Texas Instruments SN74AVC2T45DCURG4

Overview

SN74AVC2T45DCURG4 from Texas Instruments is a 2-bit dual-supply bus transceiver enabling bidirectional voltage-level translation between 1.2V, 1.5V, 1.8V, 2.5V, and 3.3V domains. It features independent VCCA (1.2–3.6V) and VCCB (1.2–3.6V) rails, 4.6V I/O overvoltage tolerance, Ioff partial-power-down support, and 500Mbps max data rate (1.8V→3.3V). It is used in mobile SoC interconnects where mixed-voltage subsystems require reliable, low-latency signal routing.

For engineers reviewing the SN74AVC2T45DCURG4 datasheet, SN74AVC2T45DCURG4 pinout, SN74AVC2T45DCURG4 application, or SN74AVC2T45DCURG4 equivalent, key selection criteria include dual-rail level-shifting capability, DIR-controlled directionality, VCC isolation behavior, Ioff compliance for hot-swap systems, and NanoFree™ VSSOP-8 package compatibility with high-density portable PCB layouts.

Technical Context

The SN74AVC2T45DCURG4 implements a non-inverting, asynchronous bidirectional transceiver architecture with separate A-port (VCCA-referenced) and B-port (VCCB-referenced) I/O banks. Direction control is asserted via a single DIR input referenced to VCCA, determining whether data flows A→B (DIR = HIGH) or B→A (DIR = LOW).

Its VCC isolation feature forces both ports into high-impedance when either VCCA or VCCB is at GND, preventing bus contention during power sequencing. The device maintains active input receivers on both sides at all times, requiring externally applied logic levels on unused pins to avoid CMOS leakage.

Key Specifications

Pinout & Package

SN74AVC2T45DCURG4 uses the DCU package: 8-pin Very Thin Shrink Small-Outline Package (VSSOP), body size 2.30mm × 2.00mm, 0.5mm pitch, exposed pad not present.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus transceiver applications.

Compared with SN74LVC2T45DCUR and TXS0102DCUR, SN74AVC2T45DCURG4 uniquely combines VCC isolation, 4.6V I/O tolerance, and 500Mbps performance-making it optimal for high-reliability, mixed-voltage SoC interconnects where power sequencing and robustness are design constraints.

Availability

SN74AVC2T45DCURG4 is available at Aetrix Electronics and suitable for mobile SoC interconnect, server memory subsystem, notebook platform power management, and industrial edge controller I/O expansion requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for SN74AVC2T45DCURG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions for industrial, automotive, personal electronics, and communications markets.

The SN74AVC2T45 product line delivers dual-rail, bidirectional level-shifting transceivers optimized for low-voltage, high-speed interconnects in portable and high-density computing platforms.

FAQ

What is the function of the DIR pin on the SN74AVC2T45DCURG4?

The DIR pin on the SN74AVC2T45DCURG4 controls data direction: when DIR is HIGH (referenced to VCCA), data flows from A ports to B ports; when DIR is LOW, data flows from B ports to A ports. It is not an enable/disable pin-both A and B ports remain input-active regardless of DIR state, and unused inputs must be terminated to avoid CMOS leakage. This behavior is explicitly defined in the functional table of the SN74AVC2T45DCURG4 datasheet.

Can SN74AVC2T45DCURG4 translate between 1.2V and 3.3V rails?

Yes, SN74AVC2T45DCURG4 supports 1.2V ↔ 3.3V bidirectional level-shifting. With VCCA = 1.2V and VCCB = 3.3V, it achieves 240Mbps max data rate. Input thresholds on each port track its respective supply (e.g., B-port inputs recognize logic HIGH at ≥0.7×VCCB), and output drive levels follow the local VCC rail. This capability is confirmed in Section 5.3 (Recommended Operating Conditions) and Table 5-1 of the SN74AVC2T45DCURG4 datasheet.

Does SN74AVC2T45DCURG4 support partial power-down operation?

Yes, SN74AVC2T45DCURG4 supports partial power-down via its Ioff feature. When either VCCA or VCCB is at 0V, the Ioff circuitry disables all outputs, limiting off-state current to ±5µA (max) and preventing damaging back-current flow. This is validated in Section 5.5 (Electrical Characteristics) under the Ioff parameter and is critical for hot-plug and power-gated subsystems using the SN74AVC2T45DCURG4.

What is the significance of VCC isolation in SN74AVC2T45DCURG4?

VCC isolation in SN74AVC2T45DCURG4 ensures that if either VCCA or VCCB is driven to GND (e.g., during power sequencing or fault), both A and B ports enter a high-impedance state. This prevents false logic assertion on either bus and eliminates contention risks. The feature is implemented at the silicon level and verified in the Absolute Maximum Ratings and Functional Block Diagram sections of the SN74AVC2T45DCURG4 datasheet.

Which package does SN74AVC2T45DCURG4 use, and what are its key mechanical attributes?

SN74AVC2T45DCURG4 uses the DCU package: an 8-pin VSSOP (Very Thin Shrink Small-Outline Package) with 2.30mm × 2.00mm body size and 0.5mm lead pitch. It is part of TI's NanoFree™ family, where the silicon die serves as the package substrate-reducing parasitics and improving thermal resistance (RθJA = 246.9°C/W). This package is documented in Section 11 (Mechanical, Packaging, and Orderable Information) of the SN74AVC2T45DCURG4 datasheet.