Texas Instruments SN74AVC2T45YZPR

Overview

SN74AVC2T45YZPR from Texas Instruments is a 2-bit dual-supply bus transceiver enabling bidirectional voltage-level translation between 1.2V, 1.5V, 1.8V, 2.5V, and 3.3V domains. It features independent VCCA (1.2–3.6V) and VCCB (1.2–3.6V) rails, 4.6V I/O overvoltage tolerance, Ioff partial-power-down support, and VCC isolation. It is used in smartphone interconnects between application processors and memory or peripheral ICs.

For engineers reviewing the SN74AVC2T45YZPR datasheet, SN74AVC2T45YZPR pinout, SN74AVC2T45YZPR application, or SN74AVC2T45YZPR equivalent, key selection criteria include dual-rail level-shifting capability, DSBGA-8 package footprint compatibility, DIR-controlled directionality, 500Mbps max data rate (1.8V→3.3V), and guaranteed Ioff leakage (<5µA) during power sequencing.

Technical Context

This device implements a non-inverting, asynchronous bidirectional transceiver architecture with separate A-port (VCCA-referenced) and B-port (VCCB-referenced) I/O banks. Direction control is managed solely by the DIR input referenced to VCCA - logic low enables B→A transmission; logic high enables A→B transmission.

The internal circuitry maintains active input receivers on both ports at all times, requiring externally applied valid logic levels to avoid CMOS leakage. VCC isolation ensures both ports enter high-impedance state if either VCCA or VCCB is driven to GND, preventing bus contention during power-up/down sequences.

Key Specifications

Pinout & Package

SN74AVC2T45YZPR uses the YZP package: 8-pin DSBGA with 0.5mm pitch, body size 1.89mm × 0.89mm, bottom-terminal configuration optimized for space-constrained mobile PCBs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus transceiver applications.

Compared with SN74LVC2T45YZPR and TXS0102DCUR, SN74AVC2T45YZPR delivers the highest bandwidth, deterministic DIR-based control, and VCC isolation - making it the preferred choice for high-reliability, mixed-voltage mobile SoC interconnects where timing, sequencing, and robustness are critical.

Availability

SN74AVC2T45YZPR is available at Aetrix Electronics and suitable for smartphone baseband interconnects, server memory buffer interfaces, and notebook platform controller hubs requiring stable component supply, full traceability, and long-term lifecycle support.

Supply support for SN74AVC2T45YZPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and connectivity technologies for industrial, automotive, and consumer markets.

SN74AVC2T45YZPR belongs to TI's AVC (Advanced Very-low-voltage CMOS) logic family, designed specifically for ultra-low-voltage bidirectional level translation in space- and power-constrained portable electronics.

FAQ

What is the maximum supported data rate for SN74AVC2T45YZPR when translating from 1.8V to 3.3V?

The SN74AVC2T45YZPR supports up to 500Mbps in the 1.8V-to-3.3V direction, as specified in the official Texas Instruments datasheet SCES531N. This performance is validated under recommended operating conditions with matched load capacitance and proper PCB layout. The SN74AVC2T45YZPR achieves this using optimized driver strength and low-propagation-delay architecture tailored for high-speed mobile interconnects.

Does SN74AVC2T45YZPR require external pull-up resistors on its I/O lines?

No, SN74AVC2T45YZPR does not require external pull-up resistors for normal operation - its CMOS inputs are actively biased and do not float. However, unused I/O pins must be tied to VCCA, VCCB, or GND to prevent excess leakage current; leaving them unconnected violates the absolute maximum ratings. The SN74AVC2T45YZPR itself contains no internal pull-ups or pull-downs.

Can SN74AVC2T45YZPR operate with VCCA = 1.2V and VCCB = 2.5V simultaneously?

Yes, SN74AVC2T45YZPR is explicitly rated for independent operation across the full 1.2V–3.6V range on both VCCA and VCCB. The datasheet confirms functional operation and switching characteristics for all combinations including 1.2V/2.5V, with typical propagation delay of 2.7ns (A→B) and 3.4ns (B→A) at TA = 25°C. The SN74AVC2T45YZPR maintains I/O voltage tolerance and Ioff compliance across this configuration.

What is the thermal resistance (RθJA) of the SN74AVC2T45YZPR in its YZP package?

The junction-to-ambient thermal resistance (RθJA) for SN74AVC2T45YZPR in the YZP (DSBGA-8) package is 105.8°C/W, as published in Section 5.4 of the TI datasheet SCES531N. This value assumes standard JEDEC JESD51-2 PCB mounting conditions (2-layer board, 1-in² copper). The low RθJA reflects the DSBGA's superior thermal path via solder balls directly to the PCB, critical for sustained operation in thermally dense smartphone modules.

How does the VCC isolation feature function in SN74AVC2T45YZPR during power sequencing?

The VCC isolation feature in SN74AVC2T45YZPR forces both A and B ports into high-impedance state whenever either VCCA or VCCB falls to GND - regardless of DIR state or input logic levels. This prevents false logic assertion or bus contention during asymmetric power-up/down. Verified leakage remains below 5µA in this state, ensuring system-level safety. The SN74AVC2T45YZPR implements this via internal voltage-monitoring circuitry tied to each supply rail.