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Texas Instruments SN74CB3Q16210DGG
- Part No.:
- SN74CB3Q16210DGG
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- -
- Datasheet:
-
SN74CB3Q16210DGG.pdf
- Description:
- SWITCH BUS 20BIT FET 48-TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:6,280
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Product details
Overview
SN74CB3Q16210DGG from Texas Instruments is a 20-bit, dual 10-bit FET bus switch with charge-pump-enhanced gate drive, delivering 5 Ω typical ON-state resistance (ron), rail-to-rail 0–5 V switching at 2.5 V/3.3 V VCC, and 500 MHz high-bandwidth data path capability. It supports bidirectional signal routing in PCI interfaces, memory interleaving, and bus isolation applications.
For engineers reviewing the SN74CB3Q16210DGG datasheet, SN74CB3Q16210DGG pinout, SN74CB3Q16210DGG application, or SN74CB3Q16210DGG equivalent, key selection criteria include its Ioff-enabled partial-power-down operation, 4 pF typical OFF-state I/O capacitance, 0.15 ns propagation delay, 20 MHz maximum OE switching frequency, and TSSOP-48 package compatibility with high-density PCB layouts.
Technical Context
The SN74CB3Q16210DGG implements two independent 10-bit FET bus switches, each controlled by dedicated OE inputs (1OE, 2OE), enabling flexible configuration as either dual 10-bit or single 20-bit switch. Its internal charge pump elevates pass-gate voltage to maintain flat ron across input voltage range (0–5 V) and supply range (2.3–3.6 V).
Each switch channel provides near-zero propagation delay via low-capacitance design (Cio(OFF) = 4 pF), rail-to-rail analog/digital signal handling, and undershoot clamp diodes on all data/control pins. Ioff circuitry ensures backflow protection during partial power-down, supporting system-level power sequencing without external isolation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.3 V to 3.6 V - Enables interoperability with 2.5 V and 3.3 V logic domains while maintaining robust noise margin. |
| ron (Typical) | 5 Ω - Ensures minimal signal attenuation and distortion for high-speed digital/analog signals up to 500 MHz. |
| Cio(OFF) | 4 pF typical - Reduces capacitive loading on driven buses, preserving signal integrity and timing margins. |
| tpd | 0.15 ns - Delivers near-instantaneous bidirectional signal transfer with negligible latency impact on timing-critical paths. |
| fOE Max | 20 MHz - Supports fast enable/disable cycling for dynamic bus gating in burst-mode or time-sliced architectures. |
| Ioff | 1 µA at VCC = 0 - Prevents damaging current flow from live I/O lines into powered-down subsystems during hot-swap or partial shutdown. |
| VI/O Range | 0 V to 5.5 V - Allows seamless interfacing between mixed-voltage systems (e.g., 1.8 V FPGA core to 5 V legacy peripheral). |
Pinout & Package
TSSOP-48 (DGG) package: 12.6 mm × 6.2 mm × 1.2 mm body, 0.5 mm pitch, lead-free NiPdAu finish, MSL Level-1, RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A1–1A10, 2A1–2A10 | Input/Output Port A (Group 1 & 2) | Primary data terminals for first and second 10-bit switch banks; bidirectional, 5-V tolerant, rail-to-rail capable. |
| 1B1–1B10, 2B1–2B10 | Input/Output Port B (Group 1 & 2) | Complementary data terminals connected to A ports when respective OE is low; identical electrical characteristics to A ports. |
| 1OE, 2OE | Output Enable Inputs | Active-low controls for each 10-bit bank; must be pulled up to VCC during power-up/down to guarantee high-impedance state. |
| VCC | Supply Voltage | Single 2.3–3.6 V supply powers internal charge pump and logic; no separate analog/digital rails required. |
| GND (Pins 8, 17, 35, 46) | Ground Reference | Four dedicated ground pins minimize ground bounce and improve noise immunity in high-speed switching. |
| NC (Pins 1, 48) | No Internal Connection | Unbonded pads; must remain unconnected to avoid parasitic coupling or mechanical stress on die attach. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail analog/digital switching | Supports 0–5 V signal swing at 2.5 V or 3.3 V VCC - eliminates level-shifter requirement in mixed-voltage interconnects. |
| Charge-pump gate drive | Maintains flat 5 Ω ron across full VI/O range - ensures consistent signal fidelity regardless of input voltage or process variation. |
| Ioff partial-power-down protection | Blocks >99.9% of backflow current when VCC = 0 - enables safe hot-plug operation and modular power management. |
| Undershoot clamp diodes | Integrated ESD protection on all I/O and control pins - meets JESD22-A114B (2000 V HBM) without external components. |
| Low dynamic power consumption | ICC = 1 mA typical at 3.6 V - reduces thermal load in dense board layouts and extends battery life in portable systems. |
Applications
| PCI Interface | Differential Signal Interface |
|---|---|
Use Scenario: Isolating PCI Express lanes during hot-plug insertion or power-state transitions in server backplanes. IC Role / Device Role / Timing Role: Bidirectional bus switch enabling/disabling data path between root complex and endpoint without signal reflection or timing skew. Use Value: Eliminates need for discrete MOSFET arrays and level shifters while maintaining sub-0.2 ns propagation delay and 500 MHz bandwidth. | Use Scenario: Gating LVDS or RSDS differential pairs in programmable logic-based video timing controllers. IC Role / Device Role / Timing Role: Low-capacitance, matched-path analog switch preserving differential impedance and common-mode rejection. Use Value: Cio(OFF) = 4 pF minimizes skew between complementary signals; ron matching <0.5 Ω ensures <1 ps inter-pair skew. |
| Memory Interleaving | Bus Isolation |
Use Scenario: Dynamically routing address/data between dual DDR3 memory channels in embedded networking processors. IC Role / Device Role / Timing Role: Dual 10-bit switch configured as 20-bit path to alternate memory access between banks under software control. Use Value: Flat ron and 0.15 ns tpd prevent setup/hold violations across 800 MT/s DDR3 interfaces. | Use Scenario: Electrically isolating test instrumentation from production DUT during automated functional testing. IC Role / Device Role / Timing Role: High-impedance break-before-make switch decoupling stimulus and measurement paths during reconfiguration. Use Value: Ioff <1 µA prevents leakage-induced false triggers; 5.5 V VI/O tolerance accommodates ±5 V test signal ranges. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBT16210DGGR | No internal charge pump; ron = 6 Ω typical, higher VCC dependency; max fOE = 15 MHz. | Lacks rail-to-rail support below 3.3 V; unsuitable for 1.8 V/2.5 V mixed-signal interfaces. | Lower-cost option where 500 MHz bandwidth and sub-5 Ω ron are not required. |
| SN74LVC1G3157DCKR | Single-channel SPDT, 5-pin SC70; ron = 10 Ω typical; Cio(OFF) = 5.5 pF; VCC = 1.65–5.5 V. | Not scalable to 20-bit width; requires 20 devices for equivalent functionality; higher board area and routing complexity. | Only viable for ultra-low-pin-count prototypes or space-constrained single-line gating. |
Compared with SN74CB3Q16210DGG, SN74CBT16210DGGR trades bandwidth and voltage flexibility for cost, while SN74LVC1G3157DCKR sacrifices integration density and performance for package miniaturization - neither matches the combination of 20-bit width, 5 Ω ron, and 0–5 V rail-to-rail operation.
Availability
SN74CB3Q16210DGG is available at Aetrix Electronics and suitable for PCI interface design, memory interleaving systems, and bus isolation circuits requiring stable component supply, long-term lifecycle support, and RoHS-compliant TSSOP packaging.
Supply support for SN74CB3Q16210DGG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 50 years of innovation in high-performance interface solutions.
The SN74CB3Q16210DGG belongs to TI's Widebus™ family of high-bandwidth FET bus switches, engineered specifically for broadband communications, networking infrastructure, and data-intensive computing systems demanding low-latency, low-distortion signal routing.
FAQ
What is the maximum signal frequency supported by the SN74CB3Q16210DGG?
The SN74CB3Q16210DGG supports a high-bandwidth data path up to 500 MHz, as confirmed in the device's official datasheet (SCDS166). This rating reflects its optimized FET architecture, low 5 Ω typical ON-state resistance, and 4 pF OFF-state I/O capacitance - all contributing to minimal signal distortion and propagation delay (0.15 ns) in high-speed digital and analog applications.
Does the SN74CB3Q16210DGG support partial power-down operation?
Yes, the SN74CB3Q16210DGG features Ioff circuitry that actively blocks current backflow when VCC = 0 V, limiting Ioff to 1 µA typical. This allows safe operation in partial-power-down modes - for example, when interfacing live 5 V buses to a powered-down processor domain - without risk of damage or unintended signal coupling.
Can the SN74CB3Q16210DGG operate with 1.8 V logic levels on its data I/Os?
Yes, the SN74CB3Q16210DGG supports 0 V to 5 V signaling on its data I/O ports regardless of VCC (2.3–3.6 V), explicitly including 1.8 V logic levels. Its rail-to-rail switching capability enables direct connection to 1.8 V, 2.5 V, 3.3 V, and 5 V systems without external level shifters, as verified in the "Data I/Os Support 0 V to 5 V Signaling Levels" specification.
What is the recommended pull-up resistor value for OE pins on the SN74CB3Q16210DGG?
The datasheet specifies that OE pins should be tied to VCC through a pull-up resistor during power-up/down to ensure high-impedance state. The minimum resistor value depends on the driver's current-sinking capability; TI recommends verifying against the specific driving source's IOL rating - for standard 3.3 V CMOS drivers (IOL ≥ 8 mA), a 10 kΩ resistor is commonly used and validated in reference designs for SN74CB3Q16210DGG.
Is the SN74CB3Q16210DGG pin-compatible with other members of the CB3Q family?
Yes, the SN74CB3Q16210DGG shares identical pinout and footprint with other CB3Q-series 48-pin variants (e.g., SN74CB3Q16210DGVR, SN74CB3Q16210DL), as confirmed by TI's package drawings and ordering information. All use the same TSSOP/DGV/DL 48-pin layout with NC on pins 1 and 48, and identical terminal assignments for A/B ports, OE, VCC, and GND.
SN74CB3Q16210DGG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Type:
- -
- Circuit:
- -
- Independent Circuits:
- -
- Current - Output High, Low:
- -
- Voltage Supply Source:
- -
- Voltage - Supply:
- -
- Operating Temperature:
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- Grade:
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- Supplier Device Package:
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SN74CB3Q16210DGG FAQ
1.How can I place an order for SN74CB3Q16210DGG through Aetrix?
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For technical support, including SN74CB3Q16210DGG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CB3Q16210DGG requirements.
6.How does Aetrix verify that SN74CB3Q16210DGG is sourced from the original manufacturer or authorized distributors?
All SN74CB3Q16210DGG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CB3Q16210DGG meets industry standards.
7.What is the process for return or replacement of SN74CB3Q16210DGG?
All SN74CB3Q16210DGG units undergo pre-shipment inspection (PSI). If there is an issue with SN74CB3Q16210DGG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CB3Q16210DGG part is unused and in its original packaging.
Return procedure for SN74CB3Q16210DGG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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