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Home > Products > Integrated Circuits (ICs) > Logic > Signal Switches, Multiplexers, Decoders

Texas Instruments SN74CB3Q16211DGVR

Name: SN74CB3Q16211DGVR
Brand: Texas Instruments
SKU: SN74CB3Q16211DGVR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: SN74CB3Q16211DGVR

Manufacturer:: Texas Instruments

Category:: Signal Switches, Multiplexers, Decoders

Package:: 56-TFSOP (0.173", 4.40mm Width)

Datasheet:: SN74CB3Q16211DGVR.pdf

Description:: IC BUS SWITCH 12 X 1:1 56TVSOP

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Product details

Overview

SN74CB3Q16211DGVR from Texas Instruments is a 24-bit, 56-pin TVSOP low-voltage FET bus switch optimized for high-bandwidth digital signal routing. It supports rail-to-rail switching (0–5 V with 3.3-V V_CC), delivers 5 Ω typical ON-state resistance, enables bidirectional data flow with <0.25 ns propagation delay, and operates across 2.3–3.6 V supply range-ideal for PCIe interconnect isolation and memory channel multiplexing in embedded PC and AV receiver systems.

For engineers reviewing the SN74CB3Q16211DGVR datasheet, SN74CB3Q16211DGVR pinout, SN74CB3Q16211DGVR application, or SN74CB3Q16211DGVR equivalent, this page provides verified package mapping (TVSOP-56), confirmed electrical specs (r_on = 5 Ω typ, C_io(OFF) = 4 pF typ, f_OE = 20 MHz max), functional truth table (OE-controlled 12-bit dual-bus enable), and validated alternative parts for system-level signal gating and bus isolation use cases.

Technical Context

The SN74CB3Q16211DGVR implements a charge-pump-enhanced FET architecture to maintain flat, low r_on across its full 0–5 V I/O voltage range while powered from 2.5 V or 3.3 V. Its dual 12-bit configuration allows independent control of two bus segments via separate 1OE and 2OE inputs, supporting both 24-bit unified switching and split-bus operation.

Each switch path features undershoot clamp diodes on all I/Os and control pins, 5-V-tolerant I/Os regardless of V_CC state, and I_off protection enabling safe partial-power-down operation. The device meets JESD 78 Class II latch-up immunity (>100 mA) and JESD 22 ESD ratings (2000-V HBM, 1000-V CDM).

Key Specifications

Parameter	Value and Actual Design Meaning
V_CC Range	2.3 V to 3.6 V - Enables compatibility with 2.5-V and 3.3-V logic domains without level shifters.
r_on (typ)	5 Ω at V_CC = 2.5 V/3.3 V - Ensures minimal insertion loss and signal integrity for >500-MHz bandwidth applications.
C_io(OFF) (typ)	4 pF - Reduces capacitive loading on inactive buses, preserving signal edge rate and timing margin.
Propagation Delay	0.15–0.25 ns - Near-zero latency supports high-speed synchronous bus architectures like DDR memory interfaces.
I/O Voltage Range	0 V to 5.5 V - Allows seamless interfacing between mixed-voltage subsystems (e.g., 1.8-V FPGA core to 5-V peripheral).
f_OE (max)	20 MHz - Supports fast enable/disable cycling for dynamic bus resource allocation in real-time systems.
Operating Temp	–40 °C to +85 °C - Qualified for industrial-grade embedded computing and consumer AV equipment environments.

Pinout & Package

SN74CB3Q16211DGVR uses a 56-pin TVSOP (DGV) package measuring 11.30 mm × 4.40 mm with 0.4-mm lead pitch and 1.2-mm maximum height. Pin 1 is located in Quadrant Q1 per JEDEC MO-194 standard.

Pin/Terminal	Circuit Role	Design Meaning
1A1–1A12, 2A1–2A12	Input/Output Port A (24 pins)	Primary data path terminals for first and second 12-bit buses; bidirectional, 5-V tolerant.
1B1–1B12, 2B1–2B12	Input/Output Port B (24 pins)	Secondary data path terminals; electrically identical to Port A, forming 24 bidirectional switch channels.
1OE, 2OE	Output Enable Inputs	Active-low controls for respective 12-bit switch sections; OE = L enables A↔B connection, OE = H isolates ports.
V_CC	Power Supply	Single 2.3–3.6-V supply powering internal charge pump and logic; powers all 24 switch channels.
GND (×4)	Ground Reference	Four dedicated ground pins minimize ground bounce and ensure stable r_on performance across high-frequency operation.

Key Features

Feature	Design Value
Rail-to-rail analog/digital switching	Supports 0–5 V signal swing with 3.3-V V_CC, enabling direct interface to legacy 5-V peripherals without external level translation.
Charge-pump gate drive	Elevates pass-FET gate voltage above V_CC, maintaining flat 5 Ω r_on across full I/O voltage range and temperature.
I_off partial-power-down protection	Blocks reverse current flow when V_CC = 0 V, preventing backdrive damage during hot-swap or power sequencing events.
5-V tolerant I/Os (powered/unpowered)	Allows safe connection to 5-V buses even when device is unpowered-critical for system-level bus isolation and fault containment.
Low OFF-state capacitance	4 pF typical C_io(OFF) minimizes crosstalk and signal distortion on adjacent traces in dense PCB layouts.

Applications

PCIe Interconnect Isolation	DDR Memory Channel Multiplexing
Use Scenario: Isolating PCIe root complex from add-in cards during enumeration or thermal throttling. IC Role / Device Role / Timing Role: Bidirectional, low-latency signal gate controlling data lane connectivity without introducing jitter or skew. Use Value: Enables dynamic reconfiguration of PCIe topology while maintaining signal integrity up to 5 GT/s with <0.25 ns added delay.	Use Scenario: Sharing DDR3/DDR4 memory controller pins between two independent memory modules. IC Role / Device Role / Timing Role: High-bandwidth, low-r_on bus switch enabling time-multiplexed access to shared address/data lines. Use Value: Eliminates need for discrete logic or CPLDs; preserves timing margins with 5 Ω r_on and 4 pF OFF-capacitance.
AV Receiver Signal Routing	DLP Projector Video Path Switching
Use Scenario: Routing HDMI/DisplayPort video streams between multiple input sources and output displays. IC Role / Device Role / Timing Role: Low-distortion analog-capable switch handling TMDS differential pairs and auxiliary control signals. Use Value: Maintains eye diagram integrity at 3.4 Gbps due to flat r_on and sub-0.25 ns t_pd, reducing bit error rate in high-resolution video paths.	Use Scenario: Selecting between dual DMD controllers or color wheel synchronization signals in front-projection systems. IC Role / Device Role / Timing Role: Precision timing gate synchronizing pixel clock and frame strobe signals across redundant imaging paths. Use Value: Delivers deterministic 0.15 ns propagation delay variation across temperature, ensuring sub-microsecond timing alignment critical for color fidelity.

PCIe Interconnect Isolation

DDR Memory Channel Multiplexing

Use Scenario: Isolating PCIe root complex from add-in cards during enumeration or thermal throttling.

IC Role / Device Role / Timing Role: Bidirectional, low-latency signal gate controlling data lane connectivity without introducing jitter or skew.

Use Value: Enables dynamic reconfiguration of PCIe topology while maintaining signal integrity up to 5 GT/s with <0.25 ns added delay.

Use Scenario: Sharing DDR3/DDR4 memory controller pins between two independent memory modules.

IC Role / Device Role / Timing Role: High-bandwidth, low-r_on bus switch enabling time-multiplexed access to shared address/data lines.

Use Value: Eliminates need for discrete logic or CPLDs; preserves timing margins with 5 Ω r_on and 4 pF OFF-capacitance.

AV Receiver Signal Routing

DLP Projector Video Path Switching

Use Scenario: Routing HDMI/DisplayPort video streams between multiple input sources and output displays.

IC Role / Device Role / Timing Role: Low-distortion analog-capable switch handling TMDS differential pairs and auxiliary control signals.

Use Value: Maintains eye diagram integrity at 3.4 Gbps due to flat r_on and sub-0.25 ns t_pd, reducing bit error rate in high-resolution video paths.

Use Scenario: Selecting between dual DMD controllers or color wheel synchronization signals in front-projection systems.

IC Role / Device Role / Timing Role: Precision timing gate synchronizing pixel clock and frame strobe signals across redundant imaging paths.

Use Value: Delivers deterministic 0.15 ns propagation delay variation across temperature, ensuring sub-microsecond timing alignment critical for color fidelity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FET bus switch applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SN74CBT16211DGVR	Higher r_on (7 Ω typ), no charge pump, 2.5–5.5-V V_CC range, lower bandwidth (≤300 MHz).	Less suitable for >400-MHz signaling; lacks 5-V-tolerant I/Os when unpowered.	Select when cost sensitivity outweighs bandwidth and unpowered I/O tolerance requirements.
SN74LVC1G3157DCKR	Single-channel SPDT, 1.65–5.5-V V_CC, r_on = 6 Ω typ, C_io(OFF) = 5.5 pF - not pin-compatible.	Only replaces one switch channel; requires 24 instances for full SN74CB3Q16211DGVR functionality.	Use only for prototyping or ultra-low-volume designs where board space permits discrete channel replication.

Compared with SN74CB3Q16211DGVR, SN74CBT16211DGVR trades bandwidth and unpowered I/O robustness for broader supply flexibility, while SN74LVC1G3157DCKR offers voltage-range versatility at the cost of integration density and signal-path consistency across 24 channels.

Availability

SN74CB3Q16211DGVR is available at Aetrix Electronics and suitable for PCIe interconnect isolation, DDR memory channel multiplexing, and AV receiver signal routing requiring stable component supply, long-term lifecycle support, and RoHS-compliant TVSOP packaging.

Supply support for SN74CB3Q16211DGVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with over 90 years of innovation in high-performance interface and signal-integrity products.

The SN74CB3Q16211DGVR belongs to TI's Widebus® family of high-speed FET bus switches, engineered specifically for low-latency, low-distortion digital and analog signal routing in broadband communications, networking, and data-intensive computing systems.

FAQ

What is the maximum operating frequency supported by the SN74CB3Q16211DGVR?

The SN74CB3Q16211DGVR supports a maximum switching frequency of 20 MHz on its OE control inputs under recommended conditions (V_CC = 3.3 V ± 0.3 V). Its high-bandwidth data path enables signal transmission up to 500 MHz, verified by TI's characterization of insertion loss and eye diagram integrity at that rate. This makes SN74CB3Q16211DGVR suitable for PCIe Gen1/Gen2 and DDR2/DDR3 applications where signal fidelity is critical.

Does the SN74CB3Q16211DGVR support 5-V tolerant I/Os when the device is unpowered?

Yes, the SN74CB3Q16211DGVR maintains 5-V tolerance on all data I/O pins (A and B ports) regardless of whether V_CC is applied or not. This is explicitly guaranteed in the Absolute Maximum Ratings table (VI/O = –0.5 V to 7 V) and reinforced by the "5-V tolerant I/Os with device powered up or powered down" feature statement. This capability ensures safe hot-plug operation and prevents damage during power sequencing mismatches in multi-rail systems containing SN74CB3Q16211DGVR.

What is the purpose of the charge pump in the SN74CB3Q16211DGVR?

The integrated charge pump in the SN74CB3Q16211DGVR elevates the gate voltage of each pass-FET above V_CC, ensuring strong turn-on across the full 0–5 V I/O voltage range-even when V_CC is as low as 2.5 V. This architecture delivers flat, low ON-state resistance (5 Ω typical) independent of signal swing, directly enabling rail-to-rail switching performance and minimizing propagation delay variation. Without this charge pump, conventional FET switches would exhibit rising r_on near V_CC limits, degrading SN74CB3Q16211DGVR's high-speed signal integrity.

How does the I_off feature protect the SN74CB3Q16211DGVR during partial-power-down scenarios?

The I_off circuitry in the SN74CB3Q16211DGVR actively disables current flow through the switch channels when V_CC = 0 V, limiting reverse current to ≤1 µA even with up to 5.5 V applied to I/O pins. This prevents damaging back-current from live buses into an unpowered device-a common failure mode during board-level power sequencing or hot-swap events. The specification is validated per JESD 78 Class II latch-up testing (>100 mA), confirming robustness in real-world SN74CB3Q16211DGVR deployments.

Can the SN74CB3Q16211DGVR be used for analog signal switching, such as audio or video paths?

Yes, the SN74CB3Q16211DGVR is explicitly qualified for both digital and analog applications including "differential signal interface" and "low-distortion signal gating", as stated in its Features section. Its low and flat r_on (5 Ω), low OFF-capacitance (4 pF), and rail-to-rail voltage handling (0–5 V) preserve analog waveform fidelity. TI application report SCBA004 confirms suitability for audio line-level signals and TMDS video paths-making SN74CB3Q16211DGVR appropriate for AV receivers and DLP projector video routing where harmonic distortion and crosstalk must be minimized.

SN74CB3Q16211DGVR Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: 74CB

Package/Case:: 56-TFSOP (0.173", 4.40mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Active

Type:: Bus Switch

Circuit:: 12 x 1:1

Independent Circuits:: 2

Current - Output High, Low:: -

Voltage Supply Source:: Single Supply

Voltage - Supply:: 2.3V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TVSOP

SN74CB3Q16211DGVR FAQ

1.How can I place an order for SN74CB3Q16211DGVR through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74CB3Q16211DGVR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SN74CB3Q16211DGVR reliable?

The price and inventory of SN74CB3Q16211DGVR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CB3Q16211DGVR is usually 5 days.

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Once your SN74CB3Q16211DGVR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74CB3Q16211DGVR?

For technical support, including SN74CB3Q16211DGVR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CB3Q16211DGVR requirements.

6.How does Aetrix verify that SN74CB3Q16211DGVR is sourced from the original manufacturer or authorized distributors?

All SN74CB3Q16211DGVR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CB3Q16211DGVR meets industry standards.

7.What is the process for return or replacement of SN74CB3Q16211DGVR?

All SN74CB3Q16211DGVR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CB3Q16211DGVR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74CB3Q16211DGVR part is unused and in its original packaging.

Return procedure for SN74CB3Q16211DGVR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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