Texas Instruments SN74CB3Q16211DGGR
- Part No.:
- SN74CB3Q16211DGGR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 56-TFSOP (0.240", 6.10mm Width)
- Datasheet:
-
SN74CB3Q16211DGGR.pdf
- Description:
- IC BUS SWITCH 12 X 1:1 56TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:1,102
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Product details
Overview
SN74CB3Q16211DGGR from Texas Instruments is a 24-bit, 56-pin TSSOP low-voltage FET bus switch supporting rail-to-rail 0–5 V signaling at 2.5 V/3.3 V supply, with 5 Ω typical ON-state resistance, 500 MHz bandwidth, and bidirectional zero-delay switching for high-speed digital interconnects in memory and interface subsystems.
For engineers reviewing the SN74CB3Q16211DGGR datasheet, SN74CB3Q16211DGGR pinout, SN74CB3Q16211DGGR application, or SN74CB3Q16211DGGR equivalent, key selection criteria include its Ioff-enabled partial-power-down capability, 4 pF OFF-state I/O capacitance, 20 MHz maximum OE switching frequency, and compatibility with 0.8–5 V logic families across PCIe, DDR, and legacy parallel bus isolation use cases.
Technical Context
The SN74CB3Q16211DGGR implements two independent 12-bit FET bus switches with separate 1OE and 2OE controls, enabling flexible configuration as either dual 12-bit or single 24-bit paths. Its charge-pump gate drive ensures flat ron over voltage and temperature, maintaining signal integrity in high-bandwidth applications.
Each switch supports 5-V tolerant I/Os regardless of VCC state (2.3–3.6 V), features undershoot clamp diodes on all data and control pins, and guarantees latch-up immunity >100 mA per JESD78 Class II - critical for hot-swap and mixed-voltage system interoperability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.3 V to 3.6 V - enables operation from 2.5 V and 3.3 V rails without level shifters |
| ron (Typical) | 5 Ω - minimizes insertion loss and propagation delay in high-speed data paths |
| Cio(OFF) | 4 pF typical - reduces capacitive loading on shared buses and preserves signal rise/fall times |
| tpd | 0.15–0.25 ns - near-zero propagation delay supports sub-ns timing budgets in DDR and PCIe Gen1+ systems |
| fOE (Max) | 20 MHz - defines maximum toggle rate for output-enable control without timing violation |
| Ioff | 1 µA at VCC = 0 V - blocks back-current during partial power-down, protecting powered subsystems |
| VI/O Range | 0 V to 5.5 V - supports interoperability across 0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5 V logic families |
Pinout & Package
TSSOP-56 (DGG) package: 14.00 mm × 6.10 mm body, 1.2 mm max height, 0.5 mm pitch, RoHS-compliant NiPdAu lead finish, MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A1–1A12, 2A1–2A12 | Data input A-side terminals | 12-bit input ports for first and second switch banks; accept 0–5 V signals independent of VCC |
| 1B1–1B12, 2B1–2B12 | Data output B-side terminals | Corresponding bidirectional output ports; electrically identical to A-side under ON condition |
| 1OE, 2OE | Output-enable controls | Active-low enables respective 12-bit switch bank; must be pulled up to VCC for safe power-up sequencing |
| VCC | Supply voltage | 2.3–3.6 V core supply; powers internal charge pump and logic; not used for I/O voltage reference |
| GND (Pins 8, 23, 39, 52) | Ground reference | Four dedicated ground pins minimize ground bounce and ensure stable ron across all channels |
| NC (Pin 1) | No internal connection | Unbonded pad; no electrical function; must remain unconnected per TI design guidance |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail switching | Supports 0–5 V signal swing with 2.5 V or 3.3 V VCC - eliminates need for external level translators in mixed-voltage systems |
| 5-V tolerant I/Os | Operates with VI/O up to 5.5 V regardless of VCC state (powered up/down) - enables safe hot-plug and legacy interface integration |
| Low and flat ron | 5 Ω typical, <8 Ω max over full VCC/temperature range - ensures consistent impedance matching and minimal jitter accumulation |
| Ioff partial-power-down | 1 µA leakage at VCC = 0 V - prevents damaging current flow between live and unpowered subsystems during power sequencing |
| Bidirectional zero-delay path | tpd ≤ 0.25 ns - preserves signal edge fidelity for high-frequency clock/data buses without added latency |
Applications
| PCIe Gen1 Interposer | DDR3 Memory Isolation |
|---|---|
Use Scenario: Isolating PCIe root complex from add-in card during hot-plug events while maintaining signal integrity up to 2.5 Gbps. IC Role / Device Role / Timing Role: Bidirectional, low-capacitance bus switch providing 5-V tolerant, rail-to-rail signal pass-through with Ioff protection during VCC ramp-down. Use Value: Enables seamless hot-plug compliance without external level shifters or clamping circuits, reducing BOM count and layout area. |
Use Scenario: Separating DDR3 controller and SODIMM modules to prevent noise coupling and support independent power cycling. IC Role / Device Role / Timing Role: 24-bit high-bandwidth analog switch routing DQ/DQS/DM lines with sub-0.25 ns propagation delay and 4 pF OFF-state loading. Use Value: Maintains signal eye margin across 800 MT/s DDR3 interfaces while allowing independent VDD/VDDQ sequencing per JEDEC specification. |
| AV Receiver Signal Routing | DLP Projector Video Bus Gating |
Use Scenario: Dynamically routing HDMI/DisplayPort auxiliary channels and CEC signals between multiple source inputs and display outputs. IC Role / Device Role / Timing Role: Low-distortion analog switch enabling 0–3.3 V signaling with 500 MHz bandwidth and undershoot clamp diodes for ESD robustness. Use Value: Eliminates cross-talk between audio/video paths and sustains signal fidelity over long PCB traces in consumer AV equipment. |
Use Scenario: Gating high-speed LVDS video data lanes between scaler IC and DMD controller in front-projection systems. IC Role / Device Role / Timing Role: 24-bit FET switch operating at 2.5 V supply with 5 Ω ron and 10 pF ON-state capacitance to preserve LVDS common-mode stability. Use Value: Prevents signal degradation during blanking intervals while meeting tight skew requirements (<50 ps) across 24-bit parallel video buses. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FET bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBT16211DGGR | Higher ron (7 Ω typ), no charge pump, 3.3 V only VCC, no Ioff | Lacks partial-power-down support and 2.5 V operation; unsuitable for mixed-rail or hot-swap designs | Choose only if cost sensitivity outweighs power sequencing flexibility and bandwidth requirements |
| PI3CH480ELEX | 24-bit, 3.3 V only, 6 Ω ron, 3 pF Cio(OFF), no 5-V tolerance | Requires external level translation for 5 V signals; lower OFF-capacitance but narrower voltage interoperability | Select when ultra-low OFF-capacitance is prioritized over 5-V I/O compatibility and Ioff safety |
Compared with SN74CB3Q16211DGGR, SN74CBT16211DGGR trades off power-down safety and voltage flexibility for lower unit cost, while PI3CH480ELEX offers tighter OFF-capacitance at the expense of 5-V tolerance and partial-power-down capability - making SN74CB3Q16211DGGR the optimal choice for mixed-voltage, hot-pluggable, or high-fidelity signal gating.
Availability
SN74CB3Q16211DGGR is available at Aetrix Electronics and suitable for PCIe interposers, DDR3 memory isolation, AV receiver signal routing, and DLP projector video bus gating requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for SN74CB3Q16211DGGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in high-speed interface solutions and signal integrity engineering.
The SN74CB3Q16211DGGR belongs to TI's Widebus® family of high-bandwidth FET bus switches, designed specifically for low-distortion, rail-to-rail signal gating in memory, PCIe, and multimedia subsystems where timing precision and voltage interoperability are critical.
FAQ
What is the maximum operating frequency supported by the SN74CB3Q16211DGGR?
The SN74CB3Q16211DGGR supports up to 500 MHz bandwidth for high-speed data paths, verified under loaded conditions with 30 pF test capacitance. Its 0.15–0.25 ns propagation delay and 5 Ω typical ON-state resistance enable reliable operation in PCIe Gen1 (2.5 Gbps) and DDR3-800 (400 MHz) applications without signal degradation.
Does the SN74CB3Q16211DGGR support partial-power-down mode?
Yes, the SN74CB3Q16211DGGR supports partial-power-down via its Ioff circuitry, limiting leakage to 1 µA when VCC = 0 V and VI/O = 0–5.5 V. This feature prevents damaging back-current flow between powered and unpowered sections of a system, making SN74CB3Q16211DGGR suitable for hot-plug and multi-rail architectures.
Can the SN74CB3Q16211DGGR interface 5-V signals while operating from a 2.5-V supply?
Yes, the SN74CB3Q16211DGGR supports 5-V tolerant I/Os across its full 0–5.5 V VI/O range, regardless of whether VCC is 2.5 V or 3.3 V. This allows direct interfacing with legacy 5-V peripherals without external level shifters - a confirmed capability documented in Section 7.1 Absolute Maximum Ratings and Section 5 Description.
What is the purpose of the charge pump in the SN74CB3Q16211DGGR?
The integrated charge pump elevates the gate voltage of the internal FET pass transistors to maintain low and flat ON-state resistance (ron ≈ 5 Ω) across the entire 2.3–3.6 V VCC range and 0–5 V signal swing. This architecture ensures consistent signal integrity and minimal propagation delay - a defining feature distinguishing SN74CB3Q16211DGGR from non-charge-pump alternatives like SN74CBT16211DGGR.
How many independent switch banks does the SN74CB3Q16211DGGR contain?
The SN74CB3Q16211DGGR contains two independent 12-bit bus switch banks, each controlled by its own active-low output-enable pin (1OE and 2OE). These can be used separately for dual-channel isolation or tied together to operate as a single 24-bit switch - a configuration explicitly defined in the Function Table (Table 5-1) and Pin Configuration section of the official datasheet.
SN74CB3Q16211DGGR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CB
- Package/Case:
- 56-TFSOP (0.240", 6.10mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Bus Switch
- Circuit:
- 12 x 1:1
- Independent Circuits:
- 2
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSSOP
SN74CB3Q16211DGGR FAQ
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6.How does Aetrix verify that SN74CB3Q16211DGGR is sourced from the original manufacturer or authorized distributors?
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7.What is the process for return or replacement of SN74CB3Q16211DGGR?
All SN74CB3Q16211DGGR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CB3Q16211DGGR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CB3Q16211DGGR part is unused and in its original packaging.
Return procedure for SN74CB3Q16211DGGR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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