Texas Instruments SN74AUP3G34YFPR
- Part No.:
- SN74AUP3G34YFPR
- Manufacturer:
- Texas Instruments
- Package:
- 8-XFBGA, DSBGA
- Datasheet:
-
SN74AUP3G34YFPR.pdf
- Description:
- IC BUF NON-INVERT 3.6V 8DSBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SN74AUP3G34YFPR from Texas Instruments is a low-power triple non-inverting buffer gate in an 8-ball DSBGA (YFP) package, operating across 0.8 V to 3.6 V supply range, delivering 4.3 ns max propagation delay at 3.3 V with 4.3 pF typical dynamic power dissipation and 0.9 µA max static ICC - optimized for battery-powered portable logic interfacing.
For engineers reviewing the SN74AUP3G34YFPR datasheet, SN74AUP3G34YFPR pinout, SN74AUP3G34YFPR application, or SN74AUP3G34YFPR equivalent, this page provides verified functional identity, YFP-package–specific terminal mapping, Ioff-enabled partial-power-down capability, and validated alternatives for point-to-point signal buffering in ultra-low-power systems.
Technical Context
The SN74AUP3G34YFPR implements three independent positive-logic buffers (Y = A) with rail-to-rail input compatibility and 3.6-V tolerant I/Os, enabling mixed-voltage domain interfacing. Its AUP-family architecture delivers sub-1-µA static current across full VCC range and supports Ioff isolation during partial power-down.
Signal integrity is maintained via low input capacitance (1.5 pF typ), low output overshoot/undershoot (<10% of VCC), and latch-up immunity exceeding 100 mA per JESD 78 Class II - critical for noise-sensitive portable and wearable applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 0.8 V to 3.6 V - enables direct interface with 0.9-V, 1.2-V, 1.8-V, 2.5-V, and 3.3-V logic domains without level shifters. |
| tpd (Max) | 4.3 ns at 3.3 V, CL = 15 pF - ensures timing-critical signal routing in high-speed digital subsystems with minimal latency. |
| ICC (Max) | 0.9 µA at TA = 25°C - extends battery life in always-on sensor nodes and IoT edge devices by minimizing quiescent drain. |
| Ioff Support | Active at VCC = 0 V - prevents backflow current when powered down, allowing safe hot-insertion and multi-rail sequencing. |
| Input Capacitance | 1.5 pF typical - reduces loading on preceding drivers and preserves signal edge rates in high-impedance or long-trace paths. |
| Output Drive | ±4 mA at 3.0 V - sufficient for driving one standard CMOS load or short PCB traces without external buffering. |
| ESD Rating | 2000-V HBM, 1000-V CDM - meets industrial-grade robustness requirements for handheld and field-deployable equipment. |
Pinout & Package
SN74AUP3G34YFPR uses an 8-ball DSBGA (NanoStar™ YFP) package with 0.4-mm pitch, 1.2 mm × 1.2 mm body, and solder-bump-defined terminals. Pin 1 is identified by a distinct bump composition marker (• = Pb-free).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 (Pin 1) | 1A Input | First buffer input; accepts 0.8–3.6 V logic levels and tolerates up to 4.6 V transient voltage. |
| A2 (Pin 2) | 1Y Output | Non-inverted output of first buffer; drives downstream loads with ±4 mA capability at 3 V. |
| B1 (Pin 3) | 2A Input | Second buffer input; electrically isolated from other inputs; supports independent signal routing. |
| B2 (Pin 4) | 2Y Output | Non-inverted output of second buffer; shares same VCC/GND rails but no internal coupling. |
| C1 (Pin 5) | 3A Input | Third buffer input; fully compatible with 0.8-V minimum VCC operation and Ioff shutdown mode. |
| C2 (Pin 6) | 3Y Output | Non-inverted output of third buffer; maintains <10% VCC overshoot/undershoot under fast switching. |
| D1 (Pin 7) | GND | Ground reference for all logic and I/O circuits; must be connected to system ground plane for EMI control. |
| D2 (Pin 8) | VCC | Supply rail for all buffers; decoupling capacitor (≥100 nF) required within 2 mm of this ball for stable operation. |
Key Features
| Feature | Design Value |
|---|---|
| NanoStar™ DSBGA packaging | 1.2 mm × 1.2 mm footprint with 0.4-mm pitch - enables ultra-compact layout in space-constrained wearables and medical sensors. |
| Wide VCC range (0.8–3.6 V) | Eliminates need for external voltage translators when interfacing between legacy and modern low-voltage SoCs. |
| Ioff partial-power-down | Disables outputs and blocks current flow when VCC = 0 V - essential for multi-supply domain power gating. |
| Low dynamic power (Cpd = 4.3 pF) | Reduces switching energy consumption by >50% vs. older AUC/AHC families at 3.3 V, lowering thermal load. |
| 3.6-V I/O tolerance | Allows safe connection to 3.3-V peripherals even when operating at 1.8-V VCC - simplifies mixed-signal board design. |
Applications
| Mobile Sensor Hub Interface | Wearable Biometric Signal Routing |
|---|---|
Use Scenario: Isolating and buffering I²C/SPI signals between ultra-low-power MCU and multiple analog sensor ICs in a smartwatch. IC Role / Device Role / Timing Role: Triple buffer provides independent, low-noise signal path conditioning for accelerometer, gyroscope, and heart-rate monitor interfaces. Use Value: Enables simultaneous sensor polling with sub-5 ns propagation delay and zero cross-talk between channels under 1.8-V operation. |
Use Scenario: Driving LED indicators and status lines from a 0.9-V BLE SoC while maintaining compatibility with 3.3-V display controller logic. IC Role / Device Role / Timing Role: Level-shifting buffer stage that translates sub-1-V logic outputs to 3.3-V-compatible drive strength without external components. Use Value: Achieves mixed-voltage interoperability using only the SN74AUP3G34YFPR's 3.6-V tolerant I/Os and 0.8-V minimum VCC support. |
| IoT Edge Node Power-Gated Logic | Portable Diagnostic Instrument Data Path |
Use Scenario: Enabling/disabling communication lines to external modems or radios during sleep cycles in battery-operated environmental monitors. IC Role / Device Role / Timing Role: Ioff-enabled buffer isolates active circuitry from powered-down subsystems, preventing leakage-induced wakeups. Use Value: Reduces system standby current by blocking backflow paths, extending operational life beyond 12 months on coin-cell batteries. |
Use Scenario: Conditioning parallel data bus signals between a 1.2-V FPGA and legacy 3.3-V ADC/DAC modules in handheld test equipment. IC Role / Device Role / Timing Role: High-fidelity signal repeater preserving rise/fall times and minimizing jitter accumulation across multi-stage digital paths. Use Value: Maintains <10% VCC overshoot/undershoot and 1.5 pF input capacitance to prevent signal degradation in precision measurement chains. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar triple buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC3G34DCUR | Higher ICC (max 10 µA), wider tpd range (2.5–7.5 ns), 1.65–5.5 V VCC range, VSSOP-8 package. | Supports 5-V systems and higher-speed interfaces but consumes ~11× more static power than SN74AUP3G34YFPR. | Select when 5-V compatibility or legacy board reuse is required; avoid for sub-µA battery lifetime targets. |
| SN74AUP2G34YFPR | Dual (not triple) buffer, identical AUP family specs, same YFP-8 package and 0.8–3.6 V operation. | Provides two independent buffers instead of three - suitable only where channel count reduction is acceptable. | Choose when system requires exactly two buffered paths and board area is constrained; verify pinout alignment before substitution. |
Compared with SN74LVC3G34DCUR, SN74AUP3G34YFPR delivers 90% lower static current and smaller footprint, while SN74AUP2G34YFPR trades one buffer channel for identical ultra-low-power performance in the same package.
Availability
SN74AUP3G34YFPR is available at Aetrix Electronics and suitable for mobile sensor hubs, wearable biometric interfaces, and IoT edge node power-gated logic requiring stable component supply with guaranteed long-term manufacturability.
Supply support for SN74AUP3G34YFPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in power-efficient silicon solutions.
The AUP logic family - including SN74AUP3G34YFPR - was designed specifically for ultra-low-power portable electronics, prioritizing nanowatt static consumption, wide VCC scalability, and miniature packaging without sacrificing signal integrity.
FAQ
What is the maximum propagation delay of SN74AUP3G34YFPR at 3.3 V?
The maximum propagation delay (tpd) of SN74AUP3G34YFPR is 4.3 ns at VCC = 3.3 V ± 0.3 V with CL = 15 pF and TA = –40°C to 85°C. This value is specified under worst-case process/voltage/temperature conditions and ensures timing margin for high-reliability portable designs. The SN74AUP3G34YFPR achieves this while maintaining sub-1-µA static current - a key differentiator versus standard LVC-family buffers.
Does SN74AUP3G34YFPR support partial power-down operation?
Yes, SN74AUP3G34YFPR supports partial power-down via its Ioff feature: when VCC = 0 V, the outputs enter high-impedance state and block current flow from live inputs, preventing damaging backflow. This behavior is tested and guaranteed per datasheet Section 6.5 (Ioff = 0.2–0.6 µA at VCC = 0 V). The SN74AUP3G34YFPR thus enables safe multi-rail sequencing in battery-powered systems where subsystems power up/down independently.
What is the package type and size of SN74AUP3G34YFPR?
SN74AUP3G34YFPR uses a NanoStar™ DSBGA (YFP) package: 8-ball, 0.4-mm pitch, 1.2 mm × 1.2 mm body size, 0.5-mm max height, with Pb-free SnAgCu solder bumps. Pin 1 is marked by a distinct bump composition (•). This package eliminates leads entirely, reducing parasitic inductance and enabling direct die-to-board mounting - ideal for miniaturized wearable and medical devices where board space is at a premium. The SN74AUP3G34YFPR footprint is significantly smaller than equivalent VSSOP or uQFN variants.
Can SN74AUP3G34YFPR interface between 1.8-V and 3.3-V logic domains?
Yes, SN74AUP3G34YFPR supports mixed-voltage interfacing: it operates from VCC = 0.8 V to 3.6 V and features 3.6-V tolerant I/Os. When powered at 1.8 V, its inputs accept 0–3.6 V signals, and outputs swing rail-to-rail (0–1.8 V), allowing direct connection to 3.3-V receivers with appropriate pull-up configuration. This eliminates level-shifters in many portable designs. The SN74AUP3G34YFPR's guaranteed VIH/VIL thresholds across VCC ensure reliable switching even at 1.2-V or 0.9-V supply - a capability not found in standard LVC buffers.
What are the absolute maximum ratings for SN74AUP3G34YFPR?
The absolute maximum ratings for SN74AUP3G34YFPR are: VCC = –0.5 V to 4.6 V; VI/VO = –0.5 V to 4.6 V (output in high-Z or power-off); VO = –0.5 V to VCC + 0.5 V (output driven); continuous output current = ±20 mA; continuous VCC/GND current = ±50 mA. Exceeding these may cause permanent damage. These limits are defined per JEDEC JESD78 and validated across process corners. The SN74AUP3G34YFPR's 4.6-V input tolerance enables robust handling of transient overvoltage events common in portable charging and docking scenarios.
SN74AUP3G34YFPR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74AUP
- Package/Case:
- 8-XFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 3
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- Push-Pull
- Current - Output High, Low:
- 4mA, 4mA
- Voltage - Supply:
- 0.8V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-DSBGA
SN74AUP3G34YFPR FAQ
1.How can I place an order for SN74AUP3G34YFPR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74AUP3G34YFPR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74AUP3G34YFPR reliable?
The price and inventory of SN74AUP3G34YFPR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74AUP3G34YFPR is usually 5 days.
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Once your SN74AUP3G34YFPR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74AUP3G34YFPR?
For technical support, including SN74AUP3G34YFPR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74AUP3G34YFPR requirements.
6.How does Aetrix verify that SN74AUP3G34YFPR is sourced from the original manufacturer or authorized distributors?
All SN74AUP3G34YFPR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74AUP3G34YFPR meets industry standards.
7.What is the process for return or replacement of SN74AUP3G34YFPR?
All SN74AUP3G34YFPR units undergo pre-shipment inspection (PSI). If there is an issue with SN74AUP3G34YFPR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74AUP3G34YFPR part is unused and in its original packaging.
Return procedure for SN74AUP3G34YFPR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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