Texas Instruments SN74AVC16827DGGR
- Part No.:
- SN74AVC16827DGGR
- Manufacturer:
- Texas Instruments
- Package:
- 56-TFSOP (0.240", 6.10mm Width)
- Datasheet:
-
SN74AVC16827DGGR.pdf
- Description:
- IC BUF NON-INVERT 3.6V 56TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SN74AVC16827DGGR from Texas Instruments is a 20-bit noninverting buffer/driver with 3-state outputs, designed for 1.65-V to 3.6-V operation. It delivers ±24 mA dynamic drive at 3.3 V, features Dynamic Output Control (DOC™) for noise reduction without speed penalty, and supports partial-power-down via Ioff. Used in high-density data bus interfacing between mixed-voltage domains in telecom backplanes and industrial controllers.
For engineers reviewing the SN74AVC16827DGGR datasheet, SN74AVC16827DGGR pinout, SN74AVC16827DGGR application, or SN74AVC16827DGGR equivalent, key selection criteria include its dual 10-bit sections with independent OE control, 1.2–3.6 V supply range, <2 ns propagation delay, overvoltage-tolerant I/O, and TSSOP-56 package compatibility with JEDEC MO-153.
Technical Context
The SN74AVC16827DGGR implements EPIC™ submicron CMOS process and DOC™ circuitry that dynamically modulates output impedance-initially lowering it for fast edge drive, then raising it mid-transition to suppress ringing. Each 10-bit section requires both OE inputs low to enable outputs; either OE high forces high-impedance state.
It operates across –40°C to 85°C, supports Ioff for safe partial power-down, and tolerates input/output voltages up to 4.6 V regardless of VCC. Absolute max ratings include ±50 mA continuous output current and 64°C/W thermal impedance in the DGG package.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 1.2 V to 3.6 V - enables interoperability across 1.8-V, 2.5-V, and 3.3-V logic domains without level shifters |
| Dynamic Drive | ±24 mA at 3.3 V - matches standard-output drive strength while maintaining low-noise signaling via DOC™ |
| Propagation Delay | ≤1.7 ns at 3.3 V (CL = 0 pF) - supports >500 MHz data rates in point-to-point or stub-bus topologies |
| Ioff Current | ±10 µA max at 3.6 V - prevents backflow current during power sequencing, enabling hot-swap and partial shutdown |
| Input Thresholds | VIH = 0.65×VCC, VIL = 0.35×VCC - ensures robust noise margin across full VCC range with rail-to-rail compatibility |
| Output Impedance Control | DOC™ active - reduces simultaneous switching noise (SSN) by 30–40% vs fixed-drive buffers without sacrificing edge rate |
| ESD Rating | Exceeds JESD 78 Class II latch-up (>100 mA) - provides system-level robustness in noisy industrial environments |
Pinout & Package
TSSOP-56 (DGG) package, 12.0 mm × 6.1 mm × 1.2 mm max height, JEDEC MO-153 compliant, lead finish NIPDAU, MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1OE1, 1OE2, 2OE1, 2OE2 | Section output-enable inputs | Active-low dual-OE per 10-bit section - enables fine-grained bus partitioning and power gating |
| 1A1–1A10, 2A1–2A10 | Data inputs | Overvoltage-tolerant (up to 4.6 V) - allows connection to higher-voltage buses without external protection |
| 1Y1–1Y10, 2Y1–2Y10 | 3-state buffered outputs | DOC™-enabled outputs - deliver fast edge rates with controlled slew, minimizing crosstalk on dense PCB traces |
| VCC (Pins 7, 22, 36, 49) | Power supply | Four dedicated VCC pins - reduce IR drop and improve PSRR in high-speed 20-bit parallel interfaces |
| GND (Pins 4, 11, 17, 25, 33, 40, 46, 53) | Ground reference | Eight GND pins - provide low-inductance return paths essential for signal integrity at >200 Mbps per line |
Key Features
| Feature | Design Value |
|---|---|
| Dynamic Output Control (DOC™) | Reduces SSN by modulating output impedance mid-transition - eliminates need for external series resistors or ferrites |
| Ioff Partial-Power-Down Support | Blocks current flow when VCC = 0 V - enables safe insertion/removal in live-backplane systems |
| Wide Supply Range (1.2–3.6 V) | Single device replaces multiple voltage-specific buffers - simplifies BOM and layout across multi-rail designs |
| Overvoltage-Tolerant I/O | Accepts 0–4.6 V signals regardless of VCC - eliminates level translators in mixed-voltage FPGA-to-ASIC interconnects |
| Low Propagation Delay (≤1.7 ns) | Enables timing-critical applications like DDR memory address/control buffering with margin at 3.3 V |
Applications
| Telecom Backplane Interface | Industrial PLC I/O Expansion |
|---|---|
Use Scenario: Interfacing 3.3-V FPGA control logic to legacy 5-V or mixed-voltage peripheral modules in carrier-grade chassis. IC Role / Device Role / Timing Role: 20-bit bidirectional bus buffer with independent OE control per 10-bit segment, managing address/data strobes and status lines. Use Value: DOC™ reduces ground bounce on shared backplane returns; Ioff prevents damage during hot-swap module replacement. |
Use Scenario: Isolating programmable logic controller CPU bus from distributed I/O modules operating at different supply rails. IC Role / Device Role / Timing Role: Noninverting 3-state driver for parallel control bus, enabling time-multiplexed access to multiple sensor/actuator banks. Use Value: 1.2–3.6 V operation supports direct interface to 1.8-V microcontrollers and 2.5-V analog front-ends without translation. |
| Automotive ADAS Sensor Hub | Test Equipment Signal Conditioning |
Use Scenario: Aggregating camera, radar, and ultrasonic sensor data streams into a central domain controller in ASIL-B systems. IC Role / Device Role / Timing Role: High-speed 20-bit buffer for LVCMOS sensor interface bus, with OE-controlled isolation during fault recovery. Use Value: ±24 mA drive ensures clean signal integrity over 10-cm flex traces; wide temp range (–40°C to 85°C) meets automotive requirements. |
Use Scenario: Driving multiple DUT inputs simultaneously from a single pattern generator channel in automated test fixtures. IC Role / Device Role / Timing Role: Fanout buffer with precise skew control and low propagation delay variation across all 20 outputs. Use Value: ≤0.3 ns output-to-output skew (typical) enables synchronized stimulus delivery across 20-pin DUTs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 20-bit buffer/driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC16244ADGGR | Lower drive (±24 mA only at 3.3 V), no DOC™, 1.65–3.6 V range, same TSSOP-48 but 16-bit | Lacks dynamic impedance control - higher SSN in high-fanout routing; requires external termination for clean edges | Choose for cost-sensitive, lower-speed (<100 MHz) applications where DOC™ is not required |
| SN74AVCH16T245DGGR | Bidirectional 16-bit level shifter, supports 1.2–3.6 V on A/B sides independently, no 3-state OE per section | Provides voltage translation but lacks independent 10-bit OE control and DOC™ noise suppression | Choose when interfacing mismatched voltage domains (e.g., 1.8-V SoC to 3.3-V peripherals) rather than pure buffering |
Compared with SN74LVC16244ADGGR and SN74AVCH16T245DGGR, the SN74AVC16827DGGR uniquely combines per-section dual-OE control, DOC™-enabled noise reduction, and true 20-bit width in a single TSSOP-56 package - making it optimal for high-integrity, high-density parallel bus applications requiring timing precision and EMI control.
Availability
SN74AVC16827DGGR is available at Aetrix Electronics and suitable for telecom backplane design, industrial PLC I/O expansion, and automotive ADAS sensor hub development requiring stable component supply and long-term lifecycle support.
Supply support for SN74AVC16827DGGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of innovation in high-speed interface ICs and industrial-grade reliability.
The SN74AVC16827DGGR belongs to TI's AVC Widebus™ family, engineered specifically for low-noise, high-drive, mixed-voltage data path buffering in space-constrained, high-reliability systems.
FAQ
What is the maximum operating temperature range for the SN74AVC16827DGGR?
The SN74AVC16827DGGR is characterized for operation from –40°C to +85°C ambient temperature. This range is validated per JEDEC JESD78 latch-up testing and applies across the full 1.2–3.6 V supply range. The device maintains specified VOH/VOL, tpd, and Ioff performance within this envelope, making it suitable for industrial and automotive under-hood applications where thermal cycling is expected. No derating is required up to 85°C.
Does the SN74AVC16827DGGR support true 1.2-V operation?
Yes, the SN74AVC16827DGGR is fully functional at 1.2 V VCC, with guaranteed parameters including VIH/VIL thresholds, VOL/VOH levels, and tpd ≤3.2 ns (typical). Its EPIC™ submicron CMOS process enables stable operation down to 1.2 V while retaining overvoltage tolerance and Ioff functionality - unlike many competing buffers that specify only 1.65 V minimum.
How does the Dynamic Output Control (DOC™) circuit in the SN74AVC16827DGGR reduce noise?
The DOC™ circuit in the SN74AVC16827DGGR dynamically lowers output impedance at signal transition onset to drive capacitive loads quickly, then raises impedance mid-transition to damp ringing and suppress simultaneous switching noise. This two-phase behavior eliminates overshoot/undershoot without adding external components, achieving up to 40% lower SSN versus fixed-drive buffers at identical edge rates - verified in TI application report SCEA009.
Can the SN74AVC16827DGGR be used in hot-swap applications?
Yes, the SN74AVC16827DGGR supports hot-swap via its Ioff feature: when VCC = 0 V, all I/Os present high impedance (±10 µA max leakage), preventing damaging current backflow from live buses into the unpowered device. This enables safe insertion/removal in powered backplanes - confirmed per JESD78 Class II latch-up testing and widely deployed in telecom shelf management systems.
What is the pin-compatible alternative for the SN74AVC16827DGGR in TVSOP package?
The SN74AVC16827DGVR is the pin-compatible TVSOP-56 variant of the SN74AVC16827DGGR, sharing identical pinout, electrical specs, and logic function. It differs only in package dimensions (DGV vs DGG), thermal impedance (48°C/W vs 64°C/W), and land pattern - allowing direct PCB substitution where board space or thermal performance dictates thinner profile or lower θJA.
SN74AVC16827DGGR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74AVC
- Package/Case:
- 56-TFSOP (0.240", 6.10mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 10
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 12mA, 12mA
- Voltage - Supply:
- 1.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSSOP
SN74AVC16827DGGR FAQ
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For technical support, including SN74AVC16827DGGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74AVC16827DGGR requirements.
6.How does Aetrix verify that SN74AVC16827DGGR is sourced from the original manufacturer or authorized distributors?
All SN74AVC16827DGGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74AVC16827DGGR meets industry standards.
7.What is the process for return or replacement of SN74AVC16827DGGR?
All SN74AVC16827DGGR units undergo pre-shipment inspection (PSI). If there is an issue with SN74AVC16827DGGR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74AVC16827DGGR part is unused and in its original packaging.
Return procedure for SN74AVC16827DGGR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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