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Texas Instruments SN74AUP2G34YFPR
- Part No.:
- SN74AUP2G34YFPR
- Manufacturer:
- Texas Instruments
- Package:
- 6-XFBGA, DSBGA
- Datasheet:
-
SN74AUP2G34YFPR.pdf
- Description:
- IC BUF NON-INVERT 3.6V 6DSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,658
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Product details
Overview
SN74AUP2G34YFPR from Texas Instruments is a dual non-inverting buffer gate in a 6-ball DSBGA (YFP) package, optimized for ultra-low-power operation across 0.8 V to 3.6 V supply range. It delivers 4.3 ns max propagation delay at 3.3 V, 1.5 pF typical input capacitance, and supports partial-power-down via Ioff. It is used in space-constrained battery-powered interfaces such as sensor signal conditioning and level-shifting between mixed-voltage domains.
For engineers reviewing the SN74AUP2G34YFPR datasheet, SN74AUP2G34YFPR pinout, SN74AUP2G34YFPR application, or SN74AUP2G34YFPR equivalent, key selection criteria include its sub-1 µA static ICC, 4.3 pF dynamic power dissipation capacitance, Ioff-enabled isolation during power sequencing, and compatibility with 0.8 V logic thresholds - critical for modern ultra-low-voltage IoT node design.
Technical Context
The SN74AUP2G34YFPR implements two independent positive-logic buffers (Y = A), with no internal feedback or enable control. Each channel operates with rail-to-rail input voltage tolerance (–0.5 V to VCC + 0.5 V) and supports 3.6-V I/O tolerance on all pins, enabling robust mixed-mode interfacing.
Its AUP-family architecture achieves ultra-low dynamic power via minimized internal node capacitance and optimized drive strength, delivering 4.3 ns tpd at 3.3 V with CL = 15 pF while maintaining <10% VCC overshoot/undershoot and latch-up immunity exceeding 100 mA per JESD 78 Class II.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 0.8 V to 3.6 V - enables direct interface with 0.9-V microcontrollers and 3.3-V peripherals without level shifters |
| tpd Max | 4.3 ns at 3.3 V, CL = 15 pF - ensures timing-critical point-to-point signal buffering in high-speed low-voltage links |
| ICC Max | 0.9 mA at 3.3 V - reduces quiescent current by >50% vs. older AUC/AU families, extending battery life |
| Ioff Support | Active at 0 V VCC - prevents backflow current during partial power-down, protecting upstream drivers |
| Ci Typ | 1.5 pF - minimizes capacitive loading on driving sources, preserving signal integrity in dense layouts |
| ESD Rating | ±2000-V HBM, ±1000-V CDM - meets industrial-grade robustness requirements without external protection |
Pinout & Package
SN74AUP2G34YFPR uses a 6-ball NanoStar™ DSBGA (YFP) package measuring 1.13 mm × 0.73 mm × 0.5 mm max height, with solder-bump composition Pb-free (SnAgCu). Pin 1 is identified by a dot on the top-side marking "H9N".
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A | Input of Buffer 1 | Accepts logic signals from 0.8 V to 3.6 V; VIH/VIL thresholds scale with VCC |
| 1Y | Output of Buffer 1 | Drives loads up to ±4 mA at 3 V; output swing rails to VCC/GND |
| 2A | Input of Buffer 2 | Independent of Channel 1; supports asynchronous signal routing |
| 2Y | Output of Buffer 2 | Provides isolated buffered copy; no crosstalk with Channel 1 per test data |
| VCC | Supply Voltage | Single supply powers both channels; decoupling required within 2 mm |
| GND | Ground Reference | Common return for inputs, outputs, and supply; must be low-impedance |
Key Features
| Feature | Design Value |
|---|---|
| NanoStar™ DSBGA packaging | 1.13 mm × 0.73 mm footprint - enables placement in <1.5 mm² board area, ideal for wearables and hearing aids |
| 0.8-V logic compatibility | VIH = 0.65×VCC min at 1.1 V - allows direct connection to sub-1-V processors without translation |
| Ioff circuitry | 0.6 µA max Ioff at 0 V VCC - eliminates leakage paths during sleep mode, simplifying power sequencing |
| Low-noise switching | <10% VCC overshoot/undershoot - reduces EMI in noise-sensitive analog sections adjacent to digital routing |
| Wide temperature range | –40°C to +85°C operation - validated for automotive cabin and industrial edge-sensor environments |
Applications
| Wearable Sensor Hub Interface | Ultra-Low-Power MCU GPIO Expansion |
|---|---|
Use Scenario: Interfacing MEMS accelerometers (1.8-V I/O) to a 0.9-V ultra-low-power MCU core. IC Role / Device Role / Timing Role: Dual buffer isolates voltage domains and restores signal slew rate degraded by long PCB traces. Use Value: Enables direct 0.9-V logic compatibility without level shifters, reducing BOM count and layout area by 30%. | Use Scenario: Expanding limited GPIO count on a battery-powered BLE SoC by buffering outputs to multiple peripheral enable lines. IC Role / Device Role / Timing Role: Provides fan-out capability with minimal added propagation delay (≤4.3 ns) and zero static power penalty. Use Value: Adds two reliable, low-capacitance outputs while consuming <1 µA total ICC, preserving multi-year battery life. |
| Industrial Smart Transmitter Signal Conditioning | Medical Patch Monitor Data Routing |
Use Scenario: Buffering analog-to-digital converter (ADC) control signals in a 24-V loop-powered transmitter with isolated 3.3-V digital section. IC Role / Device Role / Timing Role: Acts as a clean, low-noise interface between isolated digital domains, suppressing coupling into sensitive analog front-end. Use Value: Achieves <10% VCC overshoot and 1.5-pF Ci, minimizing noise injection into 16-bit ADC reference paths. | Use Scenario: Routing ECG electrode selection signals in a disposable patch monitor where board space and battery capacity are strictly constrained. IC Role / Device Role / Timing Role: Provides dual-channel signal buffering in a 1.13 mm × 0.73 mm DSBGA package, placed directly beneath ASIC die. Use Value: Reduces total solution footprint by 45% versus SC-70 alternatives, enabling thinner form factor and higher component density. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74AUP2G34DCKR | SC-70-6 package (2.15 mm × 1.85 mm); 1.1 mm height; same electrical specs | Requires ~3.5× more board area; better suited for manual assembly or prototyping | Select when DSBGA rework capability is unavailable or thermal mass requirements exceed YFP limits |
| SN74AUP2G34DSFR | X2SON-6 package (1.05 mm × 0.95 mm); 0.4 mm height; identical AUP family specs | 0.4-mm profile enables ultra-thin stacking; slightly lower thermal resistance than YFP | Select when vertical stack height is primary constraint and board-level reflow process supports X2SON |
Compared with SN74AUP2G34DCKR and SN74AUP2G34DSFR, the SN74AUP2G34YFPR offers the smallest footprint (0.83 mm²) and lowest profile (0.5 mm), making it optimal for volume production in space-limited wearable and medical devices where automated placement and fine-pitch reflow are available.
Availability
SN74AUP2G34YFPR is available at Aetrix Electronics and suitable for wearable electronics, industrial sensor nodes, and medical monitoring devices requiring stable component supply and long-term lifecycle support.
Supply support for SN74AUP2G34YFPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in power management and signal chain solutions.
The AUP logic family, including SN74AUP2G34YFPR, was designed specifically for ultra-low-power portable applications - delivering industry-leading static and dynamic power efficiency across 0.8 V to 3.6 V operation to maximize battery runtime.
FAQ
What is the maximum operating temperature for SN74AUP2G34YFPR?
The SN74AUP2G34YFPR is rated for continuous operation from –40°C to +85°C ambient temperature, verified per TI's production testing and JEDEC JESD22-A108 qualification standards. This range covers industrial control environments and automotive cabin applications, and thermal performance is validated using the YFP package's 132°C/W qJA value under standard JEDEC conditions.
Does SN74AUP2G34YFPR support 1.2-V logic systems?
Yes, SN74AUP2G34YFPR fully supports 1.2-V operation: VIH is guaranteed ≥0.78 V (0.65×VCC) and VIL ≤0.42 V (0.35×VCC) at 1.2 V supply, with tpd = 7.3 ns max (CL = 5 pF) and ICC = 0.5 mA max. Its 0.8-V minimum VCC enables seamless integration with next-generation sub-1.2-V processors.
Can SN74AUP2G34YFPR be used without external pull-up or pull-down resistors?
Yes - all unused inputs of SN74AUP2G34YFPR must be held at VCC or GND per TI's SCBA004 guidance, but no external resistors are required if connected directly. The device has no internal weak pull-ups; however, its low input leakage (<0.5 µA) and defined VIH/VIL thresholds ensure stable logic states when tied solidly to rails.
What is the recommended PCB land pattern for SN74AUP2G34YFPR's YFP package?
The recommended land pattern for SN74AUP2G34YFPR uses 0.23-mm diameter solder pads with 0.05-mm min/0.05-mm max solder mask clearance, per TI's YFP0006 mechanical drawing. A non-solder-mask-defined (NSMD) layout is preferred to ensure reliable solder joint formation on the 0.25-mm pitch ball grid.
Is SN74AUP2G34YFPR compatible with lead-free reflow profiles?
Yes, SN74AUP2G34YFPR carries a Level-1 moisture sensitivity rating and is qualified for peak reflow temperatures up to 260°C per JEDEC J-STD-020. Its SnAgCu (SAC305) ball finish and YFP package construction are fully compatible with standard lead-free reflow profiles, including ramp-soak-reflow cycles with 60-second exposure above 217°C.
SN74AUP2G34YFPR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74AUP
- Package/Case:
- 6-XFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- Push-Pull
- Current - Output High, Low:
- 4mA, 4mA
- Voltage - Supply:
- 0.8V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-DSBGA
SN74AUP2G34YFPR FAQ
1.How can I place an order for SN74AUP2G34YFPR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74AUP2G34YFPR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74AUP2G34YFPR reliable?
The price and inventory of SN74AUP2G34YFPR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74AUP2G34YFPR is usually 5 days.
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SN74AUP2G34YFPR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74AUP2G34YFPR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74AUP2G34YFPR?
For technical support, including SN74AUP2G34YFPR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74AUP2G34YFPR requirements.
6.How does Aetrix verify that SN74AUP2G34YFPR is sourced from the original manufacturer or authorized distributors?
All SN74AUP2G34YFPR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74AUP2G34YFPR meets industry standards.
7.What is the process for return or replacement of SN74AUP2G34YFPR?
All SN74AUP2G34YFPR units undergo pre-shipment inspection (PSI). If there is an issue with SN74AUP2G34YFPR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74AUP2G34YFPR part is unused and in its original packaging.
Return procedure for SN74AUP2G34YFPR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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