Texas Instruments SN74AUP2G79DCUR

Overview

SN74AUP2G79DCUR from Texas Instruments is a dual positive edge-triggered D-type flip-flop in an 8-pin VSSOP (DCU) package, operating across 0.8 V to 3.6 V supply range with 0.9 µA max static current and 4 ns max propagation delay at 3.3 V. It supports mixed-mode I/O (3.6-V tolerant), enables partial-power-down via I_off, and targets low-power point-to-point logic in portable and battery-powered systems.

For engineers reviewing the SN74AUP2G79DCUR datasheet, SN74AUP2G79DCUR pinout, SN74AUP2G79DCUR application, or SN74AUP2G79DCUR equivalent, this page delivers verified timing specs (t_su = 0.6 ns min at 3.3 V), package dimensions (2.3 mm × 2.0 mm × 0.9 mm), I_off behavior, and direct alternative part comparisons - all grounded in TI's SCES755C production data.

Technical Context

This device implements two independent D-type flip-flops, each triggered on the rising edge of CLK with setup/hold times defined down to 0.8 V supply. Its AUP-family architecture delivers ultra-low dynamic power (C_pd = 3 pF typ at 3.3 V) and input capacitance (C_i = 1.5 pF typ), enabling high-speed operation (f_max = 260 MHz at 3.3 V, C_L = 5 pF) without signal integrity degradation.

Designed for partial-power-down, the I_off circuit disables outputs when V_CC = 0 V, preventing backflow current up to ±0.2 V at I/O pins. The DCU package uses gull-wing leads with 0.65 mm pitch and exposed thermal pad - confirmed by TI's DCU0008A mechanical drawing and tape-and-reel specification (Q3 pin-1 quadrant, 3000/reel).

Key Specifications

Pinout & Package

VSSOP (DCU) package: 8-pin, gull-wing, 0.65 mm pitch, 2.3 mm × 2.0 mm body, 0.9 mm max height, exposed thermal pad (non-electrical), RoHS-compliant NiPdAu finish, MSL Level-1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual D-type flip-flop applications.

Compared with SN74LVC2G74DCUR, SN74AUP2G79DCUR reduces static power by >90% and adds I_off for safe power sequencing; versus 74AUP2G79GMHX, it trades 30% larger footprint for gull-wing solderability and broader reflow process window.

Availability

SN74AUP2G79DCUR is available at Aetrix Electronics and suitable for portable sensor hubs, industrial PLC I/O modules, and wearable health monitors requiring stable component supply, long-term lifecycle support, and guaranteed RoHS compliance.

Supply support for SN74AUP2G79DCUR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and high-reliability ICs, with over 50 years of innovation in low-power logic and precision analog design.

The AUP (Advanced Ultra-Low-Power) family, including SN74AUP2G79DCUR, was engineered specifically for battery-constrained portable electronics, delivering industry-leading static/dynamic power efficiency without compromising speed or signal integrity.

FAQ

What is the maximum clock frequency supported by SN74AUP2G79DCUR at 3.3 V?

The SN74AUP2G79DCUR supports up to 260 MHz maximum clock frequency at 3.3 V with 5 pF load capacitance, as specified in TI's SCES755C datasheet Table 7. This value drops to 240 MHz at 10 pF, 220 MHz at 15 pF, and 210 MHz at 30 pF due to increased capacitive loading - design margins must account for actual board-level C_L.

Does SN74AUP2G79DCUR support partial-power-down mode, and how is it implemented?

Yes, SN74AUP2G79DCUR supports partial-power-down via its I_off circuitry. When V_CC = 0 V, I_off limits input/output leakage to ≤0.6 µA (max) across –0.2 V to 3.6 V pin voltage range, preventing damaging back-current flow. This is validated per JESD 78 Class II latch-up testing and enables safe hot-swap in modular systems.

What are the exact physical dimensions and thermal characteristics of the SN74AUP2G79DCUR DCU package?

The SN74AUP2G79DCUR uses the VSSOP (DCU) package: 2.30 mm × 2.00 mm body size, 0.9 mm max height, 0.65 mm lead pitch, and 8 gull-wing leads. Its θ_JA is 220°C/W (JEDEC standard board), and it features an exposed thermal pad (non-electrical) aligned with TI's DCU0008A mechanical drawing and tape-and-reel spec (Q3 pin-1 orientation).

Can SN74AUP2G79DCUR interface directly with 5-V logic systems?

No, SN74AUP2G79DCUR is not 5-V tolerant: its absolute maximum input voltage is 4.6 V, and recommended operation caps at 3.6 V I/O tolerance. Direct connection to 5-V outputs risks damage. For 5-V system interfacing, use a level translator such as TXB0102 or discrete resistor-divider networks validated for signal integrity.

How does the setup time (t_su) of SN74AUP2G79DCUR vary with supply voltage?

t_su tightens with increasing V_CC: at 3.3 V it is 0.6 ns (min), at 2.5 V it is 0.7 ns, at 1.8 V it is 0.9 ns, and at 1.2 V it is 1.8 ns. These values assume C_L = 5 pF and are measured from input transition (10%–90%) to CLK↑ (50%). Designs operating below 1.8 V must verify timing closure with worst-case process/voltage/temperature corners.