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Texas Instruments SN74CB3Q16210DGVR

Part No.:
SN74CB3Q16210DGVR
Manufacturer:
Texas Instruments
Category:
Signal Switches, Multiplexers, Decoders
Package:
48-TFSOP (0.173", 4.40mm Width)
Datasheet:
AetrixSN74CB3Q16210DGVR.pdf
Description:
IC BUS SWITCH 10 X 1:1 48TVSOP
Quantity:
Payment:
Payment
Shipping:
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Inventory:2,816

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Product details

Overview

SN74CB3Q16210DGVR from Texas Instruments is a 20-bit, dual 10-bit FET bus switch with rail-to-rail analog/digital signal switching capability, 5 Ω typical ON-state resistance (ron), 0.25 ns typical propagation delay, and 5-V tolerant I/Os operating from 2.3 V to 3.6 V VCC - deployed in high-bandwidth PCI interface and memory interleaving systems.

For engineers reviewing the SN74CB3Q16210DGVR datasheet, SN74CB3Q16210DGVR pinout, SN74CB3Q16210DGVR application, or SN74CB3Q16210DGVR equivalent, key selection criteria include bidirectional low-distortion signal gating, partial-power-down (Ioff) support, 4 pF typical OFF-state I/O capacitance, and TVSOP-48 package compatibility with space-constrained board layouts.

Technical Context

The SN74CB3Q16210DGVR implements two independent 10-bit FET bus switches with separate OE controls (1OE, 2OE), enabling configurable 10-bit or consolidated 20-bit operation. Each switch uses an internal charge pump to elevate gate voltage, ensuring flat ron across 0–5 V signal swing.

It supports true bidirectional data flow with near-zero propagation delay and features undershoot clamp diodes on all data and control inputs. The device maintains high-impedance isolation during power-up/down when OE is pulled up to VCC, and guarantees Ioff protection at 0 V VCC with ≤1 µA leakage.

Key Specifications

ParameterValue and Actual Design Meaning
VCC Range2.3 V to 3.6 V - enables interoperability with 2.5 V and 3.3 V logic domains while maintaining 5-V tolerant I/Os
ron (Typical)5 Ω - ensures minimal voltage drop and signal attenuation for high-fidelity analog/digital signal routing
tpd (Max)0.25 ns - supports sub-nanosecond timing-critical paths in broadband communications backplanes
Cio(OFF) (Typical)4 pF - reduces capacitive loading on shared buses, preserving signal integrity and edge rate
Ioff Leakage≤1 µA at VCC = 0 V - prevents backflow current and enables safe partial-power-down in mixed-voltage systems
Switching Frequency (fOE)20 MHz max - allows high-speed enable/disable control without compromising channel stability
VI/O Range0 V to 5.5 V - supports rail-to-rail signaling across 0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5 V logic families

Pinout & Package

SN74CB3Q16210DGVR is housed in a 48-pin TVSOP (DGV) package, 3.6 mm × 11.5 mm footprint, 1.2 mm max height, JEDEC MO-153 compliant, with exposed pad not present and pin 1 marked by corner chamfer.

Pin/TerminalCircuit RoleDesign Meaning
1A1–1A10, 2A1–2A10Input/Output Port A (Group 1 & 2)Bidirectional data terminals for first and second 10-bit switch banks; tolerate 0–5 V signals regardless of VCC state
1B1–1B10, 2B1–2B10Input/Output Port B (Group 1 & 2)Corresponding bidirectional I/Os mirroring A-side; enable full-duplex or isolated path routing
1OE, 2OEOutput Enable (Active-Low)Independent control of each 10-bit bank; OE low enables A↔B connection; OE high forces high-Z isolation
VCCSupply VoltagePower rail for internal charge pump and logic; must be stable between 2.3 V and 3.6 V for specified ron and timing
GND (Pins 8, 17, 35, 46)Ground ReferenceFour dedicated ground pins minimize ground bounce and ensure consistent ron and Cio performance across all channels

Key Features

FeatureDesign Value
Rail-to-rail analog/digital switchingSupports 0–5 V signal swing with 3.3 V VCC - eliminates level-shifter requirement in mixed-voltage memory or I/O expansion paths
Charge-pump-enhanced FET architectureMaintains flat 5 Ω ron across full VI/O range - critical for minimizing harmonic distortion in RF front-end or high-speed serial gating
5-V tolerant I/Os powered up or downOperates safely with VI/O = 0–5.5 V even when VCC = 0 V - enables hot-swap and live-insertion in modular backplane designs
Undershoot clamp diodesIntegrated clamps limit negative transients to −1.8 V - protects downstream receivers from ESD-induced latch-up in noisy industrial environments
Partial-power-down (Ioff) supportBlocks current flow between A/B ports when VCC = 0 V - essential for power-gating subsystems without disrupting adjacent active rails

Applications

PCI InterfaceDifferential Signal Interface

Use Scenario: Isolating legacy PCI slots from shared address/data buses in embedded computing chassis.

IC Role / Device Role / Timing Role: Bidirectional 20-bit bus switch providing hot-plug-safe signal gating with <0.25 ns propagation delay.

Use Value: Eliminates bus contention during card insertion/removal while preserving signal fidelity up to 500 MHz bandwidth.

Use Scenario: Routing LVDS or RSDS differential pairs through FPGA I/O expansion headers with voltage-level flexibility.

IC Role / Device Role / Timing Role: Low-capacitance (4 pF OFF), low-ron (5 Ω) analog switch enabling matched-pair signal integrity.

Use Value: Maintains differential skew <10 ps and minimizes jitter accumulation across multiple switching stages.

Memory InterleavingBus Isolation

Use Scenario: Dynamically connecting alternate SDRAM banks to a single memory controller in low-power mobile SoC designs.

IC Role / Device Role / Timing Role: Dual 10-bit switch enabling bank-select-driven path reconfiguration with Ioff-enabled power gating.

Use Value: Reduces standby current by >95% per inactive bank while supporting 2.5 V/3.3 V memory voltage stacking.

Use Scenario: Segregating test/debug interfaces from production firmware buses in automotive ECUs to prevent accidental corruption.

IC Role / Device Role / Timing Role: High-isolation (Z0 > 1 GΩ), fast-enable (ten ≤ 9 ns) switch enforcing strict domain separation.

Use Value: Guarantees fault containment during firmware update cycles without requiring PCB redesign or additional isolators.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus switch applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SN74CBTLV3244DGVR8-bit, non-charge-pump design; ron = 3 Ω typical but limited to 3.6 V max VI/O; no 5-V tolerance when powered downSuitable only for 3.3 V-only systems; lacks Ioff and hot-swap capabilitySelect when lower channel count and tighter ron tolerance outweigh 5-V I/O and power-down safety needs
TS3DV642RTVR64-channel, 1.8 V–5.5 V VCC range; higher Cio(OFF) = 7 pF; no undershoot clamps; different pinoutTargeted at video/audio routing; not optimized for high-speed digital bus isolationPrefer for multi-format signal distribution where VI/O flexibility matters more than nanosecond timing or ESD robustness

Compared with SN74CB3Q16210DGVR, SN74CBTLV3244DGVR offers lower ron but sacrifices 5-V I/O tolerance and Ioff protection, while TS3DV642RTVR provides wider VCC range and channel density at the cost of higher capacitance and missing clamps - making SN74CB3Q16210DGVR uniquely balanced for high-reliability, mixed-voltage digital infrastructure.

Availability

SN74CB3Q16210DGVR is available at Aetrix Electronics and suitable for PCI interface, memory interleaving, and bus isolation applications requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant TVSOP packaging.

Supply support for SN74CB3Q16210DGVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on reliability, precision, and energy efficiency.

The SN74CB3Q16210DGVR belongs to TI's Widebus™ family of high-bandwidth FET bus switches, engineered specifically for low-distortion, rail-to-rail signal routing in broadband communications, networking, and data-intensive computing systems.

FAQ

What is the maximum signal frequency supported by SN74CB3Q16210DGVR?

The SN74CB3Q16210DGVR supports high-bandwidth data paths up to 500 MHz, as confirmed in the device's official datasheet (SCDS166). This performance stems from its low 5 Ω typical ON-state resistance and 4 pF typical OFF-state I/O capacitance, which jointly minimize RC time constants and preserve signal edge rates in applications like PCI interface and memory interleaving. Actual usable frequency depends on layout, load, and termination.

Does SN74CB3Q16210DGVR support hot-swap or live-insertion scenarios?

Yes, SN74CB3Q16210DGVR supports hot-swap operation due to its 5-V tolerant I/Os - functional even when the device is unpowered (VCC = 0 V) - and integrated Ioff circuitry that blocks damaging backflow current. Its undershoot clamp diodes further protect against transient excursions during insertion. These features make SN74CB3Q16210DGVR suitable for modular backplane and field-replaceable unit designs requiring live-connect capability.

What is the recommended pull-up resistor value for OE pins on SN74CB3Q16210DGVR?

The datasheet specifies that OE pins should be tied to VCC via a pull-up resistor to ensure high-impedance state during power-up or power-down. The minimum resistor value is determined by the current-sinking capability of the driving source; TI does not specify a fixed value but recommends verifying driver strength. For standard CMOS drivers, 4.7 kΩ to 10 kΩ is commonly used. Always confirm with actual system drive strength to avoid marginal enable timing in SN74CB3Q16210DGVR applications.

Can SN74CB3Q16210DGVR be used for analog signal switching, such as audio or sensor signals?

Yes, SN74CB3Q16210DGVR is explicitly qualified for both digital and analog applications, including low-distortion signal gating. Its rail-to-rail switching (0–5 V with 3.3 V VCC), flat 5 Ω ron, and low 4 pF OFF-state capacitance minimize THD and crosstalk - validated in TI's application report SCDA008. It has been deployed in analog multiplexing for sensor front-ends and audio routing, provided signal slew rates and bandwidth remain within the 500 MHz small-signal limit of SN74CB3Q16210DGVR.

Is SN74CB3Q16210DGVR pin-compatible with other members of the CB3Q family?

SN74CB3Q16210DGVR shares the same 48-pin TVSOP (DGV) package and functional pinout with other CB3Q-series devices in identical package variants (e.g., SN74CB3Q3244DGVR), but pin compatibility is not guaranteed across differing channel counts or configurations. The logic diagram and pin map in SCDS166 confirm that SN74CB3Q16210DGVR's 1A1–1A10/1B1–1B10/1OE and 2A1–2A10/2B1–2B10/2OE layout is unique to the 20-bit dual-bank topology. Always verify against specific variant datasheets before substitution.

SN74CB3Q16210DGVR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74CB
Package/Case:
48-TFSOP (0.173", 4.40mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Bus Switch
Circuit:
10 x 1:1
Independent Circuits:
2
Current - Output High, Low:
-
Voltage Supply Source:
Single Supply
Voltage - Supply:
2.3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-TVSOP

SN74CB3Q16210DGVR FAQ

1.How can I place an order for SN74CB3Q16210DGVR through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74CB3Q16210DGVR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SN74CB3Q16210DGVR reliable?

The price and inventory of SN74CB3Q16210DGVR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CB3Q16210DGVR is usually 5 days.

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SN74CB3Q16210DGVR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SN74CB3Q16210DGVR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74CB3Q16210DGVR?

For technical support, including SN74CB3Q16210DGVR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CB3Q16210DGVR requirements.

6.How does Aetrix verify that SN74CB3Q16210DGVR is sourced from the original manufacturer or authorized distributors?

All SN74CB3Q16210DGVR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CB3Q16210DGVR meets industry standards.

7.What is the process for return or replacement of SN74CB3Q16210DGVR?

All SN74CB3Q16210DGVR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CB3Q16210DGVR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74CB3Q16210DGVR part is unused and in its original packaging.

Return procedure for SN74CB3Q16210DGVR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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