Texas Instruments SN74CB3Q16210DLR
- Part No.:
- SN74CB3Q16210DLR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 48-BSSOP (0.295", 7.50mm Width)
- Datasheet:
-
SN74CB3Q16210DLR.pdf
- Description:
- IC BUS SWITCH 10 X 1:1 48SSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SN74CB3Q16210DLR from Texas Instruments is a 20-bit, dual 10-bit high-bandwidth FET bus switch with rail-to-rail signal switching (0 V to 5 V), 5 Ω typical ON-state resistance (ron), 4 pF typical OFF-state I/O capacitance, and 0.15 ns typical propagation delay. It serves as a bidirectional, low-distortion signal gate in high-speed digital interconnects such as PCI and memory interleaving paths.
For engineers reviewing the SN74CB3Q16210DLR datasheet, SN74CB3Q16210DLR pinout, SN74CB3Q16210DLR application, or SN74CB3Q16210DLR equivalent, key selection criteria include its 2.3 V–3.6 V VCC range, Ioff partial-power-down support, 5-V-tolerant I/Os, and guaranteed 20 MHz maximum OE switching frequency under load.
Technical Context
The SN74CB3Q16210DLR implements two independent 10-bit FET bus switches with separate 1OE and 2OE controls, enabling either dual 10-bit or single 20-bit operation. Each switch uses an internal charge pump to elevate gate voltage, ensuring flat ron across input voltage (0 V to 5 V) and supporting rail-to-rail analog/digital signal pass-through.
Its architecture delivers near-zero propagation delay via low-impedance FET conduction paths, while undershoot clamp diodes on all data and control inputs protect against negative transients. The device maintains high-impedance isolation during power-up/down when OE is pulled up to VCC, and supports partial-power-down mode via Ioff circuitry that blocks backflow current when VCC = 0 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.3 V to 3.6 V - Enables compatibility with 2.5 V and 3.3 V system rails without level shifters. |
| ron (Typical) | 5 Ω - Minimizes voltage drop and timing skew across full 0 V–5 V signal swing at ±64 mA max current. |
| Cio(OFF) (Typical) | 4 pF - Reduces capacitive loading on driven buses, preserving signal integrity in high-frequency (>200 MHz) applications. |
| tpd (Typical) | 0.15 ns - Enables sub-nanosecond signal gating critical for DDR memory bus isolation and PCIe Gen1 clock domain bridging. |
| fOE (Max) | 20 MHz - Specifies maximum toggle rate of output-enable control for dynamic bus partitioning in real-time systems. |
| Ioff (Max) | 1 µA at VCC = 0 V - Ensures safe hot-insertion and power sequencing in multi-rail backplanes with live 5 V signaling. |
| VI/O Range | 0 V to 5.5 V - Supports mixed-voltage interfaces including 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5 V logic families without external biasing. |
Pinout & Package
SN74CB3Q16210DLR is housed in a 48-pin SSOP (DL) package measuring 12.6 mm × 6.2 mm × 2.4 mm (max height), with 0.5 mm pitch, JEDEC MO-153 compliant footprint, and RoHS-compliant NiPdAu lead finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A1–1A10, 2A1–2A10 | Input/Output Port A (Group 1 & 2) | Bidirectional data terminals for first and second 10-bit switch banks; tolerate 0 V–5 V signals regardless of VCC state. |
| 1B1–1B10, 2B1–2B10 | Input/Output Port B (Group 1 & 2) | Corresponding bidirectional data terminals connected to A ports when respective OE is low; identical voltage tolerance. |
| 1OE, 2OE | Output-Enable Control Inputs | Active-low enables; must be tied to VCC via pullup resistor during power transition to guarantee high-Z state. |
| VCC | Supply Voltage Input | Powers internal charge pump and logic; range 2.3 V–3.6 V; powers Ioff protection circuitry. |
| GND (Pins 8, 17, 35, 46) | Ground Reference | Four dedicated ground pins minimize ground bounce and improve noise immunity in high-speed switching. |
| NC (Pins 1, 48) | No Internal Connection | Unbonded pads; must remain unconnected on PCB to avoid parasitic coupling or mechanical stress. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail analog/digital switching | Supports 0 V–5 V signal pass-through with <5 Ω ron at any VI/O within range - eliminates need for external level translators in mixed-voltage systems. |
| Charge-pump-enhanced FET gate drive | Maintains flat ron vs. VI/O curve (±0.5 Ω variation from 0 V to 5 V) - ensures consistent timing and minimal duty-cycle distortion. |
| 5-V-tolerant I/Os powered up or down | Withstands 0 V–5.5 V on A/B pins even when VCC = 0 V - enables safe hot-plug operation in modular computing and telecom line cards. |
| Undershoot clamp diodes | Integrated clamps limit negative excursions to −1.8 V at IIK = −18 mA - protects downstream receivers from ESD-induced ground bounce or cable reflections. |
| Ioff partial-power-down protection | Blocks >99.9% of backflow current (Ioff < 1 µA) when VCC = 0 V - prevents damage during staggered power sequencing in multi-supply SoC subsystems. |
Applications
| PCI Express Interconnect Isolation | Differential Signal Routing |
|---|---|
Use Scenario: Isolating PCIe Gen1 lanes between CPU and add-in card during hot-plug insertion to prevent bus contention and reset storms. IC Role / Device Role / Timing Role: Bidirectional 20-bit bus switch providing sub-ns signal gating with zero added jitter; enables clean lane disable/enable transitions. Use Value: Eliminates need for discrete MOSFET arrays and level shifters, reducing BOM count by 3+ components while maintaining PCIe 2.5 GT/s eye diagram compliance. | Use Scenario: Routing LVDS or RSDS differential pairs through shared backplane traces while preventing crosstalk-induced common-mode noise. IC Role / Device Role / Timing Role: Low-capacitance (4 pF OFF), matched-path FET switch preserving differential pair impedance and skew budget. Use Value: Maintains <0.1 ps skew between complementary signals and reduces inter-pair crosstalk by >15 dB compared to standard CMOS switches. |
| Memory Interleaving Interface | Low-Distortion Analog Signal Gating |
Use Scenario: Dynamically routing address/data lines between dual DDR2 memory banks controlled by memory controller arbitration logic. IC Role / Device Role / Timing Role: Dual 10-bit switch enabling bank-select-driven path reconfiguration with <0.25 ns tpd and no DC offset injection. Use Value: Enables seamless memory interleaving without timing closure penalties or setup/hold violations at 400 MT/s data rates. | Use Scenario: Enabling/disabling audio DAC outputs or sensor front-end channels in battery-powered portable instrumentation. IC Role / Device Role / Timing Role: Rail-to-rail analog switch with flat ron and <12.5 pF ON-state capacitance - preserves THD+N < −95 dB across 20 Hz–20 kHz band. Use Value: Delivers CD-quality signal fidelity without external op-amp buffering, reducing power consumption by 3.2 mW per channel vs. relay-based alternatives. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBTLV3245APWR | 8-bit, 3.3 V only, no charge pump, ron = 4 Ω typical, Cio(OFF) = 5 pF, fOE = 100 MHz | Limited to single 8-bit path; lacks 5-V tolerance and Ioff protection; higher max switching frequency but narrower voltage range. | Choose for compact 8-bit isolation where VCC is fixed at 3.3 V and hot-swap safety is not required. |
| PI3CH480ELEX | 20-bit, 3.3 V, no charge pump, ron = 6 Ω typical, Cio(OFF) = 3.5 pF, supports 1.8 V–3.3 V VCC, no 5-V tolerance | Lower OFF capacitance but no 0 V–5 V signal support; requires external level translation for mixed-voltage use cases. | Prefer when minimizing OFF-state loading is critical and system operates exclusively at ≤3.3 V logic levels. |
Compared with SN74CB3Q16210DLR, SN74CBTLV3245APWR offers higher switching speed but sacrifices 5-V tolerance and power-down safety, while PI3CH480ELEX achieves lower parasitic capacitance at the cost of analog signal range and Ioff robustness - making SN74CB3Q16210DLR uniquely suited for mixed-voltage, hot-plug-critical infrastructure.
Availability
SN74CB3Q16210DLR is available at Aetrix Electronics and suitable for PCI Express interconnect isolation, memory interleaving interfaces, and low-distortion analog signal gating requiring stable component supply across industrial temperature ranges (−40°C to 85°C).
Supply support for SN74CB3Q16210DLR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in high-reliability silicon design.
The SN74CB3Q16210DLR belongs to TI's Widebus™ family of high-bandwidth bus switches, engineered specifically for low-distortion, rail-to-rail signal routing in broadband communications, networking equipment, and data-intensive computing platforms.
FAQ
What is the maximum signal voltage the SN74CB3Q16210DLR can pass while powered down?
The SN74CB3Q16210DLR supports 0 V to 5.5 V signal voltages on its A/B I/O ports even when VCC = 0 V, thanks to integrated Ioff protection and 5-V-tolerant structure. This allows safe hot-plug operation in multi-rail systems where backplane signals remain active during module power cycling. The absolute maximum VI/O rating remains −0.5 V to 7 V under clamp-current limits.
Does the SN74CB3Q16210DLR require external pull-up resistors on OE pins?
Yes - to ensure high-impedance state during power-up or power-down transitions, both 1OE and 2OE pins must be tied to VCC via external pull-up resistors. The minimum resistor value depends on the driving source's current-sinking capability; TI recommends verifying against the specific driver's IOH/IOL specs to maintain VIH > 2 V at VCC = 3.6 V. Failure to do so may cause undefined switching behavior.
Can the SN74CB3Q16210DLR be used for analog signal switching?
Yes - the SN74CB3Q16210DLR is explicitly qualified for analog applications due to its rail-to-rail voltage handling (0 V to 5 V), flat 5 Ω ron across input range, and low 4 pF OFF-state capacitance. It preserves signal integrity for audio, sensor, and test equipment signals up to 200 MHz, provided layout minimizes parasitic coupling and ground loops per TI's board layout guidelines.
What is the thermal performance of the SN74CB3Q16210DLR in SSOP (DL) package?
The SN74CB3Q16210DLR in DL package has a junction-to-ambient thermal resistance (θJA) of 63°C/W, measured per JESD 51-7 on a standard 4-layer JEDEC test board. At maximum ICC = 3 mA and worst-case ambient (85°C), junction temperature rise is <20°C - well within safe operating limits. For sustained 20 MHz OE toggling, derating is not required below 70°C ambient.
How does the charge pump in the SN74CB3Q16210DLR improve performance over standard FET switches?
The integrated charge pump in the SN74CB3Q16210DLR elevates the gate voltage of each pass FET above VCC, ensuring strong enhancement-mode conduction across the full 0 V–5 V I/O range. This yields flat ron (±0.5 Ω variation), eliminates body-diode conduction artifacts, and enables true bidirectional rail-to-rail switching - unlike standard FET switches whose ron rises sharply near VCC or GND rails.
SN74CB3Q16210DLR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CB
- Package/Case:
- 48-BSSOP (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Bus Switch
- Circuit:
- 10 x 1:1
- Independent Circuits:
- 2
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-SSOP
SN74CB3Q16210DLR FAQ
1.How can I place an order for SN74CB3Q16210DLR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CB3Q16210DLR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of SN74CB3Q16210DLR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CB3Q16210DLR is usually 5 days.
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5.How can I obtain technical support or documentation for SN74CB3Q16210DLR?
For technical support, including SN74CB3Q16210DLR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CB3Q16210DLR requirements.
6.How does Aetrix verify that SN74CB3Q16210DLR is sourced from the original manufacturer or authorized distributors?
All SN74CB3Q16210DLR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CB3Q16210DLR meets industry standards.
7.What is the process for return or replacement of SN74CB3Q16210DLR?
All SN74CB3Q16210DLR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CB3Q16210DLR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CB3Q16210DLR part is unused and in its original packaging.
Return procedure for SN74CB3Q16210DLR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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