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Texas Instruments SN74AUP3G17RSER

Part No.:
SN74AUP3G17RSER
Manufacturer:
Texas Instruments
Category:
Buffers, Drivers, Receivers, Transceivers
Package:
8-UFQFN
Datasheet:
AetrixSN74AUP3G17RSER.pdf
Description:
IC BUFFER NON-INVERT 3.6V 8UQFN
Quantity:
Payment:
Payment
Shipping:
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Inventory:760

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Product details

Overview

SN74AUP3G17RSER from Texas Instruments is a low-power triple Schmitt-trigger buffer IC in an 8-pin UQFN (RSE) package, operating from 0.8 V to 3.6 V supply. It delivers 5.1 ns maximum propagation delay at 3.3 V, 4.3 pF typical dynamic power dissipation, and 0.9 μA max static current-enabling robust signal conditioning in battery-powered portable interfaces.

For engineers reviewing the SN74AUP3G17RSER datasheet, SN74AUP3G17RSER pinout, SN74AUP3G17RSER application, or SN74AUP3G17RSER equivalent, key selection criteria include its Schmitt-trigger hysteresis (ΔVT = 0.79–1.31 V), Ioff partial-power-down support, 3.6-V I/O tolerance for mixed-voltage systems, and ultra-low input capacitance (1.5 pF).

Technical Context

The SN74AUP3G17RSER implements three independent non-inverting Schmitt-trigger buffers with asymmetric input thresholds: VT+ ranges from 0.3 V to 2.29 V and VT− from 0.1 V to 1.24 V across the 0.8–3.6 V VCC range. Its hysteresis (ΔVT) scales with supply voltage, ensuring noise immunity in noisy digital environments.

Designed for point-to-point signaling, it features Ioff circuitry that disables outputs during partial power-down, preventing backflow current when VCC = 0 V. Input clamp current is rated ±50 mA, and output drive capability reaches ±4 mA at 3 V, supporting direct interfacing with standard CMOS loads.

Key Specifications

ParameterValue and Actual Design Meaning
VCC Range0.8 V to 3.6 V - enables operation across ultra-low-voltage microcontrollers and mixed-signal SoCs.
tpd Max5.1 ns at 3.3 V, CL = 15 pF - ensures timing-critical signal buffering without pipeline latency penalties.
ICC Max0.9 μA at TA = –40°C to 85°C - extends battery life in always-on sensor nodes and wearables.
Cpd Typ4.3 pF at 3.3 V - minimizes dynamic switching power in high-frequency clock/data paths.
ΔVT0.79–1.31 V (VCC = 3 V) - provides robust noise margin against EMI and ground bounce in compact PCB layouts.
Ioff0.6 μA max at VCC = 0 V - allows safe hot-insertion and multi-rail power sequencing without external isolation.
Ci Typ1.5 pF - reduces capacitive loading on preceding drivers, preserving signal edge rate integrity.

Pinout & Package

SN74AUP3G17RSER uses an 8-pin UQFN (RSE) package with wettable flank leads, 1.55 mm × 1.55 mm body, 0.4 mm pitch, and exposed thermal pad. Pin 1 is located at top-left corner (quadrant Q2 per tape orientation), with solder mask-defined land pattern recommended.

Pin/TerminalCircuit RoleDesign Meaning
1VCCPrimary power supply input - must be decoupled locally with 0.1 μF ceramic capacitor to GND.
21AInput of Buffer 1 - Schmitt-trigger threshold enables clean signal restoration from slow or noisy sources.
32AInput of Buffer 2 - electrically isolated from other inputs; supports independent signal conditioning paths.
4GNDDigital ground reference - connected to exposed thermal pad for thermal and EMI performance.
51YOutput of Buffer 1 - non-inverting, rail-to-rail swing, compatible with 3.6-V tolerant logic families.
63AInput of Buffer 3 - shares same electrical characteristics as 1A/2A; no internal crosstalk.
72YOutput of Buffer 2 - driven only when VCC is active; Ioff disables output if VCC = 0 V.
83YOutput of Buffer 3 - identical drive strength and timing to 1Y/2Y; supports parallel fanout.

Key Features

FeatureDesign Value
Schmitt-trigger inputsVT+ and VT− thresholds provide ≥0.79 V hysteresis at 3 V, eliminating contact bounce and EMI-induced glitches in pushbutton or encoder interfaces.
Ioff partial-power-downOutputs enter high-impedance state when VCC = 0 V, enabling safe backplane hot-swap and multi-supply domain isolation without external MOSFETs.
3.6-V I/O toleranceInputs accept up to 3.6 V regardless of VCC level (down to 0.8 V), simplifying level translation between 1.8-V logic and 3.3-V peripherals.
Ultra-low Ci (1.5 pF)Minimizes capacitive loading on source drivers, preserving rise/fall times in high-speed data lines like I²C or SPI control signals.
NanoStar™-compatible footprintRSE package matches TI's NanoStar™ layout guidelines, enabling drop-in replacement with YFP DSBGA variants in space-constrained designs.

Applications

Industrial Sensor InterfacePortable Device Power Sequencing

Use Scenario: Conditioning analog switch or mechanical encoder outputs before ADC sampling in battery-powered condition monitoring units.

IC Role / Device Role / Timing Role: Triple Schmitt-trigger buffer restores marginal logic edges and rejects noise induced by long traces or shared ground planes.

Use Value: Eliminates need for external RC filters or comparator circuits, reducing BOM count and PCB area while maintaining <100 ns timing margin.

Use Scenario: Enabling/disabling power rails in wearable health monitors using MCU GPIOs with weak drive strength.

IC Role / Device Role / Timing Role: Signal repeater and level shifter between 1.8-V MCU I/O and 3.3-V PMIC enable inputs.

Use Value: Ioff prevents backfeed during sleep mode; 3.6-V tolerant inputs allow direct connection to PMIC without level translators.

USB-C Port Controller SupportIoT Edge Node Wake-Up Logic

Use Scenario: Debouncing CC line detection signals and buffering VCONN enable commands in USB-C receptacle circuits.

IC Role / Device Role / Timing Role: Noise-immune buffer isolating Type-C controller from noisy cable insertion transients.

Use Value: ΔVT > 0.8 V ensures reliable detection despite ±200 mV common-mode noise on CC pins; low ICC extends standby time.

Use Scenario: Waking ultra-low-power MCUs from deep sleep via external interrupt sources (e.g., PIR motion sensors).

IC Role / Device Role / Timing Role: Schmitt-trigger front-end converting slow-rising sensor outputs into clean MCU wake-up pulses.

Use Value: 0.9 μA ICC allows continuous monitoring without compromising weeks-long battery life; hysteresis prevents false triggers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schmitt-trigger buffer applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SN74LVC3G17RSERHigher ICC (max 10 μA), wider VCC range (1.65–5.5 V), no Ioff, lower hysteresis (ΔVT ≈ 0.3 V at 3.3 V)Not suitable for partial-power-down or sub-1-V operation; better for 5-V legacy systemsChoose when interfacing with 5-V logic and power sequencing is not required.
SN74AUP2G17RSERDual-channel version, identical electrical specs, 6-pin UQFN package, no pin compatibility with SN74AUP3G17RSERReduces channel count but requires PCB redesign; saves ~0.5 mm² board areaChoose when only two buffered channels are needed and layout revision is acceptable.

Compared with SN74LVC3G17RSER, SN74AUP3G17RSER offers 11× lower static current and Ioff support for power-gated systems; versus SN74AUP2G17RSER, it adds a third channel without increasing package size-critical for space-constrained IoT sensor hubs.

Availability

SN74AUP3G17RSER is available at Aetrix Electronics and suitable for industrial sensor interfaces, portable device power sequencing, USB-C port controller support, and IoT edge node wake-up logic requiring stable component supply and long-term lifecycle assurance.

Supply support for SN74AUP3G17RSER includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 90 years of innovation in power management and signal chain solutions.

The AUP family-including SN74AUP3G17RSER-is engineered for ultra-low-power portable electronics, delivering industry-leading static and dynamic power efficiency across 0.8–3.6 V operation while maintaining signal integrity and system-level robustness.

FAQ

What is the absolute maximum supply voltage rating for SN74AUP3G17RSER?

The absolute maximum VCC rating for SN74AUP3G17RSER is 4.6 V. Exceeding this voltage-even momentarily-may cause permanent damage. The device is fully specified for operation from 0.8 V to 3.6 V, and its 3.6-V I/O tolerance allows inputs to safely reach 3.6 V regardless of VCC level, making it ideal for mixed-voltage signal routing in modern portable designs.

Does SN74AUP3G17RSER support partial-power-down operation, and how does it behave when VCC = 0 V?

Yes, SN74AUP3G17RSER supports partial-power-down via its Ioff feature. When VCC = 0 V, the outputs enter a high-impedance state with leakage current ≤0.6 μA, preventing damaging current backflow from live inputs or outputs. This behavior is explicitly characterized in the datasheet and enables safe hot-plug operation in modular systems where subsystems power up/down independently.

What is the typical input hysteresis (ΔVT) of SN74AUP3G17RSER at 3.3 V supply, and why does it matter?

At VCC = 3.3 V, the typical input hysteresis ΔVT of SN74AUP3G17RSER is 1.05 V (VT+ = 2.29 V, VT− = 1.24 V). This wide hysteresis suppresses noise-induced false triggering on slow-rising signals such as those from mechanical switches, thermistors, or long PCB traces-eliminating the need for external RC filtering and improving system reliability in electrically noisy environments.

Can SN74AUP3G17RSER be used as a level translator between 1.8-V and 3.3-V logic domains?

Yes, SN74AUP3G17RSER functions as a unidirectional level translator: its inputs tolerate up to 3.6 V regardless of VCC, and its outputs swing rail-to-rail between GND and VCC. When powered at 1.8 V, it accepts 3.3-V inputs and outputs clean 1.8-V logic levels-ideal for interfacing 3.3-V sensors with 1.8-V MCUs without external translators or resistive dividers.

What is the recommended PCB land pattern for the RSE package of SN74AUP3G17RSER?

The RSE package of SN74AUP3G17RSER requires a solder-mask-defined land pattern with 0.35 mm × 0.35 mm pads (6×), 0.25 mm × 0.25 mm pads (4×), and a 1.35 mm × 1.3 mm exposed thermal pad. TI recommends non-solder-mask-defined (NSMD) copper for the thermal pad to ensure optimal thermal transfer and solder joint reliability during reflow.

SN74AUP3G17RSER Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74AUP
Package/Case:
8-UFQFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
Logic Type:
Buffer, Non-Inverting
Number of Elements:
3
Number of Bits per Element:
1
Input Type:
Schmitt Trigger
Output Type:
Push-Pull
Current - Output High, Low:
4mA, 4mA
Voltage - Supply:
0.8V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-UQFN (1.5x1.5)

SN74AUP3G17RSER FAQ

1.How can I place an order for SN74AUP3G17RSER through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74AUP3G17RSER on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SN74AUP3G17RSER reliable?

The price and inventory of SN74AUP3G17RSER are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74AUP3G17RSER is usually 5 days.

3.What payment methods are accepted for SN74AUP3G17RSER?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74AUP3G17RSER transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SN74AUP3G17RSER?

SN74AUP3G17RSER orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SN74AUP3G17RSER order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74AUP3G17RSER?

For technical support, including SN74AUP3G17RSER datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74AUP3G17RSER requirements.

6.How does Aetrix verify that SN74AUP3G17RSER is sourced from the original manufacturer or authorized distributors?

All SN74AUP3G17RSER products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74AUP3G17RSER meets industry standards.

7.What is the process for return or replacement of SN74AUP3G17RSER?

All SN74AUP3G17RSER units undergo pre-shipment inspection (PSI). If there is an issue with SN74AUP3G17RSER, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74AUP3G17RSER part is unused and in its original packaging.

Return procedure for SN74AUP3G17RSER:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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