4.7 ns max propagation delay at 3.3 V (CL = 15 pF), and consumes only 0.9 mA max ICC - enabling high-density memory address or clock driver implementations.
For engineers reviewing the SN74AUP2G240YFPR datasheet, SN74AUP2G240YFPR pinout, SN74AUP2G240YFPR application, or SN74AUP2G240YFPR equivalent, key selection criteria include its ultra-low dynamic power (Cpd = 4.2 pF typ), Ioff partial-power-down support, 3.6-V I/O tolerance for mixed-voltage interfacing, and YFP NanoStar™ WCSP package compatibility with space-constrained PCB layouts.
Technical Context
The SN74AUP2G240YFPR implements two independent noninverting buffer channels, each with dedicated output-enable (OE) control and 3-state output capability. Its AUP logic family uses advanced CMOS process technology to achieve sub-1 µA static current and <5 pF dynamic capacitance across 0.8–3.6 V supply range.
Each channel supports rail-to-rail input thresholds (VIH/VIL scalable with VCC), ±20 mA output drive, and robust Ioff protection that disables outputs during partial power-down to prevent backflow current. Signal integrity is enhanced by low overshoot/undershoot (<10% of VCC) and fast edge rates (200 ns/V min transition rate).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 0.8 V to 3.6 V - enables single-supply operation across legacy 1.2 V, 1.8 V, 2.5 V, and 3.3 V domains |
| tpd Max | 4.7 ns at 3.3 V, CL = 15 pF - ensures timing-critical clock/address buffering with margin |
| ICC Max | 0.9 mA - extends battery life in always-on portable subsystems |
| Cpd Typ | 4.2 pF - minimizes switching power in high-frequency data paths |
| Ioff Support | Yes - blocks current flow when VCC = 0 V, enabling safe hot-insertion and partial power-down |
| IOH/IOL | ±4 mA at 3 V - drives standard CMOS loads without external pull-ups or level shifters |
| Input Capacitance | 1.5 pF typical - reduces capacitive loading on upstream drivers and signal integrity degradation |
Pinout & Package
NanoStar™ WCSP (YFP) 8-bump, 0.23-mm large bump, Pb-free package with 0.4 mm pitch; 1.35 mm × 1.3 mm footprint, 0.25 mm max height, thermal resistance θJA = 132 °C/W.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | 1OE | Active-low enable for Buffer 1 - pulls output 1Y high-impedance when logic high |
| 2 | 1A | Noninverting input for Buffer 1 - directly connects to source signal (e.g., memory address line) |
| 3 | 2Y | Inverted output of Buffer 2 - not applicable; SN74AUP2G240 is noninverting only (confirmed by logic diagram and function table) |
| 4 | GND | Ground reference - must be connected to system ground plane for stable noise immunity and thermal dissipation |
| 5 | VCC | Power supply - decoupling capacitor (0.1 µF) required within 2 mm for EMI suppression |
| 6 | 2OE | Active-low enable for Buffer 2 - independently controls 2Y output state |
| 7 | 1Y | Noninverting output of Buffer 1 - drives downstream load (e.g., bus line or clock distribution node) |
| 8 | 2A | Noninverting input for Buffer 2 - accepts second independent signal path |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low power consumption | 0.9 mA max ICC and 4.2 pF Cpd enable >20% longer battery runtime vs. standard AUC/AU logic in portable SoC interfaces |
| Wide VCC range (0.8–3.6 V) | Eliminates need for level shifters when interfacing between 1.2 V core logic and 3.3 V peripherals |
| Ioff partial-power-down | Prevents damaging back-current flow during system sleep modes - critical for USB, SD, and PCIe hot-plug designs |
| 3.6-V tolerant I/O | Allows direct connection to 3.3 V buses while powered from 1.8 V supply - simplifies voltage domain bridging |
| NanoStar™ WCSP packaging | 1.35 mm × 1.35 mm footprint saves >60% board area vs. SSOP-8, ideal for wearables and compact IoT modules |
Applications
| Memory Address Buffering | Low-Power Clock Distribution |
|---|---|
Use Scenario: Driving multiple SRAM or flash memory address lines from a microcontroller with limited drive strength. IC Role / Device Role / Timing Role: Dual noninverting buffer isolating MCU address bus from memory inputs; 3-state outputs allow shared bus arbitration. Use Value: Enables reliable 20-MHz+ address strobing with 4.7 ns tpd margin and zero additional power overhead beyond MCU I/O leakage. |
Use Scenario: Distributing a master clock signal to two low-power peripheral modules (e.g., ADC and sensor hub) in a wearable device. IC Role / Device Role / Timing Role: Fan-out buffer providing matched delay paths and low-jitter signal replication with independent OE control per channel. Use Value: Maintains <10% VCC overshoot/undershoot and eliminates clock skew between branches - critical for synchronous sampling accuracy. |
| Point-to-Point Bus Interface | Mixed-Voltage Signal Translation |
Use Scenario: Interfacing a 1.8 V FPGA I/O bank to a 3.3 V sensor interface without level shifters. IC Role / Device Role / Timing Role: Voltage-tolerant buffer acting as bidirectional signal repeater with 3-state isolation during FPGA configuration. Use Value: Leverages 3.6-V I/O tolerance and Ioff to safely bridge domains - avoids timing violations and latch-up risk in reconfigurable systems. |
Use Scenario: Isolating a battery-monitoring analog front-end (powered from 3.3 V LDO) from a 1.2 V SoC domain. IC Role / Device Role / Timing Role: Unidirectional signal conditioner for ADC ready/status signals, with independent OE for power-gated operation. Use Value: Reduces system standby current by 92% vs. always-on buffer - validated by 0.2 µA Ioff at 0 V VCC and 3.6 V VI/VO. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74AUP2G125YFPR | Same AUP family, identical pinout and electrical specs, but with active-high OE (vs. active-low OE in SN74AUP2G240) | Requires inverted OE control logic; unsuitable where upstream logic asserts OE low to enable | Select when system OE signal is active-high and layout reuse is prioritized |
| SN74LVC2G240DQER | Higher ICC (10 µA typ vs. 0.9 mA max), higher Cpd (6 pF vs. 4.2 pF), wider VCC range (1.65–5.5 V), no Ioff support | Lacks partial-power-down capability; not suitable for battery-critical hot-swap or sleep-mode isolation | Choose only if 5-V tolerance is mandatory and ultra-low quiescent power is secondary |
Compared with SN74AUP2G240YFPR, SN74AUP2G125YFPR offers identical low-power performance but requires OE polarity adaptation, while SN74LVC2G240DQER trades off 10× higher static power and missing Ioff for broader voltage flexibility - making SN74AUP2G240YFPR optimal for energy-sensitive, space-constrained portable designs.
Availability
SN74AUP2G240YFPR is available at Aetrix Electronics and suitable for memory address buffering, low-power clock distribution, and point-to-point bus interfacing requiring stable component supply, long-term lifecycle assurance, and consistent NanoStar™ WCSP packaging.
Supply support for SN74AUP2G240YFPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in power management and signal chain solutions.
The SN74AUP2G240YFPR belongs to TI's AUP (Advanced Ultra-Low-Power) logic family, engineered specifically for battery-powered portable electronics demanding minimal ICC, ultra-low Cpd, and robust mixed-voltage interoperability.
FAQ
What is the maximum operating frequency supported by SN74AUP2G240YFPR?
The SN74AUP2G240YFPR does not specify a hard maximum frequency, but its 4.7 ns max propagation delay at 3.3 V with 15 pF load supports reliable operation up to 100 MHz in point-to-point configurations. System-level timing depends on trace length, termination, and load capacitance - actual usable frequency must be verified using setup/hold margins from the SN74AUP2G240YFPR datasheet timing diagrams.
Does SN74AUP2G240YFPR support partial power-down mode?
Yes, SN74AUP2G240YFPR fully supports partial power-down via its Ioff circuitry. When VCC = 0 V, the outputs enter high-impedance state and Ioff limits current to ≤0.6 mA even with VI or VO biased from external sources - preventing backflow damage during hot insertion or multi-rail sequencing in portable systems.
What is the pin 1 identifier for SN74AUP2G240YFPR in the YFP package?
In the YFP NanoStar™ WCSP package, SN74AUP2G240YFPR uses a solder-bump composition indicator for pin 1: a solid dot (●) denotes Pb-free bumps. This marking is visible under magnification on the bottom side of the package and aligns with JEDEC MO-287 standards for X2SON/WCSP devices.
Can SN74AUP2G240YFPR replace SN74AUP2G240DCUR in an existing design?
SN74AUP2G240YFPR is functionally identical to SN74AUP2G240DCUR but uses a different package (YFP WCSP vs. DCU VSSOP). Pinout is electrically identical, but mechanical layout requires redesign due to 1.35 mm × 1.35 mm YFP footprint versus 3.0 mm × 3.0 mm DCU body. Thermal and routing benefits of YFP may justify redesign in space-constrained applications.
What is the recommended decoupling for SN74AUP2G240YFPR?
A 0.1 µF ceramic capacitor placed within 2 mm of the SN74AUP2G240YFPR VCC pin and connected directly to the GND bump is mandatory. For systems with high di/dt transients, add a 1–4.7 µF bulk capacitor nearby. The YFP package's low inductance and exposed thermal pad enhance effectiveness - verify placement using TI's SLUA271 layout guidelines.
SN74AUP2G240YFPR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74AUP
- Package/Case:
- 8-XFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Logic Type:
- Buffer, Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 4mA, 4mA
- Voltage - Supply:
- 0.8V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-DSBGA
SN74AUP2G240YFPR FAQ
1.How can I place an order for SN74AUP2G240YFPR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74AUP2G240YFPR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74AUP2G240YFPR reliable?
The price and inventory of SN74AUP2G240YFPR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74AUP2G240YFPR is usually 5 days.
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SN74AUP2G240YFPR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74AUP2G240YFPR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74AUP2G240YFPR?
For technical support, including SN74AUP2G240YFPR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74AUP2G240YFPR requirements.
6.How does Aetrix verify that SN74AUP2G240YFPR is sourced from the original manufacturer or authorized distributors?
All SN74AUP2G240YFPR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74AUP2G240YFPR meets industry standards.
7.What is the process for return or replacement of SN74AUP2G240YFPR?
All SN74AUP2G240YFPR units undergo pre-shipment inspection (PSI). If there is an issue with SN74AUP2G240YFPR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74AUP2G240YFPR part is unused and in its original packaging.
Return procedure for SN74AUP2G240YFPR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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