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Texas Instruments SN74AUP2G241DCUR
- Part No.:
- SN74AUP2G241DCUR
- Manufacturer:
- Texas Instruments
- Package:
- 8-VFSOP (0.091", 2.30mm Width)
- Datasheet:
-
SN74AUP2G241DCUR.pdf
- Description:
- IC BUFFER NON-INVERT 3.6V 8VSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:149
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Product details
Overview
SN74AUP2G241 from Texas Instruments is a dual 3-state buffer/driver IC optimized for low-power, point-to-point bus interface applications in portable and battery-powered systems. It features two independent noninverting buffers (1A→1Y, 2A→2Y), 3.3-V I/O tolerance, ultra-low static current (ICC ≤ 0.9 mA), 9.9 ns max propagation delay at 3.3 V, and operates across 0.8 V to 3.6 V supply range.
For engineers reviewing the SN74AUP2G241 datasheet, SN74AUP2G241 pinout, SN74AUP2G241 application, or SN74AUP2G241 equivalent, this device is selected for memory-address driver, clock distribution, and bidirectional bus transceiver roles where power efficiency, signal integrity, and partial-power-down capability (Ioff) are critical design requirements.
Technical Context
The SN74AUP2G241 implements dual independent noninverting 3-state buffers with separate output-enable controls (1OE, 2OE). Each channel drives one output (1Y, 2Y) from its respective input (1A, 2A), supporting high-impedance tri-state operation when OE is high. The logic is positive-true: output follows input only when OE = L.
It supports mixed-mode signal operation via 3.6-V tolerant I/Os and enables system-level power management through Ioff circuitry that disables outputs and blocks current backflow during partial power-down. Input capacitance is 1.5 pF typical, and dynamic power dissipation is 4.2 pF typical at 3.3 V and 10 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 0.8 V to 3.6 V - Enables single-supply operation across ultra-low-voltage microcontrollers and mixed-voltage interfaces. |
| Max Propagation Delay (tpd) | 9.9 ns at 3.3 V, CL = 15 pF - Supports reliable timing in 25-MHz clock domains and address/data strobing. |
| Static Current (ICC) | ≤ 0.9 mA at 3.3 V - Extends battery life in always-on sensor nodes and wearable devices. |
| Ioff Support | Yes, per JESD 78 Class II - Prevents damaging back-current when VCC is off while I/Os remain biased, enabling hot-swap and partial shutdown. |
| Input Capacitance (Ci) | 1.5 pF typical - Minimizes loading on high-speed source drivers and reduces signal distortion in compact PCB layouts. |
| Output Drive (IOL/IOH) | ±4 mA at 3.0 V - Sufficient for driving 50-Ω transmission lines or fan-out to 2–3 standard CMOS inputs without external buffering. |
| ESD Rating | 2000-V HBM, 1000-V CDM - Meets industrial-grade robustness requirements without additional protection circuitry. |
Pinout & Package
VSSOP-8 (DCU) package: 2.0 mm × 1.25 mm, 0.5-mm pitch, exposed thermal pad, RoHS-compliant NiPdAu finish, MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | 1OE | Active-low enable for first buffer; pulls 1Y to high-impedance when high. |
| 2 | 1A | Noninverting input for first buffer; directly drives 1Y when 1OE = L. |
| 3 | 2Y | Noninverting output of second buffer; high-impedance when 2OE = H. |
| 4 | GND | Ground reference for all internal circuitry and I/Os; must be low-inductance connection. |
| 5 | VCC | Primary power supply (0.8–3.6 V); decoupling capacitor required within 1 cm. |
| 6 | 2OE | Active-low enable for second buffer; independent control from 1OE. |
| 7 | 1Y | Noninverting output of first buffer; matches 1A logic state when enabled. |
| 8 | 2A | Noninverting input for second buffer; drives 2Y when 2OE = L. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low dynamic power | Cpd = 4.2 pF typical at 3.3 V - Reduces switching noise and heat generation in dense, thermally constrained layouts. |
| 3.6-V I/O tolerance | Supports mixed-voltage interfacing (e.g., 1.8-V MCU to 3.3-V peripheral) without level shifters. |
| Low undershoot/overshoot | <10% of VCC - Preserves signal integrity on short traces and minimizes EMI in RF-sensitive designs. |
| NanoStar™ packaging option | DSBGA (YFP) variant available - Enables <1.0 mm² footprint for space-constrained wearables and IoT edge nodes. |
| Wide temperature range | –40°C to +85°C - Qualified for industrial and automotive cabin applications without derating. |
Applications
| Memory Address Buffering | Low-Power Clock Distribution |
|---|---|
|
Use Scenario: Driving address lines from an ultra-low-power MCU to multiple SRAM or flash devices in a handheld medical monitor. IC Role / Device Role / Timing Role: Dual noninverting buffer isolates MCU pins, provides drive strength, and enables selective disable of unused memory banks via 1OE/2OE. Use Value: Eliminates need for discrete level shifters or additional drivers; 0.9 mA ICC extends battery runtime by >12% versus standard AUC-series alternatives. |
Use Scenario: Distributing a 12-MHz system clock from an SoC to two isolated subsystems (sensor hub and display controller) in a smart thermostat. IC Role / Device Role / Timing Role: Acts as a low-skew, low-noise clock fanout buffer with independent enable controls for power-gated domains. Use Value: 9.9 ns tpd and <10% overshoot ensure clean edges at destination; Ioff prevents clock feedthrough during subsystem sleep. |
| Point-to-Point Bus Interface | Partial-Power-Down System Control |
|
Use Scenario: Interfacing a 3.3-V FPGA I/O bank to a 1.8-V ADC in a battery-powered data logger, requiring direction-controlled signal isolation. IC Role / Device Role / Timing Role: Bidirectional buffer with independent OE controls manages data flow direction and isolates voltage domains. Use Value: 3.6-V tolerant I/Os eliminate external clamping diodes; 1.5 pF Ci preserves rise/fall times up to 100 Mbps. |
Use Scenario: Enabling/disabling communication paths between powered and unpowered modules in a modular industrial PLC baseboard. IC Role / Device Role / Timing Role: Provides safe, leakage-free signal isolation during module hot-swap or firmware update cycles. Use Value: Ioff limits reverse current to ≤0.6 mA even with 3.6-V signals applied while VCC = 0 V - meets IEC 61000-4-2 system-level ESD immunity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC2G241DCUR | Higher ICC (max 10 µA vs. 0.9 mA), faster tpd (6.7 ns @ 3.3 V), but no Ioff support. | Lacks partial-power-down capability; unsuitable for hot-swap or multi-rail systems with unpowered sections. | Select when speed is primary and full-system power cycling is guaranteed. |
| SN74AHC2G241DCUR | Wider VCC range (2–5.5 V), higher drive (±8 mA), but higher Cpd (12 pF) and no 3.6-V I/O tolerance. | Requires level shifting for sub-2-V logic; not suitable for mixed-voltage battery systems below 2 V. | Select for legacy 3.3/5-V systems where higher drive and rail-to-rail swing are needed. |
Compared with SN74LVC2G241DCUR and SN74AHC2G241DCUR, the SN74AUP2G241DCUR uniquely balances ultra-low static power, Ioff-enabled safety, and 3.6-V I/O tolerance - making it the only choice for battery-operated, mixed-voltage, and partial-power-down architectures.
Availability
SN74AUP2G241DCUR is available at Aetrix Electronics and suitable for memory-address buffering, low-power clock distribution, and point-to-point bus interface applications requiring stable component supply and long-term industrial lifecycle support.
Supply support for SN74AUP2G241DCUR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and personal electronics markets.
The SN74AUP2G241 belongs to TI's AUP (Advanced Ultra-Low-Power) logic family, engineered specifically to maximize battery life and signal integrity in portable and energy-constrained applications operating from 0.8 V to 3.6 V.
FAQ
What is the maximum operating frequency supported by the SN74AUP2G241DCUR?
The SN74AUP2G241DCUR does not specify a maximum clock frequency in its datasheet. Its performance is characterized by propagation delay: 9.9 ns max at 3.3 V with 15-pF load. This supports reliable operation in 25-MHz synchronous systems (tcycle = 40 ns) with margin for setup/hold and routing delays. For higher frequencies, signal integrity and board layout become dominant constraints.
Does the SN74AUP2G241DCUR support level-shifting between different supply voltages?
Yes, the SN74AUP2G241DCUR supports mixed-voltage operation: its I/Os tolerate up to 3.6 V regardless of VCC, enabling use as a level shifter - for example, translating 1.8-V MCU outputs to 3.3-V peripherals when VCC = 1.8 V. However, output voltage swing is limited to VCC, so true bidirectional level translation requires external circuitry.
How does the Ioff feature of the SN74AUP2G241DCUR protect the system during partial power-down?
The Ioff feature in the SN74AUP2G241DCUR disables all outputs and blocks current flow when VCC = 0 V, even if input or output pins are driven to up to 3.6 V. This prevents damaging back-current into a powered-down section, satisfying IEC 61000-4-2 system-level ESD requirements and enabling safe hot-swap of modules in industrial backplanes.
What is the recommended PCB layout practice for the SN74AUP2G241DCUR in high-speed applications?
For optimal signal integrity, place a 0.1-µF ceramic decoupling capacitor between VCC and GND within 3 mm of pins 5 and 4. Route inputs/outputs as controlled-impedance traces (50 Ω) if operating above 20 MHz, avoid stubs, and maintain solid ground beneath the VSSOP-8 body. Do not float unused inputs - tie 1A/2A to VCC or GND per TI's SCBA004 guidance.
Can the SN74AUP2G241DCUR replace the SN74AUP2G125DCUR in an existing design?
No - the SN74AUP2G241DCUR and SN74AUP2G125DCUR have different logic functions: the 241 is a dual noninverting buffer with active-low enables (1OE, 2OE), while the 125 is a dual noninverting buffer with active-high enables (1CE, 2CE). Pinouts differ (e.g., 1CE = pin 1 on 125 vs. 1OE = pin 1 on 241), requiring PCB and firmware changes. They are functionally incompatible drop-in replacements.
SN74AUP2G241DCUR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74AUP
- Package/Case:
- 8-VFSOP (0.091", 2.30mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 4mA, 4mA
- Voltage - Supply:
- 0.8V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-VSSOP
SN74AUP2G241DCUR FAQ
1.How can I place an order for SN74AUP2G241DCUR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74AUP2G241DCUR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74AUP2G241DCUR reliable?
The price and inventory of SN74AUP2G241DCUR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74AUP2G241DCUR is usually 5 days.
3.What payment methods are accepted for SN74AUP2G241DCUR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74AUP2G241DCUR transactions.
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4.How is shipping managed for SN74AUP2G241DCUR?
SN74AUP2G241DCUR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74AUP2G241DCUR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74AUP2G241DCUR?
For technical support, including SN74AUP2G241DCUR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74AUP2G241DCUR requirements.
6.How does Aetrix verify that SN74AUP2G241DCUR is sourced from the original manufacturer or authorized distributors?
All SN74AUP2G241DCUR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74AUP2G241DCUR meets industry standards.
7.What is the process for return or replacement of SN74AUP2G241DCUR?
All SN74AUP2G241DCUR units undergo pre-shipment inspection (PSI). If there is an issue with SN74AUP2G241DCUR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74AUP2G241DCUR part is unused and in its original packaging.
Return procedure for SN74AUP2G241DCUR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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