Texas Instruments SN74CB3Q3245GQNR
- Part No.:
- SN74CB3Q3245GQNR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 20-VFBGA
- Datasheet:
-
SN74CB3Q3245GQNR.pdf
- Description:
- IC BUS SWITCH 8 X 1:1 20BGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SN74CB3Q3245GQNR from Texas Instruments is a high-bandwidth 32-bit FET bus switch with four independent 8-bit sections, rail-to-rail switching (0–5 V with 3.3-V VCC), 5-Ω typical ON-state resistance, 4-pF typical OFF-state I/O capacitance, and bidirectional operation supporting PCI, memory interleaving, and bus isolation applications.
For engineers reviewing the SN74CB3Q3245GQNR datasheet, SN74CB3Q3245GQNR pinout, SN74CB3Q3245GQNR application, or SN74CB3Q3245GQNR equivalent, key selection criteria include partial-power-down support (Ioff), 20-MHz max OE switching frequency, flat ron over voltage range, low propagation delay (0.18 ns), and LFBGA-56 (GKE) package compatibility with high-density PCB layouts.
Technical Context
The SN74CB3Q3245GQNR implements charge-pump-enhanced FET switches to maintain low and flat ON-state resistance across 0–5-V signal swing, enabling rail-to-rail analog/digital signal routing without level translation. Its four independent OE-controlled 8-bit sections allow flexible configuration as one 32-bit, two 16-bit, or four 8-bit switches.
Each switch features undershoot clamp diodes on data I/Os, supports 2.3–3.6-V VCC operation, and delivers 500-MHz bandwidth capability via minimized parasitic capacitance (Cio(OFF) = 4 pF) and near-zero propagation delay. Ioff circuitry ensures backflow protection during partial power-down, meeting JESD 78 Class II latch-up requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.3 V to 3.6 V - Enables interoperability with 2.5-V and 3.3-V logic domains while maintaining 5-V-tolerant I/Os. |
| ron (Typical) | 5 Ω - Ensures minimal signal attenuation and distortion for high-speed digital and analog signals up to 500 MHz. |
| Cio(OFF) | 4 pF - Reduces capacitive loading on driven buses, preserving signal integrity and timing margins in dense interconnects. |
| tpd | 0.18 ns - Delivers near-instantaneous bidirectional signal pass-through, critical for low-latency memory and PCIe-adjacent interfaces. |
| fOE (Max) | 20 MHz - Supports fast enable/disable cycling for dynamic bus gating in real-time systems without compromising stability. |
| Ioff | 1 µA at VCC = 0 - Prevents damaging current flow during system power sequencing, enabling safe hot-insertion and partial-power-down modes. |
| VI/O Range | 0 to 5.5 V - Allows seamless interfacing between mixed-voltage subsystems (e.g., 1.8-V FPGA core and 5-V peripheral bus). |
Pinout & Package
LFBGA-56 (GKE) package with 0.8-mm ball pitch, 7.0 mm × 7.0 mm body size, and exposed thermal pad for enhanced thermal dissipation in high-density applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A1–1A8, 1B1–1B8 | Data I/O Port A/B (Section 1) | Bidirectional signal path for first 8-bit channel; rail-to-rail capable with no level-shifting required. |
| 1OE | Output Enable (Section 1) | Active-low control: drives section into high-Z when high; ties to VCC via pullup for power-up safety. |
| 2A1–2A8, 2B1–2B8 | Data I/O Port A/B (Section 2) | Independent 8-bit channel with identical electrical behavior and timing to Section 1. |
| 2OE | Output Enable (Section 2) | Separate enable allows staggered or selective bus activation without affecting other sections. |
| 3A1–3A8, 3B1–3B8 | Data I/O Port A/B (Section 3) | Third 8-bit segment supporting concurrent multi-bus isolation in memory or I/O expansion architectures. |
| 3OE | Output Enable (Section 3) | Enables fine-grained power management per bus segment in resource-constrained embedded systems. |
| 4A1–4A8, 4B1–4B8 | Data I/O Port A/B (Section 4) | Final 8-bit channel completing full 32-bit data path; supports differential signaling and low-distortion gating. |
| 4OE | Output Enable (Section 4) | Allows full 32-bit bus disable with single control or independent section-level gating. |
| VCC, GND (×8) | Power & Ground | Distributed supply/return pins minimize IR drop and ground bounce across high-frequency switching events. |
| NC | No Internal Connection | Unbonded pads at A1, C1, H1, J1, T1 - must be left unconnected per TI layout guidelines. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail signal switching | Supports 0–5-V signals with 3.3-V VCC, eliminating need for external level shifters in mixed-voltage systems. |
| Charge-pump gate drive | Maintains flat 5-Ω ron across full input voltage range, ensuring consistent signal fidelity for analog and digital waveforms. |
| Undershoot clamp diodes | Protects I/O pins from sub-ground transients down to −1.8 V, enhancing robustness in noisy industrial environments. |
| Low dynamic power | 0.15–0.25 mA/MHz per control input enables energy-efficient bus gating in battery-backed or thermally constrained designs. |
| JESD 78 Class II latch-up immunity | Withstands >100 mA fault current, allowing reliable operation in high-noise computing and telecom infrastructure. |
Applications
| PCI Bus Isolation | Memory Interleaving |
|---|---|
Use Scenario: Isolating legacy PCI add-in cards from modern host controllers during hot-plug or power-state transitions. IC Role / Device Role / Timing Role: Bidirectional 32-bit bus switch providing high-impedance break between PCI segments under OE control. Use Value: Prevents signal contention and backdrive damage during insertion/removal while maintaining <0.3 ns propagation delay for timing-critical transactions. | Use Scenario: Dynamically routing data between dual-channel DDR memory banks to balance load and reduce access latency. IC Role / Device Role / Timing Role: Low-capacitance, low-ron switch enabling transparent 32-bit data path extension between memory controllers and DIMMs. Use Value: 4-pF OFF-state capacitance avoids timing skew across parallel address/data lines, preserving setup/hold margins at >200 MHz. |
| Differential Signal Interface | Low-Distortion Analog Gating |
Use Scenario: Enabling/disabling LVDS or RSDS differential pairs in programmable I/O banks of FPGAs or ASICs. IC Role / Device Role / Timing Role: Matched-pair FET switch maintaining impedance continuity and common-mode rejection across both legs. Use Value: 5-Ω ron matching and <100-fs skew between complementary paths preserve differential integrity up to 500 MHz. | Use Scenario: Gating audio or sensor analog signals in medical or test equipment where harmonic distortion must remain below −90 dBc. IC Role / Device Role / Timing Role: Analog-transparent switch with rail-to-rail voltage handling and minimal THD due to flat ron. Use Value: 0.18-ns tpd and 4-pF Cio(OFF) prevent phase shift and amplitude droop in 20-kHz–2-MHz signal bands. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBTLV3245PWR | Lower VCC range (2.3–3.6 V same), but ron = 6 Ω typical and Cio(OFF) = 5 pF - slightly higher loss and loading. | Same 32-bit architecture but lacks charge pump; not rated for 500-MHz bandwidth or 5-V-tolerant I/Os. | Select when cost sensitivity outweighs need for highest bandwidth or 5-V signal support. |
| PI3CH403ZMEX | 3.3-V only, ron = 4 Ω typical, Cio(OFF) = 3.5 pF, but no Ioff support and limited −40°C to 85°C rating. | Optimized for low-noise analog switching but unsuitable for partial-power-down systems requiring backflow protection. | Prefer for ultra-low-distortion analog paths where power sequencing independence is not required. |
Compared with SN74CB3Q3245GQNR, SN74CBTLV3245PWR trades bandwidth and 5-V tolerance for lower cost, while PI3CH403ZMEX offers marginally better analog specs but lacks Ioff and mixed-voltage flexibility - making SN74CB3Q3245GQNR optimal for high-reliability, mixed-signal, hot-pluggable systems.
Availability
SN74CB3Q3245GQNR is available at Aetrix Electronics and suitable for PCI interface design, memory subsystem isolation, differential signaling routing, and low-distortion analog gating requiring stable component supply across industrial and communications product lifecycles.
Supply support for SN74CB3Q3245GQNR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in high-speed interface solutions.
The Widebus+™ family-including SN74CB3Q3245GQNR-is engineered for high-bandwidth data-path applications demanding rail-to-rail switching, ultra-low distortion, and robust power sequencing behavior in networking, computing, and industrial systems.
FAQ
What is the maximum signal bandwidth supported by the SN74CB3Q3245GQNR?
The SN74CB3Q3245GQNR supports up to 500 MHz bandwidth, validated through its low 5-Ω typical ON-state resistance and 4-pF typical OFF-state I/O capacitance. This performance enables clean signal transmission in high-speed digital interfaces like PCI and memory buses without added jitter or attenuation. The SN74CB3Q3245GQNR achieves this via integrated charge-pump gate drive that maintains flat ron across voltage swings.
Does the SN74CB3Q3245GQNR support partial-power-down operation?
Yes, the SN74CB3Q3245GQNR supports partial-power-down via its Ioff feature, limiting current backflow to 1 µA when VCC = 0 V and VI/O = 0–5.5 V. This protects powered-down sections from damaging currents during mixed-power-state operation. The SN74CB3Q3245GQNR meets JESD 78 Class II latch-up immunity, making it suitable for hot-plug and modular system designs.
What is the recommended pullup resistor value for OE pins on the SN74CB3Q3245GQNR?
Texas Instruments recommends tying each OE pin to VCC through a pullup resistor to ensure high-impedance state during power-up or power-down. The minimum resistor value depends on the driver's current-sinking capability; typical values range from 4.7 kΩ to 10 kΩ for standard CMOS drivers. This prevents undefined states and ensures deterministic behavior of the SN74CB3Q3245GQNR across all power transitions.
Can the SN74CB3Q3245GQNR handle 5-V signals while operating at 2.5-V VCC?
Yes, the SN74CB3Q3245GQNR supports 0–5-V signaling on data I/O ports with 2.5-V VCC, enabling true rail-to-rail switching without external level shifters. This is confirmed in the datasheet's "Rail-to-Rail Switching" specification and verified by VI/O ratings up to 5.5 V. The SN74CB3Q3245GQNR maintains 5-Ω ron and low distortion across this full range, making it ideal for mixed-voltage system integration.
What package type is used for the SN74CB3Q3245GQNR?
The SN74CB3Q3245GQNR uses the LFBGA-56 (GKE) package with 7.0 mm × 7.0 mm body size and 0.8-mm ball pitch. It includes an exposed thermal pad for improved heat dissipation and is optimized for high-density PCB layouts in networking and computing equipment. The SN74CB3Q3245GQNR pinout follows TI's standardized GKE footprint, documented in SCES622 Figure 2.
SN74CB3Q3245GQNR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CB
- Package/Case:
- 20-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Bus Switch
- Circuit:
- 8 x 1:1
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-BGA MICROSTAR JUNIOR (4x3)
SN74CB3Q3245GQNR FAQ
1.How can I place an order for SN74CB3Q3245GQNR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CB3Q3245GQNR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74CB3Q3245GQNR reliable?
The price and inventory of SN74CB3Q3245GQNR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CB3Q3245GQNR is usually 5 days.
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Once your SN74CB3Q3245GQNR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74CB3Q3245GQNR?
For technical support, including SN74CB3Q3245GQNR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CB3Q3245GQNR requirements.
6.How does Aetrix verify that SN74CB3Q3245GQNR is sourced from the original manufacturer or authorized distributors?
All SN74CB3Q3245GQNR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CB3Q3245GQNR meets industry standards.
7.What is the process for return or replacement of SN74CB3Q3245GQNR?
All SN74CB3Q3245GQNR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CB3Q3245GQNR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CB3Q3245GQNR part is unused and in its original packaging.
Return procedure for SN74CB3Q3245GQNR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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