Texas Instruments SN74AUP3G17YFPR

Overview

SN74AUP3G17YFPR from Texas Instruments is a low-power triple Schmitt-trigger buffer IC in an 8-ball DSBGA (YFP) package, operating from 0.8 V to 3.6 V supply. It delivers 5.1 ns max propagation delay at 3.3 V, 1.5 pF typical input capacitance, and 0.9 µA max static current-enabling robust noise immunity and ultra-low power in battery-powered sensor interfaces and portable logic conditioning.

For engineers reviewing the SN74AUP3G17YFPR datasheet, SN74AUP3G17YFPR pinout, SN74AUP3G17YFPR application, or SN74AUP3G17YFPR equivalent, key selection criteria include its Schmitt-trigger hysteresis (ΔVT = 0.79 V typ at 3 V), Ioff support for partial-power-down mode, and 3.6-V I/O tolerance for mixed-voltage signal translation between 1.8-V and 3.3-V domains.

Technical Context

The SN74AUP3G17YFPR implements three independent non-inverting Schmitt-trigger buffers with asymmetric input thresholds (VT+ = 2.29 V, VT– = 1.24 V at 3 V), enabling reliable signal cleanup of slow or noisy digital inputs. Its AUP family architecture minimizes both static (ICC ≤ 0.9 µA) and dynamic (Cpd = 4.3 pF) power consumption across the full 0.8–3.6 V VCC range.

Designed for point-to-point routing, it features Ioff circuitry that disables outputs during power-down to prevent backflow current, and supports 3.6-V tolerant I/O even when VCC = 0.8 V-critical for level-shifting in multi-rail embedded systems without external translators.

Key Specifications

Pinout & Package

SN74AUP3G17YFPR uses an 8-ball DSBGA (YFP) package with 0.4-mm pitch, 0.5-mm max height, and solder-bump-defined pin 1 identifier (• = Pb-free). Ball layout follows standard YFP top-view orientation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schmitt-trigger buffer applications.

Compared with SN74LVC3G17DCUR and SN74AUP2G17DQER, SN74AUP3G17YFPR uniquely balances ultra-low power (0.9 µA), triple-channel integration, and Ioff-enabled power-gating-making it optimal for miniaturized, battery-operated systems requiring three independent noise-immune signal paths.

Availability

SN74AUP3G17YFPR is available at Aetrix Electronics and suitable for industrial sensor interfaces, portable medical device logic, and IoT edge node power management requiring stable component supply and long-term lifecycle support.

Supply support for SN74AUP3G17YFPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 90 years of innovation in power efficiency and signal integrity.

The AUP logic family-including SN74AUP3G17YFPR-is engineered specifically for ultra-low-power portable and battery-operated applications, delivering industry-leading static/dynamic power reduction without sacrificing speed or noise immunity.

FAQ

What is the maximum propagation delay of SN74AUP3G17YFPR at 3.3 V?

The maximum propagation delay (tpd) of SN74AUP3G17YFPR is 5.1 ns at VCC = 3.3 V ± 0.3 V with CL = 15 pF and TA = –40°C to 85°C. This value is guaranteed across the full operating temperature range and reflects worst-case timing for design margining in real-world conditions. SN74AUP3G17YFPR achieves this performance while maintaining sub-1-µA static current-unlike competing families that trade speed for power.

Does SN74AUP3G17YFPR support partial-power-down operation?

Yes, SN74AUP3G17YFPR includes Ioff circuitry that disables all three outputs and blocks current flow when VCC = 0 V, even if inputs or outputs are driven to voltages up to 3.6 V. This feature is explicitly tested and guaranteed per JESD 78 Class II latch-up standards. SN74AUP3G17YFPR's Ioff specification ensures safe integration into multi-rail systems where subsystems power down independently.

What is the input hysteresis (ΔVT) of SN74AUP3G17YFPR at 3 V supply?

At VCC = 3 V, SN74AUP3G17YFPR provides a typical input hysteresis (ΔVT = VT+ – VT–) of 0.79 V, with a guaranteed minimum of 0.79 V and maximum of 1.31 V across temperature. This wide hysteresis window rejects noise spikes up to ±395 mV, making SN74AUP3G17YFPR ideal for conditioning mechanical switch inputs or slow-rising sensor outputs without external filtering components.

Can SN74AUP3G17YFPR operate below 1.0 V?

Yes, SN74AUP3G17YFPR is fully specified from 0.8 V to 3.6 V VCC, including functional operation, timing, and electrical characteristics at 0.8 V. At this minimum voltage, it delivers tpd ≤ 14.6 ns (CL = 5 pF), ICC ≤ 0.5 µA, and VT+ = 0.3 V min-enabling direct integration with emerging ultra-low-voltage microcontrollers and energy-harvesting systems. SN74AUP3G17YFPR maintains Schmitt behavior across the entire range.

What package type does SN74AUP3G17YFPR use, and what are its dimensions?

SN74AUP3G17YFPR uses the YFP package: an 8-ball DSBGA (Die Size Ball Grid Array) with 0.4-mm ball pitch, 1.2 mm × 1.2 mm body size, and 0.5-mm maximum height. The package employs Pb-free SnAgCu solder bumps and conforms to JEDEC MO-287. Its NanoStar™ construction places the die directly under the solder balls, minimizing parasitic inductance and thermal resistance-key for SN74AUP3G17YFPR's low-noise, high-density deployment.