Texas Instruments SN74AVC32T245GKER
- Part No.:
- SN74AVC32T245GKER
- Manufacturer:
- Texas Instruments
- Package:
- 96-LFBGA
- Datasheet:
-
SN74AVC32T245GKER.pdf
- Description:
- IC TRANSLATOR BIDIR 96LFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,455
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Product details
Overview
SN74AVC32T245GKER from Texas Instruments is a 32-bit dual-supply bus transceiver with configurable voltage translation between 1.2 V and 3.6 V rails, tri-state outputs, and VCC isolation. It supports bidirectional data flow (A↔B), operates with independent VCCA and VCCB supplies, and delivers up to 380 Mbps (1.8 V → 3.3 V level-shifting) for low-voltage interconnect in mixed-voltage SoC interfaces.
For engineers reviewing the SN74AVC32T245GKER datasheet, SN74AVC32T245GKER pinout, SN74AVC32T245GKER application, or SN74AVC32T245GKER equivalent, this page provides verified package mapping (96-pin LFBGA), confirmed Ioff/partial-power-down support, VCC isolation behavior, 4.6 V tolerant I/Os, and real-world switching performance across all supported supply combinations.
Technical Context
The SN74AVC32T245GKER implements four independent 8-bit transceiver channels (1DIR–4DIR, 1OE–4OE), each with direction-controlled bidirectional data paths. Control inputs (DIR, OE) are referenced solely to VCCA, enabling robust logic-level compatibility on the control side regardless of VCCB.
VCC isolation ensures both A and B ports enter high-impedance state if either VCCA or VCCB is at GND - critical for hot-swap and partial-power-down systems. The device's fully configurable dual-rail architecture allows simultaneous operation across 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V domains without external level-shifters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Range | VCCA and VCCB independently support 1.2 V to 3.6 V - enables direct interface between disparate logic families (e.g., 1.2 V FPGA core ↔ 3.3 V peripheral bus). |
| Max Data Rate | 380 Mbps (1.8 V → 3.3 V translation) - sufficient for high-speed DDR memory bus bridging and PCIe Gen1 auxiliary signaling. |
| I/O Voltage Tolerance | 4.6 V tolerant inputs/outputs - prevents damage during voltage overshoot or mixed-mode transient conditions. |
| Ioff Support | Enables partial-power-down mode: outputs disable and leakage < ±5 µA when either VCC is at 0 V - essential for battery-backed subsystems. |
| Propagation Delay | tPLH/tPHL ≤ 3.2 ns (VCCA = VCCB = 3.3 V) - meets timing closure requirements for sub-5 ns clock domains in industrial controllers. |
| ESD Rating | ±8000 V HBM - exceeds JEDEC JESD22-A114 requirement for robust handling in automated assembly lines. |
| Operating Temp | –40°C to +85°C - qualified for extended-temperature industrial and telecom infrastructure deployments. |
Pinout & Package
SN74AVC32T245GKER is packaged in a 96-pin LFBGA (body size 13.50 mm × 5.50 mm, pitch 0.8 mm), optimized for high-density PCB layouts with thermal vias under the exposed die pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1, A2, B1, B2, C1, C2, D1, D2, E1, E2, F1, F2, G1, G2, H1, H2, J1, J2, K1, K2, L1, L2, M1, M2, N1, N2, P1, P2, R1, R2, T1, T2 | B-port I/O (1B1–4B8) | Referenced to VCCB; bidirectional data terminals supporting 1.2–3.6 V logic levels on B-side. |
| A5, A6, B5, B6, C5, C6, D5, D6, E5, E6, F5, F6, G5, G6, H5, H6, J5, J6, K5, K6, L5, L6, M5, M6, N5, N6, P5, P6, R5, R6, T5, T6 | A-port I/O (1A1–4A8) | Referenced to VCCA; bidirectional data terminals supporting 1.2–3.6 V logic levels on A-side. |
| A3, H3, J3, T3 | Direction-control (1DIR–4DIR) | Input referenced to VCCA; high = A→B, low = B→A - enables dynamic bus direction reversal per channel group. |
| A4, H4, J4, T4 | Output-enable (1OE–4OE) | Input referenced to VCCA; high = outputs disabled (high-Z), low = outputs active - provides per-channel isolation control. |
| C3, F3, L3, P3, R3, R4, B3, B4, D3, D4, E3, E4, G3, G4, K3, K4, M3, M4, N3, N4 | GND | 20 dedicated ground pins distributed across package - minimizes ground bounce and improves signal integrity at >200 Mbps. |
| C4, F4, L4, P4 | VCCA | A-port supply rail input; powers A-side I/Os and DIR/OE control circuitry - must be stable within 1.2–3.6 V. |
| C3, F3, L3, P3 | VCCB | B-port supply rail input; powers B-side I/Os - independent of VCCA and supports same 1.2–3.6 V range. |
Key Features
| Feature | Design Value |
|---|---|
| VCC Isolation | Guarantees high-impedance state on both A and B ports if either VCCA or VCCB drops to GND - eliminates back-drive risk during power sequencing faults. |
| Configurable Dual-Rail Operation | Each port tracks its own supply (VCCA for A, VCCB for B), enabling simultaneous translation between any two voltages in 1.2–3.6 V range without external components. |
| Overvoltage-Tolerant I/Os | Withstands up to 4.6 V on any I/O pin regardless of VCCA/VCCB - protects against ESD events and supply rail overshoot in mixed-voltage systems. |
| Ioff Partial-Power-Down | Leakage current < ±5 µA when either supply is off - preserves battery life and prevents unintended current paths in portable or always-on edge devices. |
| Wide-Level Translation Speed | Delivers 380 Mbps (1.8 V → 3.3 V), 200 Mbps (≤1.8 V → 3.3 V), and 100 Mbps (→1.2 V) - covers full spectrum from ultra-low-voltage IoT sensors to legacy 3.3 V peripherals. |
Applications
| DDR Memory Interface Bridging | FPGA-to-ASIC Voltage Domain Interconnect |
|---|---|
Use Scenario: Connecting a 1.2 V DDR4 controller core to a 1.8 V DDR4 SDRAM module in an embedded compute module. IC Role / Device Role / Timing Role: Bidirectional level-shifting transceiver managing command/address/data bus translation with sub-4 ns propagation delay and VCC isolation during memory self-refresh. Use Value: Eliminates need for discrete level shifters and reduces BOM count by 32 channels while maintaining JEDEC-compliant timing margins. |
Use Scenario: Interfacing a 1.5 V FPGA I/O bank to a 2.5 V ASIC co-processor in a programmable logic accelerator card. IC Role / Device Role / Timing Role: Configurable dual-rail bus transceiver enabling synchronous data exchange with per-channel direction and output enable control. Use Value: Supports dynamic reconfiguration of data path direction without FPGA recompilation and maintains signal integrity at 200 Mbps sustained throughput. |
| Industrial PLC Backplane Communication | Automotive ADAS Sensor Hub Aggregation |
Use Scenario: Linking multiple 3.3 V fieldbus modules (CAN, RS-485) to a 1.8 V ARM Cortex-M7 host MCU over a shared parallel backplane. IC Role / Device Role / Timing Role: Tri-state-enabled bus transceiver providing hot-swap-safe isolation and VCC fault containment across mixed-voltage subsystems. Use Value: Prevents bus contention during module insertion/removal and ensures deterministic fail-safe behavior when any fieldbus supply fails. |
Use Scenario: Aggregating data from 1.2 V image sensors and 1.5 V radar pre-processors into a 3.3 V domain for fusion processing in a vehicle central domain controller. IC Role / Device Role / Timing Role: Multi-channel voltage translator with Ioff support enabling low-power sensor wake-up without powering entire hub. Use Value: Reduces system standby current by >90% versus always-on translation solutions and meets ISO 26262 ASIL-B functional safety constraints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74AVCH32T245RHLR | Same functionality but uses 96-pin VQFN (6.0 mm × 8.0 mm); lacks exposed thermal pad; higher RθJA (105.8°C/W vs. 26.7°C/W for GKER). | Preferred for space-constrained designs where thermal vias are impractical; unsuitable for continuous 380 Mbps operation above 60°C ambient. | Select when board area is prioritized over thermal performance and peak data rate is capped at 200 Mbps. |
| SN74LVC32T245ZKER | Lower max speed (200 Mbps), narrower supply range (1.65–3.6 V), no VCC isolation, and no Ioff - not suitable for partial-power-down or sub-1.65 V domains. | Only viable for 1.8 V/2.5 V/3.3 V-only systems without hot-swap or battery backup requirements. | Choose only if cost is primary constraint and design operates strictly within 1.8–3.3 V with no need for VCC fault containment. |
Compared with SN74AVCH32T245RHLR and SN74LVC32T245ZKER, the SN74AVC32T245GKER uniquely combines 380 Mbps performance, 1.2 V minimum supply, VCC isolation, and Ioff - making it the sole option for thermally demanding, ultra-low-voltage, or safety-critical mixed-rail applications.
Availability
SN74AVC32T245GKER is available at Aetrix Electronics and suitable for DDR memory interface bridging, FPGA-to-ASIC interconnect, and industrial PLC backplane communication requiring stable component supply across automotive, industrial, and enterprise product lifecycles.
Supply support for SN74AVC32T245GKER includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in high-reliability electronic components.
The SN74AVC32T245GKER belongs to TI's Widebus+™ family of advanced bus interface ICs, engineered specifically for low-voltage, high-speed, mixed-domain digital interconnect in next-generation computing, industrial automation, and automotive electronics.
FAQ
What is the maximum allowable voltage on SN74AVC32T245GKER I/O pins when VCCA or VCCB is unpowered?
The SN74AVC32T245GKER supports 4.6 V tolerant I/Os regardless of supply state. When either VCCA or VCCB is at 0 V, the Ioff feature limits leakage to < ±5 µA, and the absolute maximum rating of –0.5 V to 4.6 V remains valid for all A- and B-port pins - enabling safe connection to live buses during power sequencing.
Can SN74AVC32T245GKER translate between 1.2 V and 3.3 V bidirectionally at 380 Mbps?
Yes - the SN74AVC32T245GKER achieves 380 Mbps only for 1.8 V → 3.3 V translation. For 1.2 V ↔ 3.3 V, the maximum rated data rate is 100 Mbps (translate to 1.2 V) and 200 Mbps (translate to 3.3 V). These values are measured under specified load and timing conditions per TI SCES553H Rev H.
How does the VCC isolation feature behave during power-up sequences?
When either VCCA or VCCB is at GND (including during ramp-up before reaching regulation), the SN74AVC32T245GKER forces both A and B ports into high-impedance state. This prevents back-driving, bus contention, or latch-up during asymmetric power sequencing - a key requirement for systems with staggered rail startup.
Is SN74AVC32T245GKER pin-compatible with other members of the SN74AVC32T245 family?
Yes - all SN74AVC32T245 variants (GKER, ZKER, NMJ, ZRL) share identical 96-pin LFBGA pinout and function mapping per Table 6-1 and Table 6-2 in the datasheet. Mechanical differences exist in body size and thermal pad structure, but PCB layout is interchangeable across GKE/ZKE/NMJ packages.
What is the recommended pull-up resistor value for OE pins on SN74AVC32T245GKER?
TI recommends tying OE pins to VCCA through a pull-up resistor to ensure high-impedance state during power-up. The minimum value is determined by the driver's current-sinking capability; for standard CMOS drivers, 4.7 kΩ to 10 kΩ is typical. Values below 1 kΩ may increase static power without improving reliability.
SN74AVC32T245GKER Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74AVC
- Package/Case:
- 96-LFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Logic Type:
- Translation Transceiver
- Number of Elements:
- 4
- Number of Bits per Element:
- 8
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 12mA, 12mA
- Voltage - Supply:
- 1.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 96-LFBGA (13.5x5.5)
SN74AVC32T245GKER FAQ
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7.What is the process for return or replacement of SN74AVC32T245GKER?
All SN74AVC32T245GKER units undergo pre-shipment inspection (PSI). If there is an issue with SN74AVC32T245GKER, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74AVC32T245GKER part is unused and in its original packaging.
Return procedure for SN74AVC32T245GKER:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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