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Texas Instruments SN74CB3Q16211DGG
- Part No.:
- SN74CB3Q16211DGG
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- -
- Datasheet:
-
SN74CB3Q16211DGG.pdf
- Description:
- SW BUS 24BIT FET 56-TSSOP
- Quantity:
- Payment:
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Inventory:1,225
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Product details
Overview
SN74CB3Q16211DGG from Texas Instruments is a 24-bit, 56-pin TSSOP FET bus switch optimized for high-bandwidth digital signal routing in low-voltage systems. It supports rail-to-rail switching (0 V to 5 V with 3.3-V VCC), delivers 5 Ω typical ON-state resistance, enables bidirectional data flow with near-zero propagation delay (0.15 ns), and operates across 2.3 V–3.6 V supply range - ideal for PCIe interconnect isolation and memory interleaving in embedded PCs.
For engineers reviewing the SN74CB3Q16211DGG datasheet, SN74CB3Q16211DGG pinout, SN74CB3Q16211DGG application, or SN74CB3Q16211DGG equivalent, key selection criteria include its 500-MHz bandwidth capability, 5-V-tolerant I/Os under powered-up/down conditions, Ioff-enabled partial-power-down support, and compatibility with 0.8-V to 5-V signaling standards including DDR, PCI, and differential interfaces.
Technical Context
The SN74CB3Q16211DGG implements two independent 12-bit FET bus switches with separate 1OE and 2OE controls, enabling flexible configuration as either dual 12-bit or single 24-bit switch. Its charge-pump gate drive elevates pass-transistor gate voltage to maintain flat, low ron (5 Ω typ.) across input voltage range and supply voltages.
Each switch channel features 4 pF typical OFF-state I/O capacitance, undershoot clamp diodes on all data and control inputs, and full JESD78 Class II latch-up immunity (>100 mA). The device supports TTL- and CMOS-compatible control inputs and guarantees 5-V tolerance on I/O pins regardless of VCC state - critical for hot-swap and mixed-voltage domain bridging.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.3 V to 3.6 V - enables operation in both 2.5-V and 3.3-V system rails without level shifters |
| ron (typ.) | 5 Ω - ensures minimal insertion loss and signal distortion up to 500 MHz |
| Cio(OFF) (typ.) | 4 pF - reduces capacitive loading on high-speed buses like PCIe Gen1/2 and DDR2 |
| Propagation Delay | 0.15 ns - supports near-transparent signal gating with sub-nanosecond timing integrity |
| Ioff | 1 µA at VCC = 0 V - prevents backflow current during partial power-down, protecting upstream drivers |
| Switching Frequency | 20 MHz max fOE - defines maximum toggle rate for enable-controlled bus isolation |
| Operating Temp | –40 °C to +85 °C - qualified for industrial-grade embedded computing and AV equipment |
Pinout & Package
TSSOP-56 (DGG) package: 14.00 mm × 6.10 mm body, 1.2 mm max height, lead pitch 0.5 mm, RoHS-compliant NiPdAu finish, MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A1–1A12, 2A1–2A12 | Data Input A-side (Port A) | 12-bit input channels per switch bank; accept 0–5 V signals regardless of VCC state |
| 1B1–1B12, 2B1–2B12 | Data Output B-side (Port B) | Corresponding bidirectional output terminals; mirror A-side voltage with <5 Ω ron |
| 1OE, 2OE | Output Enable (active-low) | Independent control of each 12-bit switch; OE low connects A↔B, OE high places port in high-Z |
| VCC | Power Supply | Single 2.3–3.6 V rail powers internal charge pump and logic; no auxiliary supplies required |
| GND (pins 8, 17, 35, 43) | Ground Reference | Four dedicated ground pins minimize ground bounce in high-speed 24-bit switching |
| NC (pin 1) | No Internal Connection | Unused pad; must remain unconnected per TI layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail analog/digital switching | Supports 0–5 V signal swing with 3.3-V VCC, enabling direct interface to legacy 5-V peripherals and modern low-voltage logic |
| 5-V tolerant I/Os | Guaranteed safe operation when I/O pins exceed VCC - even during power-up/power-down sequences - eliminating external clamping diodes |
| Charge-pump enhanced ron | Maintains flat 5 Ω typical ON-resistance across full input voltage range (0–5 V) and supply range (2.3–3.6 V), preserving signal integrity |
| Ioff partial-power-down protection | Blocks damaging current flow between live and unpowered system domains - essential for hot-plug and modular backplane designs |
| Low 4-pF OFF-state capacitance | Minimizes signal reflection and crosstalk on high-frequency buses such as PCI Express and DDR memory channels |
Applications
| PCIe Interconnect Isolation | DDR Memory Interleaving |
|---|---|
|
Use Scenario: Isolating PCIe Gen1/Gen2 lanes between CPU and add-in card during hot-plug events or firmware reconfiguration. IC Role / Device Role / Timing Role: Bidirectional, low-latency signal gate placed between root complex and endpoint; controlled by system management unit via OE lines. Use Value: Enables clean bus disconnection without signal corruption or latch-up risk, leveraging 5-V-tolerant I/Os and Ioff protection during partial power states. |
Use Scenario: Dynamically routing address/data lines between dual DDR2 memory banks in embedded PC or set-top box SoC platforms. IC Role / Device Role / Timing Role: 24-bit parallel switch configured as single bank to alternate access between memory controllers and DIMMs. Use Value: Achieves sub-nanosecond propagation delay and 4-pF Cio(OFF) to preserve setup/hold timing margins across 400 MT/s DDR2 interfaces. |
| AV Receiver Signal Routing | DLP Front Projection Interface |
|
Use Scenario: Switching HDMI/DisplayPort auxiliary channels (DDC, CEC, HPD) between multiple source devices in premium home theater receivers. IC Role / Device Role / Timing Role: Low-capacitance analog-capable bus switch handling bidirectional I²C and 3.3-V logic-level control signals. Use Value: 5 Ω ron and rail-to-rail operation ensure minimal voltage drop and full logic-level translation across mixed-voltage sources (1.8 V, 3.3 V, 5 V). |
Use Scenario: Gating LVDS pixel clock and data lanes between DMD controller and digital micromirror device in DLP front projectors. IC Role / Device Role / Timing Role: High-fidelity signal gate preserving edge integrity on 100+ MHz LVDS clocks and video data streams. Use Value: 500-MHz bandwidth and 0.15-ns tpd prevent jitter accumulation and skew-induced image artifacts in high-resolution projection. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FET bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBT16211DGGR | Higher ron (7 Ω typ.), no charge pump, 2.5-V–3.6-V only, lower bandwidth (~300 MHz) | Lacks 5-V I/O tolerance and rail-to-rail capability; unsuitable for mixed-voltage hot-swap | Select only if cost sensitivity outweighs performance requirements and system uses uniform 3.3-V signaling |
| PI3CH480ELEX | 16-bit (not 24-bit), 3.3-V only, 6 Ω ron, 4-pF Cio(OFF), no Ioff support | Requires external power sequencing for partial-power-down; insufficient channel count for full 24-bit bus | Consider only for space-constrained 16-bit applications where TI's Widebus® ecosystem compatibility is not required |
Compared with SN74CB3Q16211DGG, SN74CBT16211DGGR trades bandwidth and voltage flexibility for lower cost, while PI3CH480ELEX offers smaller footprint but lacks critical Ioff and 5-V tolerance needed for robust system-level integration.
Availability
SN74CB3Q16211DGG is available at Aetrix Electronics and suitable for PCIe interconnect isolation, DDR memory interleaving, and AV receiver signal routing requiring stable component supply and long-term industrial lifecycle support.
Supply support for SN74CB3Q16211DGG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in high-reliability IC design.
The SN74CB3Q16211DGG belongs to TI's Widebus® family of high-speed FET bus switches, engineered specifically for broadband communications, memory subsystems, and mixed-signal interface bridging in computing and consumer AV systems.
FAQ
What is the maximum operating frequency supported by the SN74CB3Q16211DGG?
The SN74CB3Q16211DGG supports up to 500 MHz bandwidth for high-speed data paths, verified under loaded conditions with 30-pF test capacitance. Its 20 MHz maximum OE switching frequency defines control-side toggle limits, while propagation delay remains fixed at 0.15 ns regardless of data rate - making SN74CB3Q16211DGG suitable for PCIe Gen1/2, DDR2, and LVDS applications where signal fidelity is critical.
Does the SN74CB3Q16211DGG support 5-V tolerant I/Os when VCC is unpowered?
Yes, the SN74CB3Q16211DGG maintains full 5-V tolerance on all data I/O pins (A and B ports) whether VCC is powered or fully off. This is enabled by integrated clamp diodes and robust oxide design, allowing safe connection to live 5-V buses during system power sequencing - a key requirement validated in SN74CB3Q16211DGG's absolute maximum ratings table (VI/O = –0.5 V to 7 V).
How does the charge pump in the SN74CB3Q16211DGG improve performance?
The internal charge pump in the SN74CB3Q16211DGG elevates the gate voltage of the pass FETs above VCC, ensuring strong enhancement-mode conduction across the full 0–5 V input range. This delivers flat 5 Ω typical ron independent of input voltage - unlike non-pumped switches whose ron rises sharply near VCC - directly improving signal rise/fall times and reducing harmonic distortion in SN74CB3Q16211DGG-based interfaces.
Can the SN74CB3Q16211DGG be used in partial-power-down mode?
Yes, the SN74CB3Q16211DGG incorporates Ioff circuitry that actively disables current paths when VCC = 0 V, limiting leakage to 1 µA maximum. This allows safe insertion into live backplanes or hot-swappable modules without damaging upstream drivers - a feature explicitly tested per JESD78 Class II and confirmed in SN74CB3Q16211DGG's electrical characteristics table.
What package type is used for the SN74CB3Q16211DGG?
The SN74CB3Q16211DGG uses the TSSOP-56 (DGG) package: 14.00 mm × 6.10 mm body size, 1.2 mm maximum height, 0.5 mm lead pitch, and NiPdAu lead finish. It is RoHS-compliant, MSL Level-1 rated, and supplied in 2000-piece tape-and-reel format - matching mechanical specifications in TI's official DGG0056A package outline drawing.
SN74CB3Q16211DGG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Type:
- -
- Circuit:
- -
- Independent Circuits:
- -
- Current - Output High, Low:
- -
- Voltage Supply Source:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
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- Supplier Device Package:
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SN74CB3Q16211DGG FAQ
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7.What is the process for return or replacement of SN74CB3Q16211DGG?
All SN74CB3Q16211DGG units undergo pre-shipment inspection (PSI). If there is an issue with SN74CB3Q16211DGG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CB3Q16211DGG part is unused and in its original packaging.
Return procedure for SN74CB3Q16211DGG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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