Texas Instruments SN74AVC20T245DGG
- Part No.:
- SN74AVC20T245DGG
- Manufacturer:
- Texas Instruments
- Package:
- 56-TFSOP (0.240", 6.10mm Width)
- Datasheet:
-
SN74AVC20T245DGG.pdf
- Description:
- IC TRANSLATOR BIDIR 56TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SN74AVC20T245DGG from Texas Instruments is a 20-bit dual-rail noninverting bus transceiver enabling bidirectional voltage-level translation between 1.2-V to 3.6-V domains. It features independent VCCA and VCCB rails, Ioff partial-power-down support, VCC isolation, and 4.6-V tolerant I/Os. Used in mixed-voltage FPGA-to-ASIC interconnects requiring sub-3ns propagation delay at 3.3-V translation.
For engineers reviewing the SN74AVC20T245DGG datasheet, SN74AVC20T245DGG pinout, SN74AVC20T245DGG application, or SN74AVC20T245DGG equivalent, key selection criteria include its 20-bit dual-directional translation capability, TSSOP-56 package compatibility with 0.5-mm pitch PCB layouts, guaranteed 380 Mbps data rate (1.8-V ↔ 3.3-V), and explicit VCCA-referenced DIR/OE logic thresholds.
Technical Context
This device implements two independent 10-bit transceiver sections (1A↔1B and 2A↔2B), each with dedicated DIR and OE controls referenced to VCCA. Its fully configurable dual-rail architecture allows simultaneous operation across mismatched supply domains - e.g., 1.5-V A-port interfacing to 2.5-V B-port - without external level-shifting components.
The VCC isolation feature forces both ports into high-impedance when either VCCA or VCCB drops to GND, preventing backdrive during power sequencing. Ioff circuitry limits off-state current to ±1 µA per I/O when either rail is unpowered, satisfying JEDEC JESD78 Class II latch-up immunity (>100 mA).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Range | VCCA and VCCB independently support 1.2 V to 3.6 V - enables direct interface between 1.2-V, 1.5-V, 1.8-V, 2.5-V, and 3.3-V logic domains |
| Max Data Rate | 380 Mbps (1.8-V ↔ 3.3-V) - supports high-speed DDR memory control, PCIe sideband, and FPGA configuration buses |
| Propagation Delay | tPLH/tPHL = 2.9 ns (A→B, VCCA=3.3 V, VCCB=3.3 V) - ensures timing closure in sub-5-ns critical paths |
| I/O Voltage Tolerance | 4.6 V on all A/B ports - permits safe connection to legacy 3.3-V or 5-V systems without clamping diodes |
| Ioff Current | ±1 µA max per I/O at 25°C - prevents damaging back-current during hot-swap or staggered power-up sequences |
| ESD Rating | 8000-V HBM, 200-V MM, 1000-V CDM - meets industrial-grade robustness requirements for board-level handling |
Pinout & Package
TSSOP-56 package (DGG), 12.0 mm × 6.2 mm × 1.2 mm body, 0.5-mm lead pitch, NiPdAu lead finish, MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1DIR, 2DIR | Direction control input | Referenced to VCCA; determines data flow direction per 10-bit section (L = B→A, H = A→B) |
| 1OE, 2OE | Output enable input | Referenced to VCCA; L enables outputs, H forces high-impedance state on both ports |
| 1A1–1A10, 2A1–2A10 | A-side data I/O | Track VCCA supply; tolerate up to 4.6 V regardless of VCCA level |
| 1B1–1B10, 2B1–2B10 | B-side data I/O | Track VCCB supply; tolerate up to 4.6 V regardless of VCCB level |
| VCCA, VCCB | Power supply inputs | Independent rails; VCCA powers DIR/OE logic and A-port I/O; VCCB powers B-port I/O |
| GND | Ground reference | Eight dedicated ground pins distributed across package for low-noise return path and thermal dissipation |
Key Features
| Feature | Design Value |
|---|---|
| Dual-rail translation | Enables asynchronous 1.2-V ↔ 3.3-V communication without external biasing or resistors |
| VCC isolation | Guarantees high-impedance on both ports if either VCCA or VCCB = 0 V - eliminates need for external power-good sequencing logic |
| Ioff partial-power-down | Blocks current flow between powered/unpowered rails - required for PCI Express hot-plug and battery-backed subsystems |
| Overvoltage-tolerant I/O | Withstands 4.6-V inputs while operating at 1.2-V VCC - simplifies integration with mixed-voltage backplanes |
| Low propagation skew | Matched tPLH/tPHL ≤ 0.5 ns across all 20 channels - preserves signal integrity in parallel bus applications |
Applications
| DDR Memory Interface | FPGA-to-Microcontroller Bridge |
|---|---|
Use Scenario: Interfacing a 1.8-V DDR2 SDRAM controller to a 3.3-V system management microcontroller. IC Role / Device Role / Timing Role: Bidirectional level translator managing address, command, and control signals between mismatched voltage domains. Use Value: Eliminates discrete resistor-based translators; maintains 380 Mbps timing margin for CAS latency and refresh cycles. | Use Scenario: Connecting a 1.2-V Artix-7 FPGA I/O bank to a 2.5-V industrial sensor hub MCU. IC Role / Device Role / Timing Role: Configurable 20-bit transceiver enabling real-time sensor data streaming with sub-3ns channel-to-channel skew. Use Value: Supports full 20-bit parallel sensor readout without timing derating or added PCB area. |
| PCIe Sideband Signal Routing | Hot-Swappable Module Backplane |
Use Scenario: Translating PCIe REFCLK, PERST#, and WAKE# signals between 3.3-V slot power and 1.5-V endpoint logic. IC Role / Device Role / Timing Role: Low-skew, high-impedance-isolated translator ensuring signal integrity during link training and recovery. Use Value: Meets PCIe 3.0 sideband timing budgets with <3.5 ns tPLH and guaranteed VCC isolation during hot-insertion. | Use Scenario: Enabling live insertion of 1.8-V compute modules into a 3.3-V carrier board with no power sequencing constraints. IC Role / Device Role / Timing Role: Ioff-enabled translator maintaining isolation until module power stabilizes, then enabling bidirectional status/control exchange. Use Value: Prevents backfeed damage during hot-swap; supports <100-µA off-state leakage for reliable firmware handshake. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74AVCH16T245DGGR | 16-bit version in same TSSOP-56 package; lacks second DIR/OE pair; identical VCC range and Ioff spec | Suitable only for 16-bit buses; not drop-in for 20-bit designs requiring full channel count | Select when bus width is ≤16 bits and PCB layout reuse is prioritized over channel count |
| SN74LVC20T245DGG | Same pinout and function but LVC family: lower drive strength (±24 mA vs ±50 mA), higher VOL/VOH variation, no 1.2-V min VCC support | Not suitable for 1.2-V or 1.5-V domains; limited to ≥1.65-V operation; reduced noise margin at low VCC | Choose only if existing LVC ecosystem mandates compatibility and 1.2-V operation is unnecessary |
Compared with SN74AVCH16T245DGGR and SN74LVC20T245DGG, the SN74AVC20T245DGG uniquely delivers full 20-bit width, guaranteed 1.2-V operation, ±50-mA drive, and 4.6-V I/O tolerance - making it the sole option for compact, ultra-low-voltage, high-drive mixed-domain interconnects.
Availability
SN74AVC20T245DGG is available at Aetrix Electronics and suitable for DDR memory interfaces, FPGA-to-MCU bridges, PCIe sideband routing, and hot-swappable module backplanes requiring stable component supply across industrial temperature ranges (−40°C to 85°C).
Supply support for SN74AVC20T245DGG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and communications markets.
The SN74AVC20T245DGG belongs to TI's AVC (Advanced Very-Low-Voltage CMOS) logic family, engineered specifically for high-speed, low-voltage bidirectional bus translation in space-constrained, multi-rail digital systems.
FAQ
What voltage ranges does the SN74AVC20T245DGG support on its VCCA and VCCB supplies?
The SN74AVC20T245DGG supports independent supply voltages from 1.2 V to 3.6 V on both VCCA and VCCB rails. This enables translation between any combination of 1.2-V, 1.5-V, 1.8-V, 2.5-V, and 3.3-V logic domains. Operation below 1.2 V is not specified, and exceeding 3.6 V violates absolute maximum ratings.
Does the SN74AVC20T245DGG require external pull-up resistors on DIR or OE pins?
No external pull-up resistors are required on DIR or OE for normal operation. However, to ensure defined high-impedance state during power-up/power-down, TI recommends tying OE to VCCA through a pull-up resistor - minimum value determined by driver sink capability. DIR may be driven directly from VCCA-referenced logic.
Can the SN74AVC20T245DGG translate between 1.2-V and 3.3-V while maintaining 380 Mbps data rate?
No - the 380 Mbps rating applies only to 1.8-V ↔ 3.3-V translation. At 1.2-V ↔ 3.3-V, the maximum supported data rate is 100 Mbps per the datasheet's published timing table. Performance degrades at extreme VCC differentials due to reduced noise margin and slower edge rates.
Is the SN74AVC20T245DGG pin-compatible with other 20-bit AVC transceivers in TSSOP-56?
Yes - the SN74AVC20T245DGG shares identical pinout, footprint, and terminal assignment with SN74AVC20T245DGGR and SN74AVC20T245DGG.B. All three use the DGG package with 56-pin TSSOP layout, enabling direct substitution in tube or tape-and-reel form factors without PCB changes.
How does the VCC isolation feature behave if VCCA = 0 V but VCCB = 3.3 V?
When VCCA = 0 V (GND), the SN74AVC20T245DGG forces both A-port and B-port I/Os into high-impedance state regardless of DIR/OE states or VCCB level. This prevents back-driving the 3.3-V B-bus and protects downstream components - a critical safety feature during asymmetric power sequencing.
SN74AVC20T245DGG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74AVC
- Package/Case:
- 56-TFSOP (0.240", 6.10mm Width)
- Packaging:
- Tube
- Product Status:
- Active
- Logic Type:
- Translation Transceiver
- Number of Elements:
- 2
- Number of Bits per Element:
- 10
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 12mA, 12mA
- Voltage - Supply:
- 1.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSSOP
SN74AVC20T245DGG FAQ
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For technical support, including SN74AVC20T245DGG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74AVC20T245DGG requirements.
6.How does Aetrix verify that SN74AVC20T245DGG is sourced from the original manufacturer or authorized distributors?
All SN74AVC20T245DGG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74AVC20T245DGG meets industry standards.
7.What is the process for return or replacement of SN74AVC20T245DGG?
All SN74AVC20T245DGG units undergo pre-shipment inspection (PSI). If there is an issue with SN74AVC20T245DGG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74AVC20T245DGG part is unused and in its original packaging.
Return procedure for SN74AVC20T245DGG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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