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Texas Instruments SN74AVC20T245DGVR
- Part No.:
- SN74AVC20T245DGVR
- Manufacturer:
- Texas Instruments
- Package:
- 56-TFSOP (0.173", 4.40mm Width)
- Datasheet:
-
SN74AVC20T245DGVR.pdf
- Description:
- IC TRANSLATOR BIDIR 56TVSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,175
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Product details
Overview
SN74AVC20T245DGVR from Texas Instruments is a 20-bit dual-supply noninverting bus transceiver enabling bidirectional voltage-level translation between 1.2-V to 3.6-V domains. It features two independent rails (VCCA/VCCB), 4.6-V tolerant I/Os, VCC isolation, and Ioff support for partial-power-down operation. Used in mixed-voltage FPGA-to-ASIC interconnects, memory subsystems, and low-power portable SoC interfaces.
For engineers reviewing the SN74AVC20T245DGVR datasheet, SN74AVC20T245DGVR pinout, SN74AVC20T245DGVR application, or SN74AVC20T245DGVR equivalent, key selection criteria include bidirectional rail-to-rail translation capability, 56-pin TVSOP package thermal performance (θJA = 48°C/W), guaranteed 100–380 Mbps data rates across voltage combinations, and JESD 78 Class II latch-up immunity.
Technical Context
This device implements two independent 10-bit translation sections, each with dedicated DIR and OE controls referenced to VCCA. Directional data flow (A↔B) is determined per-section by DIR logic level, while OE independently disables outputs into high-impedance state. Control inputs are VCCA-referenced, ensuring robust timing when VCCA differs from VCCB.
VCC isolation ensures both ports enter high-Z if either VCCA or VCCB is at GND - critical for hot-swap and power sequencing. Ioff protection actively disables outputs during power-down, preventing back-current flow even when I/Os are driven externally at active voltages up to 4.6 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Range | VCCA and VCCB independently configurable from 1.2 V to 3.6 V - enables universal 1.2/1.5/1.8/2.5/3.3-V node bridging |
| Max Data Rate | 380 Mbps (1.8-V ↔ 3.3-V); 100 Mbps (1.2-V ↔ 1.2-V) - supports DDR memory control, high-speed sensor buses, and PCIe sideband signaling |
| I/O Tolerance | 4.6-V overvoltage-tolerant inputs/outputs - allows safe interfacing with legacy 3.3-V or 5-V logic without external clamping |
| Propagation Delay | tPLH/tPHL ≤ 3.4 ns (A→B, VCCA=3.3 V, VCCB=3.3 V) - meets sub-5-ns timing budgets for real-time control loops |
| Latch-Up Immunity | >100 mA per JESD 78 Class II - ensures reliability in noisy industrial environments with transient coupling |
| ESD Protection | 8 kV HBM, 200 V MM, 1 kV CDM - exceeds IEC 61000-4-2 Level 4 for board-level ESD robustness |
| Thermal Resistance | θJA = 48°C/W (TVSOP-DGV) - enables sustained 20-bit operation at 85°C ambient without forced airflow |
Pinout & Package
SN74AVC20T245DGVR uses a 56-pin Thin Very Small Outline Package (TVSOP-DGV), 11.4 mm × 4.5 mm × 1.2 mm max height, JEDEC MO-194 compliant, with exposed pad for thermal enhancement.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1DIR, 2DIR | Direction control input (per 10-bit section) | Logic level selects A→B (DIR=H) or B→A (DIR=L); referenced to VCCA for stable threshold across rail combinations |
| 1OE, 2OE | Output enable input (per 10-bit section) | Active-low; forces associated port into high-Z when high - enables bus arbitration and power-domain isolation |
| 1A1–1A10, 2A1–2A10 | Data inputs/outputs (Port A) | Track VCCA supply; tolerate up to 4.6 V regardless of VCCA setting - eliminates need for level-shifting buffers on A-side |
| 1B1–1B10, 2B1–2B10 | Data inputs/outputs (Port B) | Track VCCB supply; fully independent voltage domain - supports asymmetric translation (e.g., 1.2-V MCU ↔ 3.3-V peripheral) |
| VCCA, VCCB | Independent power supplies | Decoupled rails allow dynamic voltage scaling; VCC isolation ensures fail-safe high-Z if either rail collapses |
| GND (×8 pins) | Ground terminals | Multiple dedicated ground pins minimize ground bounce and improve signal integrity for 20-bit parallel paths |
Key Features
| Feature | Design Value |
|---|---|
| Fully configurable dual-rail architecture | Enables simultaneous 1.2-V ↔ 1.8-V and 2.5-V ↔ 3.3-V translations on same device - reduces BOM count in multi-voltage systems |
| VCC isolation | Guarantees high-impedance state on both ports if either VCCA or VCCB = 0 V - prevents bus contention during power sequencing or fault conditions |
| Ioff partial-power-down support | Blocks current backflow when powered down while I/Os remain driven - essential for battery-backed subsystems and hot-plug interfaces |
| Overvoltage-tolerant I/Os | Withstands 4.6 V on any A/B port pin regardless of VCCA/VCCB setting - eliminates external TVS diodes in mixed-voltage PCB layouts |
| Low propagation delay variation | Δt < 0.5 ns across VCCA/VCCB combinations (e.g., 3.3 V → 1.2 V vs. 1.2 V → 3.3 V) - simplifies timing closure in bidirectional data paths |
Applications
| Mobile Baseband Processing | FPGA-to-Memory Interface |
|---|---|
Use Scenario: Interfacing 1.2-V application processor core with 1.8-V LPDDR2 memory controller in smartphone SoC. IC Role / Device Role / Timing Role: Bidirectional level translator managing command/address/data strobes with sub-5-ns skew control. Use Value: Eliminates discrete MOSFET translators; maintains 380 Mbps throughput at 1.2-V/1.8-V boundary while meeting JEDEC mobile ESD requirements. | Use Scenario: Connecting Xilinx Artix-7 FPGA (1.0-V core, 1.8-V I/O) to Micron MT41K256M16TW-107 IT:K DDR3 SDRAM (1.5-V VDDQ). IC Role / Device Role / Timing Role: Dual-rail transceiver translating 20-bit address/control bus with matched A→B and B→A delays. Use Value: Enables direct FPGA-to-DRAM connection without voltage margin loss; leverages VCC isolation to prevent DRAM bus corruption during FPGA configuration reset. |
| Industrial PLC Backplane | Automotive ADAS Sensor Hub |
Use Scenario: Isolating 24-V field I/O modules (3.3-V logic) from 1.5-V microcontroller subsystem in programmable logic controller rack. IC Role / Device Role / Timing Role: Voltage translator with Ioff and latch-up immunity for fault-tolerant backplane communication. Use Value: Survives 100 mA latch-up stress per JESD 78 Class II; maintains bus integrity during 24-V surge events via 4.6-V I/O tolerance. | Use Scenario: Bridging 1.2-V vision processor MIPI CSI-2 interface to 2.5-V radar sensor SPI control bus in automotive sensor fusion module. IC Role / Device Role / Timing Role: Low-power bidirectional translator supporting 120 Mbps (1.2-V ↔ 2.5-V) with <1 µA static ICC in sleep mode. Use Value: Reduces system standby current by 90% vs. discrete solutions; meets AEC-Q100 Grade 2 temperature range (−40°C to 85°C) without derating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional voltage-level translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74AVCH16T245DGGR | 16-bit, TSSOP-48; lacks VCC isolation; 3.6-V I/O tolerance only | Lower channel count; no fail-safe high-Z on rail collapse - unsuitable for hot-swap backplanes | Select when 16-bit width suffices and VCC isolation is not required; lower cost but reduced robustness |
| TXB0304RUTR | 4-bit, X2SON-12; auto-direction sensing; 5.5-V I/O tolerance; no DIR/OE pins | Smaller footprint; direction detection adds latency; not pin-compatible - requires PCB redesign | Choose for space-constrained 4-bit interfaces where automatic direction control outweighs deterministic timing control |
Compared with SN74AVC20T245DGVR, SN74AVCH16T245DGGR offers lower channel density and no VCC isolation - limiting use in fault-tolerant systems - while TXB0304RUTR trades deterministic DIR control for compact size and auto-sensing, making it incompatible for synchronous 20-bit burst transfers.
Availability
SN74AVC20T245DGVR is available at Aetrix Electronics and suitable for industrial automation, automotive ADAS sensor hubs, and mobile baseband processing requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for SN74AVC20T245DGVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and consumer markets.
The SN74AVC20T245DGVR belongs to TI's AVC (Advanced Very-Low-Voltage CMOS) logic family, engineered specifically for robust, high-speed bidirectional voltage translation in multi-rail digital systems with stringent power and reliability requirements.
FAQ
What is the maximum supported data rate for SN74AVC20T245DGVR when translating between 1.2-V and 3.3-V rails?
The SN74AVC20T245DGVR supports up to 100 Mbps when translating between 1.2-V and 3.3-V rails, as specified in the SCES566F datasheet. This rate is validated under recommended operating conditions with CL = 15 pF and applies to both A→B and B→A directions. Performance remains stable across −40°C to 85°C ambient temperature.
Does SN74AVC20T245DGVR require external pull-up resistors on DIR or OE pins?
No external pull-up resistors are required on DIR or OE pins of the SN74AVC20T245DGVR under normal operation. However, TI recommends tying OE to VCCA through a pull-up resistor during power-up/down to guarantee high-impedance state - minimum resistance depends on driver sink capability, typically ≥10 kΩ for standard CMOS drivers.
Can SN74AVC20T245DGVR operate with VCCA = 1.2 V and VCCB = 3.3 V simultaneously?
Yes, the SN74AVC20T245DGVR is explicitly designed for asymmetric operation: VCCA may be set to 1.2 V while VCCB is set to 3.3 V. The device maintains full functionality including 100 Mbps data rate, 4.6-V I/O tolerance, and VCC isolation - enabling direct interface between ultra-low-power cores and legacy 3.3-V peripherals.
What is the thermal performance of SN74AVC20T245DGVR in its TVSOP package?
The SN74AVC20T245DGVR in TVSOP-DGV package has a junction-to-ambient thermal resistance (θJA) of 48°C/W, measured per JESD 51-7. This enables continuous 20-bit operation at 85°C ambient with typical power dissipation below 50 mW - verified across all VCCA/VCCB combinations from 1.2 V to 3.3 V.
How does the VCC isolation feature protect system buses during power sequencing?
The VCC isolation feature in SN74AVC20T245DGVR forces both A and B ports into high-impedance state if either VCCA or VCCB drops to GND - preventing bus contention, current backflow, or unintended logic states during staggered power-up/down sequences common in multi-rail systems like server motherboards or automotive ECUs.
SN74AVC20T245DGVR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74AVC
- Package/Case:
- 56-TFSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Translation Transceiver
- Number of Elements:
- 2
- Number of Bits per Element:
- 10
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 12mA, 12mA
- Voltage - Supply:
- 1.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TVSOP
SN74AVC20T245DGVR FAQ
1.How can I place an order for SN74AVC20T245DGVR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74AVC20T245DGVR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74AVC20T245DGVR reliable?
The price and inventory of SN74AVC20T245DGVR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74AVC20T245DGVR is usually 5 days.
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Once your SN74AVC20T245DGVR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74AVC20T245DGVR?
For technical support, including SN74AVC20T245DGVR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74AVC20T245DGVR requirements.
6.How does Aetrix verify that SN74AVC20T245DGVR is sourced from the original manufacturer or authorized distributors?
All SN74AVC20T245DGVR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74AVC20T245DGVR meets industry standards.
7.What is the process for return or replacement of SN74AVC20T245DGVR?
All SN74AVC20T245DGVR units undergo pre-shipment inspection (PSI). If there is an issue with SN74AVC20T245DGVR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74AVC20T245DGVR part is unused and in its original packaging.
Return procedure for SN74AVC20T245DGVR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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