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Texas Instruments SN74CB3Q32245GKER

Part No.:
SN74CB3Q32245GKER
Manufacturer:
Texas Instruments
Category:
Signal Switches, Multiplexers, Decoders
Package:
96-LFBGA
Datasheet:
AetrixSN74CB3Q32245GKER.pdf
Description:
IC BUS SWITCH 8 X 1:1 96LFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,292

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Product details

Overview

SN74CB3Q32245GKER from Texas Instruments is a high-bandwidth 32-bit FET bus switch organized as four independent 8-bit bidirectional switches, featuring 5-Ω typical ON-state resistance (ron), rail-to-rail 0–5-V switching capability with 3.3-V VCC, and 4-pF typical OFF-state I/O capacitance. It enables low-distortion signal gating in PCI interfaces and memory interleaving systems.

For engineers reviewing the SN74CB3Q32245GKER datasheet, SN74CB3Q32245GKER pinout, SN74CB3Q32245GKER application, or SN74CB3Q32245GKER equivalent, key selection criteria include partial-power-down support via Ioff, 20-MHz maximum OE switching frequency, flat ron over voltage range, and LFBGA-64 (GKE) package compatibility with high-density routing.

Technical Context

The SN74CB3Q32245GKER implements charge-pump-enhanced FET switches to maintain low and flat ON-state resistance across 0–5-V I/O signaling levels, enabling rail-to-rail operation without level-shifting circuitry. Its four independent 8-bit sections each feature dedicated OE inputs (1OE–4OE) for granular bus isolation control.

Each switch supports bidirectional data flow with near-zero propagation delay (0.18 ns typical at 3.3 V), sub-8 ns enable/disable times, and 5-V-tolerant I/Os even when powered down-enabling hot-swap and partial-power-down system architectures compliant with JESD 78 Class II latch-up immunity.

Key Specifications

Parameter Value and Actual Design Meaning
VCC Range2.3 V to 3.6 V - Enables use in 2.5-V and 3.3-V logic domains with margin for supply variation.
ron (Typical)5 Ω - Ensures minimal voltage drop and signal attenuation for high-speed digital/analog signals up to 500 MHz.
Cio(OFF)4 pF typical - Reduces capacitive loading on driven buses, preserving signal integrity and timing margins.
tpd0.18 ns typical - Delivers near-instantaneous signal pass-through critical for synchronous bus architectures.
fOE Max20 MHz - Supports fast enable/disable cycling for dynamic bus segmentation in real-time systems.
Ioff1 µA at VCC = 0 - Prevents backflow current during power-down, enabling safe partial-power-down mode operation.
VI/O Range0 to 5.5 V - Allows interoperability with 0.8-V to 5-V logic families without external level shifters.

Pinout & Package

LFBGA-64 (GKE) package, 5 mm × 5 mm, 0.5-mm pitch, bottom-side solder balls, moisture sensitivity level 3. Pinout validated per SCES622 Figure 1 (top view).

Pin/Terminal Circuit Role Design Meaning
1A1–1A8, 2A1–2A8, 3A1–3A8, 4A1–4A8Data input/output port A (four 8-bit groups)Bidirectional signal path; electrically identical to corresponding B pins when switch enabled.
1B1–1B8, 2B1–2B8, 3B1–3B8, 4B1–4B8Data input/output port B (four 8-bit groups)Paired with A ports; no directionality-signal flows freely between A and B when OE active low.
1OE, 2OE, 3OE, 4OEActive-low output-enable controlIndependent enable per 8-bit section; drives associated A/B pair into high-Z when high.
VCC (pins C3, C4, L3, L4)Power supplySingle 2.3–3.6-V supply powers all four switch banks and internal charge pump.
GND (pins B2, B3, D1, D2, K2, K3, M1, M2)Ground referenceEight dedicated ground balls minimize ground bounce and improve noise immunity.
NC (pins A1, A6, H1, T1)No internal connectionUnbonded pads; must remain unconnected on PCB to avoid parasitic coupling.

Key Features

Feature Design Value
Rail-to-rail 0–5-V switchingOperates with 3.3-V VCC while passing 0–5-V signals - eliminates need for external level translators in mixed-voltage systems.
Charge-pump gate driveElevates FET gate voltage to ensure low, flat ron across full VI/O range - maintains consistent timing and amplitude response.
Partial-power-down support (Ioff)Leakage <1 µA when VCC = 0 - prevents back-current damage during hot-plug or staggered power sequencing.
Low 4-pF OFF-state capacitanceMinimizes bus loading and crosstalk in high-frequency applications like DDR memory channels and PCIe sideband paths.
Undershoot clamp diodesIntegrated clamps on all data/control pins - protects against negative transients down to −1.8 V without external components.

Applications

PCI Interface Differential Signal Interface

Use Scenario: Isolating legacy PCI slots from shared address/data buses during hot-plug insertion or configuration changes.

IC Role / Device Role / Timing Role: Bidirectional 32-bit bus switch providing zero-delay signal pass-through and high-impedance isolation under OE control.

Use Value: Eliminates bus contention and timing skew during reconfiguration while supporting 33-MHz PCI clock domains without added latency.

Use Scenario: Gating LVDS or RSDS differential pairs in programmable interconnect fabrics for FPGA-based test equipment.

IC Role / Device Role / Timing Role: Low-capacitance, low-ron analog switch enabling clean differential signal routing without common-mode distortion.

Use Value: Preserves signal integrity (Cio(OFF) = 4 pF) and edge fidelity (tpd = 0.18 ns) essential for >200-Mbps differential links.

Memory Interleaving Bus Isolation

Use Scenario: Dynamically connecting alternate DRAM banks to a shared controller in dual-channel memory subsystems.

IC Role / Device Role / Timing Role: Four independent 8-bit switches allow per-bank enable control synchronized with memory access cycles.

Use Value: Enables bank-level isolation with sub-nanosecond timing alignment, reducing row activation conflicts and improving bandwidth utilization.

Use Scenario: Segregating debug/trace buses from main system buses in automotive ADAS ECUs to meet ASIL-B fault containment requirements.

IC Role / Device Role / Timing Role: High-impedance isolation barrier activated by safety monitor signals during fault conditions.

Use Value: Achieves >10⁹ Ω isolation resistance with Ioff <1 µA, satisfying diagnostic coverage targets for functional safety compliance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus switch applications.

Alternative Part Technical Difference Application Difference Selection Advice
SN74CBTLV3245PWRLower VCC range (2.3–3.6 V same), but ron = 6 Ω typical and Cio(OFF) = 5.5 pF - higher loss and loading.Optimized for lower-power 1.8-V systems; lacks 5-V-tolerant I/Os and charge pump - unsuitable for mixed-voltage hot-swap.Select only if cost-sensitive and 5-V tolerance is unnecessary; verify ron impact on signal rise time.
PI3CH485LESame 32-bit architecture, but ron = 7 Ω typical, Cio(OFF) = 6 pF, and no Ioff support - higher leakage during power-down.Targeted at telecom line cards; requires external pull-ups for OE and lacks undershoot clamps - increases BOM count.Consider only for non-hot-swap applications where TI's Ioff and clamping features are not required.

Compared with SN74CB3Q32245GKER, SN74CBTLV3245PWR offers lower cost but sacrifices 5-V tolerance and hot-swap robustness, while PI3CH485LE trades off isolation safety and transient protection for slightly smaller footprint - making SN74CB3Q32245GKER optimal for mixed-voltage, safety-critical, or high-fidelity signal routing.

Availability

SN74CB3Q32245GKER is available at Aetrix Electronics and suitable for PCI interface design, memory interleaving systems, differential signal routing, and bus isolation applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for SN74CB3Q32245GKER includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of innovation in high-speed interface and signal-integrity technologies.

The SN74CB3Q32245GKER belongs to TI's Widebus+™ family of high-bandwidth FET bus switches, engineered specifically for low-distortion, rail-to-rail signal gating in broadband communications, networking infrastructure, and data-intensive computing platforms.

FAQ

What is the maximum signal frequency supported by the SN74CB3Q32245GKER?

The SN74CB3Q32245GKER supports high-bandwidth data paths up to 500 MHz, as confirmed in the device's characterization report (SCDA008). This performance derives from its 5-Ω typical ON-state resistance and 4-pF OFF-state I/O capacitance, which jointly minimize RC delay and preserve signal edge rates. Actual usable frequency depends on PCB layout, load capacitance, and termination - but the SN74CB3Q32245GKER itself imposes no intrinsic bandwidth limit below 500 MHz.

Does the SN74CB3Q32245GKER support hot-swap or partial-power-down operation?

Yes, the SN74CB3Q32245GKER fully supports partial-power-down via its Ioff circuitry, limiting current backflow to 1 µA when VCC = 0. This allows safe insertion/removal while other system rails remain active. The device also features 5-V-tolerant I/Os regardless of VCC state, and undershoot clamp diodes protect against −1.8-V transients - all critical for robust hot-swap implementation in server backplanes and modular instrumentation.

Can the SN74CB3Q32245GKER operate with 2.5-V VCC while switching 0–3.3-V signals?

Yes, the SN74CB3Q32245GKER explicitly supports 0–3.3-V switching with 2.5-V VCC, as stated in the datasheet's "Rail-to-Rail Switching" section. Its integrated charge pump ensures the pass transistor remains fully enhanced across this combination, delivering flat 5-Ω ron and maintaining sub-0.3-ns propagation delay. This capability eliminates external level shifters in mixed-supply systems such as FPGA I/O banks interfacing with 3.3-V peripherals.

How many independent bus switch sections does the SN74CB3Q32245GKER provide?

The SN74CB3Q32245GKER provides four independent 8-bit bus switch sections, each controlled by its own active-low output-enable input (1OE through 4OE). These can be configured flexibly: as four separate 8-bit switches, two 16-bit switches (by tying adjacent OEs), or one unified 32-bit switch (by tying all four OEs together). This configurability enables precise bus segmentation in complex memory or I/O expansion architectures.

What package type and pin count does the SN74CB3Q32245GKER use?

The SN74CB3Q32245GKER uses the LFBGA-64 (GKE) package: a 5 mm × 5 mm, 0.5-mm pitch, 64-ball grid array with exposed thermal pad. It contains 32 bidirectional data pins (divided into four A/B port groups), four OE controls, eight ground balls, two VCC balls, and four NC positions. This compact, high-I/O-density package supports fine-pitch routing for space-constrained high-speed designs.

SN74CB3Q32245GKER Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74CB
Package/Case:
96-LFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Type:
Bus Switch
Circuit:
8 x 1:1
Independent Circuits:
4
Current - Output High, Low:
-
Voltage Supply Source:
Single Supply
Voltage - Supply:
2.3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
96-LFBGA (13.5x5.5)

SN74CB3Q32245GKER FAQ

1.How can I place an order for SN74CB3Q32245GKER through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74CB3Q32245GKER on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of SN74CB3Q32245GKER are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CB3Q32245GKER is usually 5 days.

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Once your SN74CB3Q32245GKER order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74CB3Q32245GKER?

For technical support, including SN74CB3Q32245GKER datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CB3Q32245GKER requirements.

6.How does Aetrix verify that SN74CB3Q32245GKER is sourced from the original manufacturer or authorized distributors?

All SN74CB3Q32245GKER products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CB3Q32245GKER meets industry standards.

7.What is the process for return or replacement of SN74CB3Q32245GKER?

All SN74CB3Q32245GKER units undergo pre-shipment inspection (PSI). If there is an issue with SN74CB3Q32245GKER, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74CB3Q32245GKER part is unused and in its original packaging.

Return procedure for SN74CB3Q32245GKER:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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