Texas Instruments SN74AVC16827DGVR

Overview

SN74AVC16827DGVR from Texas Instruments is a 20-bit noninverting buffer/driver with 3-state outputs, designed for 1.2-V to 3.6-V operation and optimized for 1.65-V to 3.6-V V_CC. It delivers ±24 mA dynamic drive capability at 3.3 V, features Dynamic Output Control (DOC™) for noise reduction without speed penalty, and supports partial-power-down via I_off. It is used in high-speed bus interface applications such as memory expansion and FPGA I/O bridging.

For engineers reviewing the SN74AVC16827DGVR datasheet, SN74AVC16827DGVR pinout, SN74AVC16827DGVR application, or SN74AVC16827DGVR equivalent, key selection criteria include its dual 10-bit sections with independent output-enable control, overvoltage-tolerant I/O (up to 4.6 V), sub-2 ns propagation delay at 3.3 V, and TVSOP-56 package compatibility with space-constrained PCB layouts.

Technical Context

The SN74AVC16827DGVR implements a Dynamic Output Control (DOC™) circuit that dynamically adjusts output impedance during signal transitions-initially lowering it for strong drive, then raising it to suppress switching noise. This enables robust signal integrity in high-density digital systems without sacrificing timing performance.

It is organized into two independent 10-bit buffer sections, each requiring both OE inputs (e.g., 1OE1 and 1OE2) to be low for Y outputs to be active; either OE high forces all corresponding outputs into high-impedance state. The device is fully characterized from –40°C to 85°C and supports mixed-voltage mode data communication across 1.2–3.6 V domains.

Key Specifications

Pinout & Package

SN74AVC16827DGVR is housed in a 56-pin Thin Very Small Outline Package (TVSOP, DGV), measuring 4.4 mm × 12.5 mm with 0.4 mm lead pitch and maximum height of 1.2 mm. It features exposed metal thermal pad (non-electrical) per JEDEC MO-194.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar buffer/driver applications.

Compared with SN74AVC16826DGVR and SN74LVC16244ADGVR, the SN74AVC16827DGVR uniquely combines 20-bit width, DOC™-enabled noise control, overvoltage-tolerant I/O, and true 1.2–3.6 V operation - making it optimal for next-generation mixed-voltage, high-density interconnects where signal integrity and design flexibility are prioritized.

Availability

SN74AVC16827DGVR is available at Aetrix Electronics and suitable for industrial automation, automotive domain controllers, and FPGA-based prototyping platforms requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for SN74AVC16827DGVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of expertise in high-reliability interface ICs and widebus technologies.

The SN74AVC16827DGVR belongs to TI's AVC logic family, engineered specifically for low-voltage, high-speed bus interface applications demanding noise resilience, mixed-voltage interoperability, and robust partial-power-down behavior.

FAQ

What is the maximum operating voltage for SN74AVC16827DGVR I/O pins?

The SN74AVC16827DGVR supports overvoltage-tolerant inputs and outputs rated to 4.6 V regardless of V_CC level - allowing safe connection to 5 V or 3.3 V buses even when V_CC is as low as 1.2 V. This eliminates need for external clamping diodes in mixed-voltage systems and is confirmed in Absolute Maximum Ratings and Recommended Operating Conditions tables of the SCES176I datasheet.

Does SN74AVC16827DGVR support partial power-down, and how is it implemented?

Yes, SN74AVC16827DGVR fully supports partial-power-down via its I_off circuitry, which disables outputs and limits leakage to ±10 µA when V_CC = 0 V and VI or VO = 3.6 V. This prevents damaging current backflow in modular systems - for example, when one board in a hot-swap chassis powers down while adjacent boards remain active. The feature is validated per JESD 78 Class II latch-up testing.

How does the Dynamic Output Control (DOC™) circuit in SN74AVC16827DGVR reduce noise?

The DOC™ circuit in SN74AVC16827DGVR dynamically lowers output impedance at signal transition onset for strong drive, then raises it mid-transition to suppress ringing and ground bounce. As shown in Figure 1 of SCES176I, this yields <30% lower V_OL/V_OH overshoot versus fixed-drive buffers while maintaining ≤1.7 ns propagation delay at 3.3 V - critical for clean 200+ MHz bus signaling.

What is the pin-compatible alternative if SN74AVC16827DGVR is unavailable?

There is no pin-compatible drop-in replacement for SN74AVC16827DGVR. The SN74AVC16826DGVR shares the same TVSOP-56 (DGV) package and pinout for its 18 pins but lacks two output pairs and associated OE controls. Any substitution requires PCB layout revision. TI does not list any P2P alternatives for this exact 20-bit, dual-OE, DOC™-enabled part in the SCES176I datasheet or packaging addendum.

What are the thermal characteristics of SN74AVC16827DGVR in TVSOP-56 package?

The SN74AVC16827DGVR in TVSOP-56 (DGV) package has a junction-to-ambient thermal resistance (θ_JA) of 48°C/W, per TI's PACKAGE OPTION ADDENDUM. This value assumes standard JEDEC 2-layer board conditions. With typical I_CC < 40 µA and output loading within ±12 mA, self-heating remains negligible (<0.5°C rise) in most industrial applications - enabling operation up to +85°C ambient without heatsinking.