Texas Instruments SN74CB3Q16811DGGR
- Part No.:
- SN74CB3Q16811DGGR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 56-TFSOP (0.240", 6.10mm Width)
- Datasheet:
-
SN74CB3Q16811DGGR.pdf
- Description:
- IC BUS SWITCH 12 X 1:1 56TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SN74CB3Q16811DGGR from Texas Instruments is a 24-bit FET bus switch with precharged B-port outputs, designed for high-bandwidth bidirectional signal routing in 2.5-V/3.3-V systems. It features 5 Ω typical ON-state resistance, 4 pF OFF-state I/O capacitance, 5-V-tolerant I/Os, and supports rail-to-rail 0- to 5-V signaling - enabling PCI Hot Plug, memory interleaving, and bus isolation in networking and computing backplanes.
For engineers reviewing the SN74CB3Q16811DGGR datasheet, SN74CB3Q16811DGGR pinout, SN74CB3Q16811DGGR application, or SN74CB3Q16811DGGR equivalent, key selection criteria include precharge bias voltage (BIASV) support for live-insertion noise suppression, partial-power-down Ioff capability, flat ron over voltage range, and TSSOP-56 package compatibility with high-density PCB layouts.
Technical Context
This device integrates two independent 12-bit bus switches, each controlled by dedicated OE inputs (1OE, 2OE), allowing flexible partitioning as either dual 12-bit or single 24-bit switching paths. Its charge-pump gate drive enables low, flat ON-resistance across VCC = 2.3 V to 3.6 V and input voltages from 0 V to 5.5 V.
The B-port outputs are internally precharged via a 10-kΩ-equivalent path to BIASV (0–5 V), minimizing signal distortion during hot-plug events. Ioff circuitry blocks current backflow when VCC = 0 V, supporting true partial-power-down operation per JESD78 Class II latch-up compliance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.3 V to 3.6 V - ensures interoperability with both 2.5-V and 3.3-V logic domains without level shifters. |
| ron (Typ) | 5 Ω - delivers near-zero propagation delay (0.09 ns) and minimal signal attenuation for high-speed data buses. |
| Cio(OFF) | 4 pF typ - reduces capacitive loading on shared buses, preserving signal integrity and timing margins. |
| Ioff | 1 µA max at VCC = 0 V - prevents damaging back-current during system power sequencing or partial shutdown. |
| VI/O Range | 0 V to 5.5 V - enables mixed-voltage interfacing (e.g., 1.8-V A-port ↔ 5-V B-port) with no external clamping required. |
| tpd | 0.09–0.15 ns - determined by ron × CL time constant; supports >20 MHz switching frequency under light load. |
| BIASV Range | 0 V to 5 V - configurable precharge voltage aligns B-port DC bias with receiver threshold to suppress live-insertion glitches. |
Pinout & Package
TSSOP-56 package (DGG), 1.2 mm max height, 0.5 mm pitch, RoHS-compliant NiPdAu lead finish, MSL Level-1 (unlimited reflow).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1OE, 2OE | Independent output-enable controls | Active-low enables for each 12-bit section; OE = L connects A↔B; OE = H places B-port in precharged high-Z state. |
| 1A1–1A12, 2A1–2A12 | A-port data inputs/outputs | Unidirectional or bidirectional signal entry points; 5-V tolerant, no direction pin required. |
| 1B1–1B12, 2B1–2B12 | B-port data inputs/outputs | Precharged outputs; default to BIASV when OE = H or VCC = 0 V - eliminates floating-bus transients. |
| BIASV | Bias supply input | External reference (0–5 V) setting precharge level; must be stable before hot insertion to avoid threshold-crossing glitches. |
| VCC, GND | Power and ground | Single-supply operation; 56-pin layout includes multiple GND pins (pins 7, 18, 30, 43) for low-inductance return paths. |
Key Features
| Feature | Design Value |
|---|---|
| Precharged B-port outputs | Reduces live-insertion noise by holding B-port at BIASV during hot-plug, preventing glitch-induced false triggering in receivers. |
| Ioff partial-power-down | Blocks reverse current flow when VCC = 0 V, enabling safe insertion/removal of powered cards into active backplanes. |
| Rail-to-rail 0–5-V switching | Supports direct interface between sub-1-V logic (e.g., 0.8-V I/O) and 5-V legacy peripherals without external level translators. |
| Low and flat ON-resistance | 5 Ω typical across full VCC and VI/O range minimizes voltage drop and timing skew between parallel data lines. |
| Undershoot clamp diodes | Integrated input clamps protect against negative transients down to –1.8 V, eliminating need for external TVS on control lines. |
Applications
| PCI Hot Plug Interface | Memory Interleaving Bus |
|---|---|
|
Use Scenario: Inserting/removing expansion cards into live PCI/PCIe backplanes without disrupting system operation. IC Role / Device Role / Timing Role: Bidirectional bus switch isolating card-side signals from main bus; B-port precharge suppresses insertion glitches. Use Value: Eliminates need for complex hot-swap controllers; enables deterministic glitch-free handshaking at up to 20 MHz. |
Use Scenario: Dynamically routing address/data between dual memory banks in high-throughput server DIMM subsystems. IC Role / Device Role / Timing Role: Low-latency 24-bit path selector enabling bank-swapping with sub-0.15 ns propagation delay. Use Value: Maintains tight timing budgets across DDRx interfaces; 4 pF Cio(OFF) prevents crosstalk-induced setup/hold violations. |
| Backplane Signal Isolation | Multi-Voltage I/O Bridging |
|
Use Scenario: Segmenting high-speed control/data buses in telecom line cards to prevent fault propagation between modules. IC Role / Device Role / Timing Role: High-Z isolation switch activated by system management controller during fault detection. Use Value: Achieves >10⁹ Ω off-isolation; Ioff < 1 µA ensures no leakage-induced reset or latch-up during module power cycling. |
Use Scenario: Interfacing 1.8-V FPGA I/O banks with 3.3-V or 5-V peripheral ASICs in industrial PLC I/O modules. IC Role / Device Role / Timing Role: Voltage-agnostic bidirectional translator with no direction control or external biasing. Use Value: Supports simultaneous 0.8-V, 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V signaling on same bus - reducing BOM count by 3+ discrete level shifters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDTQS3VH16811PAG | Same 24-bit architecture and precharge function; 5.5-V max VI/O but only 3.6-V VCC max; no integrated undershoot clamps. | Requires external clamping for –1.8-V transient protection; less robust in noisy industrial environments. | Preferred where legacy IDT footprint compatibility is mandatory and transient immunity is secondary. |
| SN74CBTLV16212DGGR | Lower ron (3 Ω typ) but no BIASV precharge; Ioff not specified for VCC = 0 V; 3.6-V VI/O max. | Cannot suppress live-insertion glitches; unsuitable for PCI Hot Plug without additional bias circuitry. | Select when maximum speed is critical and hot-plug operation is not required. |
Compared with IDTQS3VH16811PAG and SN74CBTLV16212DGGR, the SN74CB3Q16811DGGR uniquely combines precharge-enabled glitch suppression, –1.8-V undershoot clamping, and verified Ioff at VCC = 0 V - making it the only option qualified for standards-compliant PCI Hot Plug and partial-power-down systems without design compromises.
Availability
SN74CB3Q16811DGGR is available at Aetrix Electronics and suitable for PCI Hot Plug interfaces, memory interleaving subsystems, and multi-voltage I/O bridging requiring stable component supply across extended temperature ranges (–40°C to +85°C) and long production lifecycles.
Supply support for SN74CB3Q16811DGGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in high-reliability interface solutions.
The SN74CB3Q16811DGGR belongs to TI's Widebus™ family of high-speed FET bus switches, engineered specifically for bandwidth-critical applications including hot-pluggable computing infrastructure, telecom backplanes, and mixed-voltage industrial control systems.
FAQ
What is the purpose of the BIASV pin on the SN74CB3Q16811DGGR?
The BIASV pin sets the precharge voltage for the B-port outputs. When an output-enable signal is deasserted (OE = H) or VCC is removed, the B-port is pulled to BIASV through an internal ~10-kΩ path. This prevents floating-bus conditions and suppresses live-insertion glitches by ensuring the B-port remains outside the input threshold region of downstream receivers - a critical requirement for PCI Hot Plug compliance. For optimal performance, BIASV should match the receiver's input switching threshold.
Can the SN74CB3Q16811DGGR operate with VCC = 2.5 V while switching 5-V signals on the I/O ports?
Yes, the SN74CB3Q16811DGGR supports 0- to 5-V signaling on all data I/Os (A and B ports) with VCC as low as 2.3 V. At VCC = 2.5 V, its typical ON-state resistance remains 5 Ω, and VI/O tolerance extends to 5.5 V - enabling direct interfacing between low-voltage controllers (e.g., 2.5-V FPGA banks) and 5-V peripherals without external level-shifting circuitry. Control inputs also accept TTL/CMOS levels across the full VCC range.
How does the Ioff feature of the SN74CB3Q16811DGGR protect the system during partial power-down?
The Ioff circuitry in the SN74CB3Q16811DGGR actively disables current paths when VCC = 0 V, limiting reverse current through the switch to ≤1 µA even if 5-V signals remain present on A or B ports. This prevents back-driving powered-down sections of the system, avoids unintended logic states, and eliminates risk of damage to unpowered ICs - a necessity for reliable hot-swap and modular power architecture designs.
Is the SN74CB3Q16811DGGR pin-compatible with other devices in the SN74CB3Q family?
Yes, the SN74CB3Q16811DGGR shares identical pinout, package (TSSOP-56), and functional block diagram with other members of the SN74CB3Q16xxx series, including SN74CB3Q16210 and SN74CB3Q16244 in the same DGG package. All support the same BIASV precharge architecture, Ioff, and 5-V-tolerant I/Os - enabling drop-in replacement within the family for bandwidth or channel-count optimization.
What is the maximum recommended switching frequency for the SN74CB3Q16811DGGR?
The SN74CB3Q16811DGGR supports up to 20 MHz maximum switching frequency on its OE control inputs under standard test conditions (VO > VCC, VI = 5 V, RL ≥1 MΩ, CL = 0). In practical PCB implementations with typical trace capacitance (≤5 pF), sustained operation at 15–18 MHz is achievable. Propagation delay remains stable at 0.09–0.15 ns due to flat ron, making it suitable for high-speed burst-mode data gating in networking and storage applications.
SN74CB3Q16811DGGR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CB
- Package/Case:
- 56-TFSOP (0.240", 6.10mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Bus Switch
- Circuit:
- 12 x 1:1
- Independent Circuits:
- 2
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSSOP
SN74CB3Q16811DGGR FAQ
1.How can I place an order for SN74CB3Q16811DGGR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CB3Q16811DGGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74CB3Q16811DGGR reliable?
The price and inventory of SN74CB3Q16811DGGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CB3Q16811DGGR is usually 5 days.
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SN74CB3Q16811DGGR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74CB3Q16811DGGR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74CB3Q16811DGGR?
For technical support, including SN74CB3Q16811DGGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CB3Q16811DGGR requirements.
6.How does Aetrix verify that SN74CB3Q16811DGGR is sourced from the original manufacturer or authorized distributors?
All SN74CB3Q16811DGGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CB3Q16811DGGR meets industry standards.
7.What is the process for return or replacement of SN74CB3Q16811DGGR?
All SN74CB3Q16811DGGR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CB3Q16811DGGR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CB3Q16811DGGR part is unused and in its original packaging.
Return procedure for SN74CB3Q16811DGGR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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