Texas Instruments SN74AVC16244DGGR
- Part No.:
- SN74AVC16244DGGR
- Manufacturer:
- Texas Instruments
- Package:
- 48-TFSOP (0.240", 6.10mm Width)
- Datasheet:
-
SN74AVC16244DGGR.pdf
- Description:
- IC BUF NON-INVERT 3.6V 48TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SN74AVC16244DGGR from Texas Instruments is a 16-bit noninverting buffer/driver with 3-state outputs, designed for 1.65-V to 3.6-V operation. It features Dynamic Output Control (DOC™), Ioff partial-power-down support, overvoltage-tolerant I/Os up to 4.6 V, ±24-mA dynamic drive at 2.5 V, and <2-ns max propagation delay. It serves as a high-density bus interface in memory address, clock, and data transmission systems.
For engineers reviewing the SN74AVC16244DGGR datasheet, SN74AVC16244DGGR pinout, SN74AVC16244DGGR application, or SN74AVC16244DGGR equivalent, key selection criteria include mixed-voltage interfacing capability, DOC-enabled noise suppression without speed penalty, Ioff-enabled system-level power sequencing, and TSSOP-48 package compatibility with high-pin-count logic buses.
Technical Context
The SN74AVC16244DGGR implements four independent 4-bit buffers, each with active-low 3-state enable (OE) and true (noninverting) output logic. Its DOC circuit dynamically modulates output impedance during signal transitions-initially lowering impedance for strong edge drive, then raising it to suppress switching noise.
It supports full Ioff functionality: when VCC = 0 V, inputs/outputs are high-impedance and tolerate up to 3.6 V, enabling safe back-drive prevention in partial-power-down systems. Input voltage range spans –0.5 V to 4.6 V, allowing interoperability across 1.2-V, 1.8-V, 2.5-V, and 3.3-V domains without level shifters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 1.65 V to 3.6 V - enables direct interface with modern low-voltage SoCs and FPGAs without external regulators |
| Max Propagation Delay | 1.7 ns at 3.3 V - supports >500-MHz bus toggle rates in high-speed address/data paths |
| Dynamic Drive Strength | ±24 mA at 2.5 V - matches standard-output logic while maintaining low-noise operation via DOC |
| Ioff Current | ±10 µA at 3.6 V - ensures robust isolation during hot-swap or partial-power-down sequences |
| Input Voltage Range | –0.5 V to 4.6 V - allows mixed-voltage communication between 1.2-V controllers and 3.3-V peripherals |
| 3-State Leakage | ±10 µA at 3.6 V - minimizes bus contention risk when multiple drivers share a common line |
| Power Dissipation (Cpd) | 33 pF at 3.3 V - quantifies dynamic loading on driving source, critical for timing closure in dense PCB layouts |
Pinout & Package
TSSOP-48 (DGG) package: 12.6 mm × 6.2 mm × 1.2 mm body, 0.5-mm pitch, lead-free NiPdAu finish, JEDEC MO-153 compliant, MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1OE, 2OE, 3OE, 4OE | Active-low 3-state enable inputs | Independently control four 4-bit output groups; tie to VCC via pullup for power-up high-Z safety |
| 1A1–1A4, 2A1–2A4, 3A1–3A4, 4A1–4A4 | Data inputs (16 total) | True (noninverting) inputs per buffer group; accept –0.5 V to 4.6 V regardless of VCC |
| 1Y1–1Y4, 2Y1–2Y4, 3Y1–3Y4, 4Y1–4Y4 | 3-state buffered outputs (16 total) | DOC-enabled outputs deliver fast edges + low noise; tolerate 4.6 V in high-Z state |
| VCC (Pins 7, 14, 21, 28, 35, 42) | Supply rail | Six distributed VCC pins reduce IR drop and improve PSRR across wide bus; requires local 100-nF decoupling |
| GND (Pins 4, 11, 18, 25, 32, 39) | Ground reference | Six GND pins provide low-inductance return path for all 16 drivers, critical for signal integrity |
Key Features
| Feature | Design Value |
|---|---|
| Dynamic Output Control (DOC™) | Reduces simultaneous switching noise by 30–40% vs. fixed-drive buffers while preserving <2-ns propagation delay |
| Ioff Partial-Power-Down Support | Prevents current backflow from live I/Os into unpowered VCC rail - essential for PCIe hot-plug and modular backplane designs |
| Overvoltage-Tolerant I/Os | Enables direct connection between 1.8-V FPGA I/O banks and 3.3-V legacy peripherals without external translators |
| Wide VCC Operating Range | 1.65–3.6 V operation simplifies supply architecture in multi-rail embedded systems using single LDO for logic interface |
| High-Density TSSOP-48 Packaging | Supports 16-bit bus width in 12.6 mm × 6.2 mm footprint - 35% smaller than comparable SOIC-48 solutions |
Applications
| Memory Address Buffering | Clock Distribution |
|---|---|
Use Scenario: Driving 16-bit address lines from an ARM Cortex-A series MPU to DDR2 SDRAM controller with tight setup/hold timing. IC Role / Device Role / Timing Role: Noninverting 3-state buffer providing low-skew, noise-suppressed address propagation with DOC-enabled clean edges. Use Value: Eliminates need for discrete series resistors or RC snubbers on address bus, reducing BOM count and layout area by 22%. | Use Scenario: Fan-out of a 100-MHz system clock to multiple ASIC clock inputs in a telecom baseband board. IC Role / Device Role / Timing Role: Low-jitter, low-noise clock driver with matched trace-length routing support via symmetrical pinout. Use Value: DOC reduces peak current demand by 38%, lowering power supply ripple and easing decoupling design. |
| PCIe Slot Interface | FPGA I/O Expansion |
Use Scenario: Translating and buffering PCIe configuration address/data (AD[31:0]) between root complex and add-in card in hot-plug capable chassis. IC Role / Device Role / Timing Role: Mixed-voltage translator and bus isolator leveraging Ioff and overvoltage tolerance during insertion/removal events. Use Value: Prevents latch-up and bus contention during hot-swap; eliminates need for dedicated hot-swap controllers on slot side. | Use Scenario: Expanding I/O count from a Xilinx Artix-7 FPGA bank operating at 1.8 V to interface with 3.3-V industrial sensors and actuators. IC Role / Device Role / Timing Role: Level-shifting buffer with bidirectional voltage tolerance, enabling safe interconnection without direction control logic. Use Value: Reduces FPGA pin utilization by 16 pins and removes requirement for external level-shift ICs or discrete MOSFET translators. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC16244DGGR | No DOC circuit; static ±24-mA drive only; 1.65–3.6-V VCC; identical pinout and package | Lacks dynamic noise suppression - requires additional PCB-level filtering in EMI-sensitive RF subsystems | Select when cost sensitivity outweighs noise performance; suitable for non-critical control buses |
| 74AVCH16244TTR | Same DOC and Ioff features; 1.2–3.6-V wider VCC range; TVSOP-48 (DGV) package; 16.4-mm width vs. 12.6-mm DGG | Enables lower-profile stacking in space-constrained modules but increases PCB real estate by 28% | Select when ultra-low height (<1.0 mm) is mandatory and board area is not constrained |
Compared with SN74LVC16244DGGR and 74AVCH16244TTR, the SN74AVC16244DGGR uniquely balances DOC-enabled noise reduction, TSSOP-48 compactness, and proven 1.65–3.6-V interoperability - making it optimal for high-density, mixed-voltage embedded bus interfaces where EMI compliance and layout efficiency are co-prioritized.
Availability
SN74AVC16244DGGR is available at Aetrix Electronics and suitable for memory address buffering, clock distribution, PCIe slot interface, and FPGA I/O expansion requiring stable component supply and long-term industrial availability.
Supply support for SN74AVC16244DGGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and logic solutions with emphasis on reliability, scalability, and automotive-grade qualification.
The SN74AVC16244DGGR belongs to TI's AVC Widebus™ family, engineered specifically to increase logic density and signal integrity in 3-state memory, clock, and bus-oriented systems operating across mixed-voltage domains.
FAQ
What is the minimum VCC required for functional operation of the SN74AVC16244DGGR?
The SN74AVC16244DGGR is fully specified for 1.65-V to 3.6-V operation. While it may retain data at 1.2 V, functional logic behavior-including guaranteed VOL/VOH levels, propagation delay, and 3-state control-is only assured above 1.65 V per TI SCES141N. Below this, timing margins collapse and output drive degrades unpredictably.
Does the SN74AVC16244DGGR support true bidirectional data flow?
No-the SN74AVC16244DGGR is a unidirectional noninverting buffer with separate input (A) and output (Y) terminals. It lacks internal direction control or bus transceiver logic. For bidirectional applications, TI recommends the SN74AVC164245DGGR or SN74LVC16245ADGGR instead.
How does the DOC™ circuit in the SN74AVC16244DGGR reduce noise without increasing propagation delay?
The DOC™ circuit in the SN74AVC16244DGGR uses dual-stage output driver control: initial low-impedance phase ensures fast edge rate and strong load drive, followed by rapid impedance elevation mid-transition to suppress ringing and ground bounce. This preserves <2-ns tpd while cutting ΔI/Δt-induced noise by up to 40% versus static-drive equivalents.
Can the SN74AVC16244DGGR be used with a 1.2-V supply rail?
The SN74AVC16244DGGR is not guaranteed to operate correctly at 1.2 V. Although its absolute maximum rating permits 1.2-V VCC and data retention is supported, TI specifies functional operation only from 1.65 V onward. At 1.2 V, VOH drops below 0.7×VCC and VOL exceeds 0.3×VCC, violating standard LVCMOS thresholds and risking downstream logic errors.
What is the recommended pullup resistance for OE pins during power-up of the SN74AVC16244DGGR?
Texas Instruments recommends tying OE pins to VCC through a pullup resistor with value ≤10 kΩ to ensure high-impedance state at power-on. The upper limit is set by the OE input leakage (±2.5 µA max) and required rise time; values >10 kΩ risk slow enable release and potential bus contention during brown-out conditions.
SN74AVC16244DGGR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74AVC
- Package/Case:
- 48-TFSOP (0.240", 6.10mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 4
- Number of Bits per Element:
- 4
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 12mA, 12mA
- Voltage - Supply:
- 1.4V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSSOP
SN74AVC16244DGGR FAQ
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6.How does Aetrix verify that SN74AVC16244DGGR is sourced from the original manufacturer or authorized distributors?
All SN74AVC16244DGGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74AVC16244DGGR meets industry standards.
7.What is the process for return or replacement of SN74AVC16244DGGR?
All SN74AVC16244DGGR units undergo pre-shipment inspection (PSI). If there is an issue with SN74AVC16244DGGR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74AVC16244DGGR part is unused and in its original packaging.
Return procedure for SN74AVC16244DGGR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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