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Texas Instruments SN74CB3Q16211DGGR

Part No.:
SN74CB3Q16211DGGR
Manufacturer:
Texas Instruments
Category:
Signal Switches, Multiplexers, Decoders
Package:
56-TFSOP (0.240", 6.10mm Width)
Datasheet:
AetrixSN74CB3Q16211DGGR.pdf
Description:
IC BUS SWITCH 12 X 1:1 56TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,102

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Product details

Overview

SN74CB3Q16211DGGR from Texas Instruments is a 24-bit, 56-pin TSSOP low-voltage FET bus switch supporting rail-to-rail 0–5 V signaling at 2.5 V/3.3 V supply, with 5 Ω typical ON-state resistance, 500 MHz bandwidth, and bidirectional zero-delay switching for high-speed digital interconnects in memory and interface subsystems.

For engineers reviewing the SN74CB3Q16211DGGR datasheet, SN74CB3Q16211DGGR pinout, SN74CB3Q16211DGGR application, or SN74CB3Q16211DGGR equivalent, key selection criteria include its Ioff-enabled partial-power-down capability, 4 pF OFF-state I/O capacitance, 20 MHz maximum OE switching frequency, and compatibility with 0.8–5 V logic families across PCIe, DDR, and legacy parallel bus isolation use cases.

Technical Context

The SN74CB3Q16211DGGR implements two independent 12-bit FET bus switches with separate 1OE and 2OE controls, enabling flexible configuration as either dual 12-bit or single 24-bit paths. Its charge-pump gate drive ensures flat ron over voltage and temperature, maintaining signal integrity in high-bandwidth applications.

Each switch supports 5-V tolerant I/Os regardless of VCC state (2.3–3.6 V), features undershoot clamp diodes on all data and control pins, and guarantees latch-up immunity >100 mA per JESD78 Class II - critical for hot-swap and mixed-voltage system interoperability.

Key Specifications

Parameter Value and Actual Design Meaning
VCC Range 2.3 V to 3.6 V - enables operation from 2.5 V and 3.3 V rails without level shifters
ron (Typical) 5 Ω - minimizes insertion loss and propagation delay in high-speed data paths
Cio(OFF) 4 pF typical - reduces capacitive loading on shared buses and preserves signal rise/fall times
tpd 0.15–0.25 ns - near-zero propagation delay supports sub-ns timing budgets in DDR and PCIe Gen1+ systems
fOE (Max) 20 MHz - defines maximum toggle rate for output-enable control without timing violation
Ioff 1 µA at VCC = 0 V - blocks back-current during partial power-down, protecting powered subsystems
VI/O Range 0 V to 5.5 V - supports interoperability across 0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5 V logic families

Pinout & Package

TSSOP-56 (DGG) package: 14.00 mm × 6.10 mm body, 1.2 mm max height, 0.5 mm pitch, RoHS-compliant NiPdAu lead finish, MSL Level-1.

Pin/Terminal Circuit Role Design Meaning
1A1–1A12, 2A1–2A12 Data input A-side terminals 12-bit input ports for first and second switch banks; accept 0–5 V signals independent of VCC
1B1–1B12, 2B1–2B12 Data output B-side terminals Corresponding bidirectional output ports; electrically identical to A-side under ON condition
1OE, 2OE Output-enable controls Active-low enables respective 12-bit switch bank; must be pulled up to VCC for safe power-up sequencing
VCC Supply voltage 2.3–3.6 V core supply; powers internal charge pump and logic; not used for I/O voltage reference
GND (Pins 8, 23, 39, 52) Ground reference Four dedicated ground pins minimize ground bounce and ensure stable ron across all channels
NC (Pin 1) No internal connection Unbonded pad; no electrical function; must remain unconnected per TI design guidance

Key Features

Feature Design Value
Rail-to-rail switching Supports 0–5 V signal swing with 2.5 V or 3.3 V VCC - eliminates need for external level translators in mixed-voltage systems
5-V tolerant I/Os Operates with VI/O up to 5.5 V regardless of VCC state (powered up/down) - enables safe hot-plug and legacy interface integration
Low and flat ron 5 Ω typical, <8 Ω max over full VCC/temperature range - ensures consistent impedance matching and minimal jitter accumulation
Ioff partial-power-down 1 µA leakage at VCC = 0 V - prevents damaging current flow between live and unpowered subsystems during power sequencing
Bidirectional zero-delay path tpd ≤ 0.25 ns - preserves signal edge fidelity for high-frequency clock/data buses without added latency

Applications

PCIe Gen1 Interposer DDR3 Memory Isolation

Use Scenario: Isolating PCIe root complex from add-in card during hot-plug events while maintaining signal integrity up to 2.5 Gbps.

IC Role / Device Role / Timing Role: Bidirectional, low-capacitance bus switch providing 5-V tolerant, rail-to-rail signal pass-through with Ioff protection during VCC ramp-down.

Use Value: Enables seamless hot-plug compliance without external level shifters or clamping circuits, reducing BOM count and layout area.

Use Scenario: Separating DDR3 controller and SODIMM modules to prevent noise coupling and support independent power cycling.

IC Role / Device Role / Timing Role: 24-bit high-bandwidth analog switch routing DQ/DQS/DM lines with sub-0.25 ns propagation delay and 4 pF OFF-state loading.

Use Value: Maintains signal eye margin across 800 MT/s DDR3 interfaces while allowing independent VDD/VDDQ sequencing per JEDEC specification.

AV Receiver Signal Routing DLP Projector Video Bus Gating

Use Scenario: Dynamically routing HDMI/DisplayPort auxiliary channels and CEC signals between multiple source inputs and display outputs.

IC Role / Device Role / Timing Role: Low-distortion analog switch enabling 0–3.3 V signaling with 500 MHz bandwidth and undershoot clamp diodes for ESD robustness.

Use Value: Eliminates cross-talk between audio/video paths and sustains signal fidelity over long PCB traces in consumer AV equipment.

Use Scenario: Gating high-speed LVDS video data lanes between scaler IC and DMD controller in front-projection systems.

IC Role / Device Role / Timing Role: 24-bit FET switch operating at 2.5 V supply with 5 Ω ron and 10 pF ON-state capacitance to preserve LVDS common-mode stability.

Use Value: Prevents signal degradation during blanking intervals while meeting tight skew requirements (<50 ps) across 24-bit parallel video buses.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FET bus switch applications.

Alternative Part Technical Difference Application Difference Selection Advice
SN74CBT16211DGGR Higher ron (7 Ω typ), no charge pump, 3.3 V only VCC, no Ioff Lacks partial-power-down support and 2.5 V operation; unsuitable for mixed-rail or hot-swap designs Choose only if cost sensitivity outweighs power sequencing flexibility and bandwidth requirements
PI3CH480ELEX 24-bit, 3.3 V only, 6 Ω ron, 3 pF Cio(OFF), no 5-V tolerance Requires external level translation for 5 V signals; lower OFF-capacitance but narrower voltage interoperability Select when ultra-low OFF-capacitance is prioritized over 5-V I/O compatibility and Ioff safety

Compared with SN74CB3Q16211DGGR, SN74CBT16211DGGR trades off power-down safety and voltage flexibility for lower unit cost, while PI3CH480ELEX offers tighter OFF-capacitance at the expense of 5-V tolerance and partial-power-down capability - making SN74CB3Q16211DGGR the optimal choice for mixed-voltage, hot-pluggable, or high-fidelity signal gating.

Availability

SN74CB3Q16211DGGR is available at Aetrix Electronics and suitable for PCIe interposers, DDR3 memory isolation, AV receiver signal routing, and DLP projector video bus gating requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for SN74CB3Q16211DGGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in high-speed interface solutions and signal integrity engineering.

The SN74CB3Q16211DGGR belongs to TI's Widebus® family of high-bandwidth FET bus switches, designed specifically for low-distortion, rail-to-rail signal gating in memory, PCIe, and multimedia subsystems where timing precision and voltage interoperability are critical.

FAQ

What is the maximum operating frequency supported by the SN74CB3Q16211DGGR?

The SN74CB3Q16211DGGR supports up to 500 MHz bandwidth for high-speed data paths, verified under loaded conditions with 30 pF test capacitance. Its 0.15–0.25 ns propagation delay and 5 Ω typical ON-state resistance enable reliable operation in PCIe Gen1 (2.5 Gbps) and DDR3-800 (400 MHz) applications without signal degradation.

Does the SN74CB3Q16211DGGR support partial-power-down mode?

Yes, the SN74CB3Q16211DGGR supports partial-power-down via its Ioff circuitry, limiting leakage to 1 µA when VCC = 0 V and VI/O = 0–5.5 V. This feature prevents damaging back-current flow between powered and unpowered sections of a system, making SN74CB3Q16211DGGR suitable for hot-plug and multi-rail architectures.

Can the SN74CB3Q16211DGGR interface 5-V signals while operating from a 2.5-V supply?

Yes, the SN74CB3Q16211DGGR supports 5-V tolerant I/Os across its full 0–5.5 V VI/O range, regardless of whether VCC is 2.5 V or 3.3 V. This allows direct interfacing with legacy 5-V peripherals without external level shifters - a confirmed capability documented in Section 7.1 Absolute Maximum Ratings and Section 5 Description.

What is the purpose of the charge pump in the SN74CB3Q16211DGGR?

The integrated charge pump elevates the gate voltage of the internal FET pass transistors to maintain low and flat ON-state resistance (ron ≈ 5 Ω) across the entire 2.3–3.6 V VCC range and 0–5 V signal swing. This architecture ensures consistent signal integrity and minimal propagation delay - a defining feature distinguishing SN74CB3Q16211DGGR from non-charge-pump alternatives like SN74CBT16211DGGR.

How many independent switch banks does the SN74CB3Q16211DGGR contain?

The SN74CB3Q16211DGGR contains two independent 12-bit bus switch banks, each controlled by its own active-low output-enable pin (1OE and 2OE). These can be used separately for dual-channel isolation or tied together to operate as a single 24-bit switch - a configuration explicitly defined in the Function Table (Table 5-1) and Pin Configuration section of the official datasheet.

SN74CB3Q16211DGGR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74CB
Package/Case:
56-TFSOP (0.240", 6.10mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Bus Switch
Circuit:
12 x 1:1
Independent Circuits:
2
Current - Output High, Low:
-
Voltage Supply Source:
Single Supply
Voltage - Supply:
2.3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
56-TSSOP

SN74CB3Q16211DGGR FAQ

1.How can I place an order for SN74CB3Q16211DGGR through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74CB3Q16211DGGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of SN74CB3Q16211DGGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CB3Q16211DGGR is usually 5 days.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74CB3Q16211DGGR?

For technical support, including SN74CB3Q16211DGGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CB3Q16211DGGR requirements.

6.How does Aetrix verify that SN74CB3Q16211DGGR is sourced from the original manufacturer or authorized distributors?

All SN74CB3Q16211DGGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CB3Q16211DGGR meets industry standards.

7.What is the process for return or replacement of SN74CB3Q16211DGGR?

All SN74CB3Q16211DGGR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CB3Q16211DGGR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74CB3Q16211DGGR part is unused and in its original packaging.

Return procedure for SN74CB3Q16211DGGR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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