Texas Instruments SN74CB3Q16211DL
- Part No.:
- SN74CB3Q16211DL
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 56-BSSOP (0.295", 7.50mm Width)
- Datasheet:
-
SN74CB3Q16211DL.pdf
- Description:
- IC BUS SWITCH 12 X 1:1 56SSOP
- Quantity:
- Payment:

- Shipping:

Inventory:2,171
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Product details
Overview
SN74CB3Q16211DL from Texas Instruments is a 24-bit, low-voltage FET bus switch optimized for high-bandwidth digital signal routing in mixed-voltage systems. It features rail-to-rail switching (0 V to 5 V with 3.3-V VCC), 5 Ω typical ON-state resistance, 4 pF typical OFF-state I/O capacitance, and bidirectional operation with near-zero propagation delay (0.15 ns). It serves as a voltage-agnostic signal gate in PCI interfaces and memory interleaving paths.
For engineers reviewing the SN74CB3Q16211DL datasheet, SN74CB3Q16211DL pinout, SN74CB3Q16211DL application, or SN74CB3Q16211DL equivalent, key selection criteria include its 2.3–3.6-V VCC range, 5-V tolerant I/Os, Ioff-enabled partial-power-down capability, and SSOP-56 package compatibility with legacy board layouts requiring 18.4 mm × 7.49 mm footprint.
Technical Context
The SN74CB3Q16211DL implements two independent 12-bit FET bus switches, each controlled by dedicated OE inputs (1OE, 2OE), enabling flexible partitioning as either dual 12-bit or single 24-bit configurations. Its charge-pump-enhanced gate drive ensures flat ron across input voltage (0–5 V) and supply (2.3–3.6 V) ranges.
Each switch supports bidirectional, rail-to-rail data flow without level translation-enabling direct interfacing between 1.8-V, 2.5-V, 3.3-V, and 5-V logic domains. The device meets JESD 78 Class II latch-up immunity (>100 mA) and JESD 22 ESD ratings (2000-V HBM, 1000-V CDM), confirming robustness in hot-plug and mixed-signal environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.3 V to 3.6 V - enables operation from 2.5-V and 3.3-V rails without external regulators |
| ron (Typical) | 5 Ω - minimizes signal attenuation and timing skew in high-speed parallel buses |
| Cio(OFF) | 4 pF typical - reduces capacitive loading on upstream drivers and preserves signal integrity |
| Propagation Delay | 0.15 ns - supports >500-MHz bandwidth applications with sub-nanosecond timing budgets |
| Ioff | 1 µA at VCC = 0 V - prevents backflow current during partial power-down, protecting powered subsystems |
| Switching Frequency | 20 MHz max (fOE) - defines maximum toggle rate of OE control for dynamic bus isolation |
| Operating Temperature | –40 °C to +85 °C - qualified for industrial-grade embedded and consumer AV equipment |
Pinout & Package
SN74CB3Q16211DL uses a 56-pin SSOP (Shrink Small Outline Package) with 18.40 mm × 7.49 mm body size, 0.65-mm lead pitch, and gull-wing leads. Pin 1 is located at top-left corner with index marking; package conforms to JEDEC MO-153.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A1–1A12, 2A1–2A12 | Input/Output Port A (Group 1 & 2) | Primary data terminals for first and second 12-bit switch banks; bidirectional, 5-V tolerant |
| 1B1–1B12, 2B1–2B12 | Input/Output Port B (Group 1 & 2) | Secondary data terminals; electrically identical to A ports, enabling symmetric bus routing |
| 1OE, 2OE | Output Enable (Active-Low) | Independent control of each 12-bit bank; OE = L enables A↔B conduction, OE = H isolates ports |
| VCC | Power Supply | Single 2.3–3.6-V supply powers internal charge pump and logic; no separate analog/digital rails required |
| GND | Ground Reference | Four dedicated ground pins (pins 8, 17, 35, 44) reduce ground bounce in high-speed switching |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail signal switching | Supports 0–5-V signal swing with 3.3-V VCC, eliminating need for external level shifters in mixed-voltage interconnects |
| 5-V tolerant I/Os | Operates safely with 5-V signals regardless of VCC state (powered up/down), enabling hot-swap compatibility |
| Low and flat ron | 5 Ω typical across full 0–5-V I/O range and 2.3–3.6-V VCC, ensuring consistent signal fidelity and minimal insertion loss |
| Ioff protection | Blocks current flow when VCC = 0 V, allowing safe integration into systems with staggered power sequencing |
| Undershoot clamp diodes | Integrated clamps on all data and control inputs suppress negative transients below –1.8 V, reducing external TVS requirements |
Applications
| PCI Express Interconnect Isolation | Memory Interleaving Control |
|---|---|
Use Scenario: Isolating PCIe root complex from add-in cards during hot-plug events to prevent bus contention and signal corruption. IC Role / Device Role / Timing Role: Bidirectional, low-latency signal gate placed between upstream and downstream lanes; enables/disables physical layer connectivity under software control. Use Value: Eliminates need for discrete MOSFET arrays and level translators while maintaining sub-0.25-ns propagation delay and 5-V tolerance for legacy signaling. | Use Scenario: Dynamically routing address/data lines between two DDR memory banks in embedded PC platforms to increase effective bandwidth. IC Role / Device Role / Timing Role: 24-bit parallel bus switch configured as single bank; controlled by memory controller to alternate access between banks. Use Value: Achieves seamless bank switching with <5 Ω ron and <4 pF Cio(OFF), minimizing timing jitter and crosstalk in high-frequency memory channels. |
| DLP Front Projection Video Path | AV Receiver Digital Audio Routing |
Use Scenario: Gating high-speed LVDS video data streams between scaler IC and DMD controller in DLP projection systems. IC Role / Device Role / Timing Role: Low-distortion signal gate inserted in pixel clock and data lanes; operates at 100+ MHz with rail-to-rail 3.3-V swing. Use Value: Preserves edge integrity via 0.15-ns tpd and 4-pF OFF-capacitance, preventing intersymbol interference in multi-gigabit video links. | Use Scenario: Selecting between multiple SPDIF/TOSLINK audio sources in premium AV receivers before DAC conversion. IC Role / Device Role / Timing Role: Bidirectional digital audio switch handling 5-V peak S/PDIF signals with 3.3-V logic control; isolated during source changeovers. Use Value: Enables glitch-free source switching using Ioff protection and undershoot clamps, avoiding audible pops/clicks in sensitive audio paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FET bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBT16211DL | Higher ron (12 Ω typical), no charge pump, 4.5-V max VCC, lower bandwidth (~250 MHz) | Limited to 3.3-V-only systems; unsuitable for 5-V tolerant or >400-MHz applications | Select only if cost sensitivity outweighs performance needs and 5-V tolerance is unnecessary |
| SN74LVC16244ADLR | Buffer-based (not FET switch); higher propagation delay (3.5 ns), unidirectional, no Ioff | Requires direction control and level-shifting for bidirectional 5-V signaling; not suitable for partial-power-down | Choose only for simple unidirectional buffering where low ron and hot-swap isolation are not required |
Compared with SN74CB3Q16211DL, SN74CBT16211DL trades bandwidth and 5-V tolerance for lower cost, while SN74LVC16244ADLR replaces passive switching with active buffering-introducing directionality, latency, and power overhead incompatible with true bus isolation use cases.
Availability
SN74CB3Q16211DL is available at Aetrix Electronics and suitable for PCI interface isolation, memory interleaving control, DLP video path gating, and AV receiver digital audio routing requiring stable component supply and long-term industrial availability.
Supply support for SN74CB3Q16211DL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of expertise in high-speed interface and signal-integrity products.
The SN74CB3Q16211DL belongs to TI's Widebus® family of FET bus switches, engineered specifically for low-distortion, high-bandwidth digital signal routing in mixed-voltage computing, communications, and consumer AV systems.
FAQ
What is the maximum signal frequency supported by the SN74CB3Q16211DL?
The SN74CB3Q16211DL supports up to 500 MHz bandwidth in high-fidelity signal paths due to its low 5-Ω ron and 4-pF Cio(OFF), verified by TI's characterization. Its 20-MHz maximum OE switching frequency governs how rapidly the switch can be enabled/disabled-not the data rate itself-making it suitable for continuous high-speed data transmission when OE is held static.
Does the SN74CB3Q16211DL require external level shifters when interfacing 1.8-V and 5-V logic?
No, the SN74CB3Q16211DL does not require external level shifters. Its 5-V tolerant I/Os accept 0–5-V signals regardless of VCC (2.3–3.6 V), and rail-to-rail switching allows 1.8-V, 2.5-V, 3.3-V, and 5-V domains to interoperate directly through the same switch path without voltage translation.
How does the Ioff feature of the SN74CB3Q16211DL protect system-level power sequencing?
The Ioff circuitry in the SN74CB3Q16211DL limits current to 1 µA when VCC = 0 V, preventing damaging backflow from live 5-V buses into unpowered sections. This enables safe integration into systems with staggered power-up/down sequences-such as motherboards where peripherals power on before the main logic rail-without risk of latch-up or supply rail collapse.
Can the SN74CB3Q16211DL be used in both 12-bit dual-bank and 24-bit single-bank configurations?
Yes, the SN74CB3Q16211DL is internally structured as two independent 12-bit bus switches, each with dedicated OE inputs (1OE and 2OE). When both OE pins are asserted low, it functions as a unified 24-bit switch; when controlled separately, it provides isolated 12-bit routing-ideal for applications like dual-channel memory or split PCIe lane management.
What package type and dimensions does the SN74CB3Q16211DL use?
The SN74CB3Q16211DL uses a 56-pin SSOP (Shrink Small Outline Package) with body dimensions of 18.40 mm × 7.49 mm and 0.65-mm lead pitch. It is supplied in tube packaging (20 units per tube) and complies with RoHS, MSL Level-1, and JEDEC MO-153 standards.
SN74CB3Q16211DL Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CB
- Package/Case:
- 56-BSSOP (0.295", 7.50mm Width)
- Packaging:
- Bulk
- Product Status:
- Active
- Type:
- Bus Switch
- Circuit:
- 12 x 1:1
- Independent Circuits:
- 2
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-SSOP
SN74CB3Q16211DL FAQ
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6.How does Aetrix verify that SN74CB3Q16211DL is sourced from the original manufacturer or authorized distributors?
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7.What is the process for return or replacement of SN74CB3Q16211DL?
All SN74CB3Q16211DL units undergo pre-shipment inspection (PSI). If there is an issue with SN74CB3Q16211DL, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CB3Q16211DL part is unused and in its original packaging.
Return procedure for SN74CB3Q16211DL:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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