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Texas Instruments SN74AUP3G34DCUR
- Part No.:
- SN74AUP3G34DCUR
- Manufacturer:
- Texas Instruments
- Package:
- 8-VFSOP (0.091", 2.30mm Width)
- Datasheet:
-
SN74AUP3G34DCUR.pdf
- Description:
- IC BUFFER NON-INVERT 3.6V 8VSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:6,201
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Product details
Overview
SN74AUP3G34DCUR from Texas Instruments is a triple non-inverting buffer gate in VSSOP-8 (DCU) package, optimized for 0.8 V to 3.6 V operation with ultra-low static current (≤0.9 µA), 4.3 ns max propagation delay at 3.3 V, and 1.5 pF typical input capacitance. It enables signal integrity–critical point-to-point buffering in portable battery-powered systems.
For engineers reviewing the SN74AUP3G34DCUR datasheet, SN74AUP3G34DCUR pinout, SN74AUP3G34DCUR application, or SN74AUP3G34DCUR equivalent, key selection criteria include Ioff-enabled partial-power-down support, 3.6-V I/O tolerance for mixed-voltage interfacing, and sub-5 ns timing performance across 0.8–3.6 V supply range.
Technical Context
The SN74AUP3G34DCUR implements three independent positive-logic buffers (Y = A) with rail-to-rail output swing and guaranteed monotonic switching. Its AUP logic family uses advanced CMOS process to achieve sub-1 µA ICC across full VCC range while maintaining robust noise margins (VIH/VIL thresholds scale with VCC).
Each buffer supports Ioff circuitry that disables outputs during power-down, preventing backflow current when VCC = 0 V. Input clamping diodes and JESD 78 Class II latch-up immunity (>100 mA) ensure reliability in dynamic system-level power sequencing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 0.8 V to 3.6 V - Enables direct interface with 1.2 V, 1.8 V, 2.5 V, and 3.3 V logic domains without level shifters. |
| tpd (max) | 4.3 ns at 3.3 V, CL = 15 pF - Supports >100 MHz signal routing in compact PCB layouts with minimal skew. |
| ICC (max) | 0.9 µA at TA = 25°C - Extends battery life in always-on sensor nodes and wearable devices by minimizing quiescent drain. |
| Ioff Current | 0.6 µA max at VCC = 0 V - Allows safe hot-insertion and partial power-down of subsystems without damaging current paths. |
| Input Capacitance | 1.5 pF typical - Reduces loading on high-impedance drivers (e.g., crystal oscillators, ADC references) and preserves signal edge rate. |
| IOH/IOL | ±4 mA at VCC = 3 V - Drives standard CMOS loads (e.g., 10–15 pF traces + gate inputs) with <0.5 V VOL/VOH margin under worst-case conditions. |
| ESD Rating | 2000-V HBM, 1000-V CDM - Meets industrial-grade robustness requirements without external protection components. |
Pinout & Package
VSSOP-8 (DCU) package: 2.0 mm × 1.25 mm body, 0.5 mm lead pitch, exposed thermal pad, RoHS-compliant NiPdAu finish, MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (1A) | Input of Buffer 1 | CMOS-compatible input accepting 0–3.6 V; VIH/VIL thresholds scale with VCC per JEDEC JESD8-12. |
| 2 (2A) | Input of Buffer 2 | Independent input with same electrical characteristics as Pin 1; no internal crosstalk coupling. |
| 3 (3A) | Input of Buffer 3 | Electrically isolated input; supports asynchronous enable/disable of individual channels via upstream logic. |
| 4 (GND) | Ground Reference | Common return path for all three buffers; must be low-inductance connection to minimize ground bounce. |
| 5 (VCC) | Power Supply | Single-supply rail powering all buffers; decoupling capacitor (0.1 µF ceramic) required within 2 mm. |
| 6 (1Y) | Output of Buffer 1 | Non-inverting buffered output; capable of driving 15 pF load with ≤4.3 ns tpd at 3.3 V. |
| 7 (2Y) | Output of Buffer 2 | Independent output with identical timing and drive strength to Pin 6; supports parallel fanout. |
| 8 (3Y) | Output of Buffer 3 | Final buffered output; maintains signal integrity even when other outputs switch simultaneously. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low static power | 0.9 µA max ICC enables multi-year battery operation in IoT endpoint sensors and medical wearables. |
| Ioff partial-power-down | Outputs enter high-impedance state with VCC = 0 V, allowing safe board-level power gating without signal contention. |
| 3.6-V I/O tolerance | Accepts 3.6 V inputs at VCC = 1.8 V - eliminates external level translators when interfacing with legacy 3.3 V peripherals. |
| Low-noise switching | Overshoot/undershoot <10% of VCC minimizes EMI in RF-sensitive applications like Bluetooth LE modules and NFC readers. |
| Wide temperature range | –40°C to +85°C operation supports automotive cabin electronics, industrial PLC I/O modules, and outdoor telemetry units. |
Applications
| Portable Medical Sensors | Industrial PLC I/O Modules |
|---|---|
|
Use Scenario: Signal conditioning chain in a handheld pulse oximeter where analog front-end outputs feed multiple ADCs and microcontroller GPIOs. IC Role / Device Role / Timing Role: Triple buffer isolates sensitive analog signals from digital switching noise while preserving rise/fall times for accurate sampling. Use Value: 1.5 pF input capacitance prevents loading of op-amp outputs; 4.3 ns tpd ensures synchronization across three parallel data paths. |
Use Scenario: Digital input conditioning in a DIN-rail mounted PLC module receiving 24 V DC field signals via optocouplers. IC Role / Device Role / Timing Role: Level-shifting and fanout buffer converting optocoupler outputs to clean 3.3 V logic for FPGA configuration pins. Use Value: 3.6-V tolerant inputs accept up to 24 V transient spikes; Ioff prevents backfeed into powered-down FPGA banks. |
| Wireless Sensor Node Baseband | Automotive Infotainment Interface |
|
Use Scenario: Interfacing low-power MCU GPIOs to BLE SoC control lines (RESET, WAKE, IRQ) in a battery-operated environmental monitor. IC Role / Device Role / Timing Role: Signal integrity-preserving buffer ensuring reliable wake-up signaling between heterogeneous voltage domains (1.8 V MCU ↔ 3.3 V radio). Use Value: 0.8–3.6 V VCC range allows direct 1.8 V supply; 0.9 µA ICC extends 10-year battery life target. |
Use Scenario: Isolating CAN transceiver status lines (TXD/RXD) from infotainment head unit processor during sleep mode transitions. IC Role / Device Role / Timing Role: Directional buffer enabling bidirectional CAN line monitoring while supporting controlled power-down sequencing. Use Value: Ioff blocks reverse current when CAN PHY remains active but host processor enters deep sleep; –40°C to +85°C rating meets AEC-Q100 ambient requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar triple buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC3G34DCUR | Higher ICC (10 µA typ), faster tpd (2.5 ns @ 3.3 V), but no Ioff or 0.8 V operation. | Suitable for high-speed digital boards where power is not constrained and full power-down isolation is unnecessary. | Select when speed >150 MHz timing closure is critical and VCC ≥1.65 V is guaranteed. |
| 74AHC3G34GW,125 | Wider VCC (2–5.5 V), higher drive (±8 mA), but larger SO8 package and no Ioff. | Better for legacy 5 V systems or high-current loads; incompatible with sub-1 V logic or space-constrained layouts. | Choose for industrial control panels requiring 5 V compatibility and higher noise immunity, not for portable battery designs. |
Compared with SN74LVC3G34DCUR and 74AHC3G34GW,125, the SN74AUP3G34DCUR uniquely balances ultra-low power, wide voltage scalability, and Ioff safety-making it the only option for energy-harvesting sensors and dynamically powered automotive subsystems.
Availability
SN74AUP3G34DCUR is available at Aetrix Electronics and suitable for portable medical sensors, industrial PLC I/O modules, wireless sensor node baseband, and automotive infotainment interface requiring stable component supply across extended temperature and voltage ranges.
Supply support for SN74AUP3G34DCUR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in power efficiency and signal integrity.
The SN74AUP3G34DCUR belongs to TI's AUP (Advanced Ultra-Low-Power) logic family, engineered specifically for battery-powered portable electronics demanding sub-microamp quiescent current and robust mixed-voltage interoperability.
FAQ
What is the maximum operating frequency supported by SN74AUP3G34DCUR?
The SN74AUP3G34DCUR does not specify a maximum clock frequency, as it is a combinational buffer-not a clocked device. Its usable signal bandwidth is determined by propagation delay and load capacitance: at 3.3 V with 15 pF load, tpd ≤4.3 ns supports clean edge transmission up to ~100 MHz for single-shot pulses or burst-mode data. For sustained high-frequency toggling, thermal limits and dynamic power (Cpd = 4.3 pF) govern practical duty-cycle constraints.
Does SN74AUP3G34DCUR support level translation between different VCC domains?
Yes, SN74AUP3G34DCUR supports mixed-voltage interfacing: its inputs tolerate up to 3.6 V regardless of VCC (e.g., 3.3 V input accepted at VCC = 1.8 V), and outputs swing rail-to-rail. This enables unidirectional level shifting without external components-ideal for connecting 3.3 V peripherals to 1.8 V MCUs. However, it does not provide bidirectional translation or voltage regulation.
Can SN74AUP3G34DCUR be used in partial-power-down systems?
Yes, SN74AUP3G34DCUR includes Ioff circuitry that disables all outputs when VCC = 0 V, limiting Ioff current to ≤0.6 µA. This prevents damaging backflow current from live signal lines into a powered-down subsystem-a critical feature for hot-swap interfaces, modular battery packs, and automotive domain controllers with independent power domains.
What is the recommended PCB layout practice for SN74AUP3G34DCUR's thermal pad?
Although the VSSOP-8 (DCU) package has no exposed thermal pad, SN74AUP3G34DCUR requires a solid GND plane beneath Pins 4 (GND) and 5 (VCC) with short, wide traces. Place a 0.1 µF X7R ceramic decoupling capacitor ≤2 mm from Pin 5, and route all three inputs (Pins 1–3) away from noisy digital traces. Avoid vias in signal paths to preserve 1.5 pF input capacitance advantage.
How does SN74AUP3G34DCUR compare to standard 74AUP1G34 in terms of integration and footprint?
SN74AUP3G34DCUR integrates three independent buffers in one VSSOP-8 package (2.0 × 1.25 mm), whereas three discrete SN74AUP1G34 units would occupy ~3× the area (each in SC70-5). The triple-gate design reduces BOM count, assembly cost, and routing congestion-especially valuable in space-constrained wearables and miniaturized industrial sensors where board real estate is premium.
SN74AUP3G34DCUR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74AUP
- Package/Case:
- 8-VFSOP (0.091", 2.30mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 3
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- Push-Pull
- Current - Output High, Low:
- 4mA, 4mA
- Voltage - Supply:
- 0.8V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-VSSOP
SN74AUP3G34DCUR FAQ
1.How can I place an order for SN74AUP3G34DCUR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74AUP3G34DCUR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74AUP3G34DCUR reliable?
The price and inventory of SN74AUP3G34DCUR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74AUP3G34DCUR is usually 5 days.
3.What payment methods are accepted for SN74AUP3G34DCUR?
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4.How is shipping managed for SN74AUP3G34DCUR?
SN74AUP3G34DCUR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74AUP3G34DCUR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74AUP3G34DCUR?
For technical support, including SN74AUP3G34DCUR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74AUP3G34DCUR requirements.
6.How does Aetrix verify that SN74AUP3G34DCUR is sourced from the original manufacturer or authorized distributors?
All SN74AUP3G34DCUR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74AUP3G34DCUR meets industry standards.
7.What is the process for return or replacement of SN74AUP3G34DCUR?
All SN74AUP3G34DCUR units undergo pre-shipment inspection (PSI). If there is an issue with SN74AUP3G34DCUR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74AUP3G34DCUR part is unused and in its original packaging.
Return procedure for SN74AUP3G34DCUR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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