Texas Instruments SN74CB3Q3245RGYR
- Part No.:
- SN74CB3Q3245RGYR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 20-VFQFN Exposed Pad
- Datasheet:
-
SN74CB3Q3245RGYR.pdf
- Description:
- IC BUS SWITCH 8 X 1:1 20VQFN
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SN74CB3Q3245 from Texas Instruments is an 8-bit FET bus switch optimized for high-bandwidth, low-voltage digital signal routing in 2.3–3.6 V systems. It delivers rail-to-rail switching (0–5 V), 4 Ω typical ON-state resistance, <0.2 ns propagation delay, and 5-V-tolerant I/Os - enabling bidirectional signal gating in PCI interfaces, memory interleaving, and bus isolation applications.
For engineers reviewing the SN74CB3Q3245 datasheet, SN74CB3Q3245 pinout, SN74CB3Q3245 application, or SN74CB3Q3245 equivalent, key selection considerations include its 20-pin VQFN (RGY) package, Ioff partial-power-down support, 3.5 pF OFF-state I/O capacitance, and compatibility with 1.2 V to 5 V signaling levels across mixed-voltage domains.
Technical Context
The SN74CB3Q3245 implements a charge-pump-enhanced FET architecture to maintain flat, low ON-state resistance (4–8 Ω) across input voltages from 0 V to VCC, enabling distortion-free analog/digital signal pass-through. Its single OE control enables synchronous 8-bit channel enable/disable with 1.5–6.5 ns enable/disable times.
Designed for voltage-translation-agnostic operation, it supports 0–5 V data I/Os regardless of VCC (2.5 V or 3.3 V), while featuring undershoot clamp diodes, 5-V-tolerant control inputs, and JESD78 Class II latch-up immunity - critical for hot-swap and mixed-supply system interconnects.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.3 V to 3.6 V - ensures stable operation across 2.5 V and 3.3 V logic domains without level shifters. |
| ron (Typ) | 4 Ω at VCC = 3.3 V - minimizes voltage drop and timing skew in high-speed parallel buses. |
| Cio(OFF) | 3.5 pF typical - reduces capacitive loading on source and destination buses, preserving signal integrity. |
| tpd | 0.12–0.20 ns - enables sub-nanosecond propagation for >500 MHz bandwidth applications. |
| Ioff | 1 µA max at VCC = 0 - prevents backflow current during partial power-down, protecting powered subsystems. |
| fOE (Max) | 20 MHz - supports high-frequency enable/disable cycling for dynamic bus resource allocation. |
| VI/O Range | 0 V to 5.5 V - allows seamless interfacing between 1.2 V, 1.8 V, 2.5 V, 3.3 V, and 5 V logic families. |
Pinout & Package
VQFN-20 (RGY) package: 3.5 mm × 4.5 mm, 0.5 mm pitch, 1 mm max height, with exposed thermal pad (Pin 21) requiring PCB soldering for thermal and mechanical reliability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 20 | No-connect (NC) | Internally unconnected - must be left floating or tied to GND/VCC per layout best practice; no electrical function. |
| 2–9, 11–18 | A1–A8 / B1–B8 | Bidirectional data channels - A and B ports are electrically symmetric; signal flows freely in either direction when enabled. |
| 10 | GND | Ground reference - primary return path for switch current and internal charge pump. |
| 19 | VCC | Supply input - powers internal charge pump and bias circuitry; range 2.3–3.6 V. |
| 12 | OE | Active-low output enable - drives all 8 switches simultaneously; low = ON (A↔B connected), high = OFF (high-Z isolation). |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail analog/digital switching | Supports 0–5 V signal pass-through with 4 Ω ron - preserves waveform fidelity for clock, data, and control signals across voltage domains. |
| Ioff partial-power-down protection | 1 µA max leakage at VCC = 0 - eliminates risk of damaging current flow from live buses into unpowered sections. |
| 5-V-tolerant I/Os | VI/O rated to 5.5 V regardless of VCC state - enables direct connection to legacy 5 V peripherals without external clamping. |
| Low OFF-state capacitance | 3.5 pF typical Cio(OFF) - limits bus loading and crosstalk in high-density routing, especially critical for DDR and PCIe trace layouts. |
| Charge-pump gate drive | Elevates pass-gate voltage above VCC - ensures flat ron vs. VI curve and eliminates body-diode conduction in bidirectional mode. |
Applications
| PCI Interface | Differential Signal Interface |
|---|---|
Use Scenario: Isolating PCI bus segments during hot-plug insertion or power sequencing. IC Role / Device Role / Timing Role: Bidirectional bus switch enabling/disabling 8-bit data lanes under OE control with sub-ns timing. Use Value: Prevents signal contention and ground bounce during reconfiguration while maintaining full 33 MHz PCI timing margins. | Use Scenario: Routing LVDS or RSDS clock/data pairs through shared backplane traces with selectable termination. IC Role / Device Role / Timing Role: Low-capacitance, low-distortion analog switch preserving differential signal symmetry and edge rate. Use Value: Maintains <0.2 ns skew between complementary paths and avoids added jitter from nonlinear ON-resistance. |
| Memory Interleaving | Bus Isolation |
Use Scenario: Dynamically connecting alternate DRAM banks to a shared controller in multi-channel memory systems. IC Role / Device Role / Timing Role: High-bandwidth 8-bit switch enabling bank-select routing with minimal propagation delay. Use Value: Enables cycle-accurate bank switching without adding setup/hold timing penalties to memory access windows. | Use Scenario: Electrically isolating processor debug interfaces (e.g., JTAG, SWD) from main system power domains. IC Role / Device Role / Timing Role: OE-controlled high-impedance barrier preventing leakage and noise coupling during debug sessions. Use Value: Eliminates need for discrete MOSFETs or relays while supporting fast, repeatable isolation with guaranteed Ioff compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FET bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDTQS3VH384 | Same functional behavior and pinout; identical ron (4 Ω), Cio(OFF) (3.5 pF), and VCC range (2.3–3.6 V); manufactured by IDT (now Renesas). | Legacy availability and longer lead times; same 20-pin SSOP/QFN footprint but different top-side marking and MSL rating. | Select IDTQS3VH384 only if existing design uses that part number and qualification documentation requires continuity. |
| SN74CBTLV3245PWR | Lower VCC range (2.3–3.6 V same), but higher ron (6 Ω typ), higher Cio(OFF) (5 pF), and no charge pump - results in voltage-dependent ron and reduced bandwidth. | Suitable for cost-sensitive, lower-speed (<200 MHz) applications where rail-to-rail switching is not required. | Choose SN74CBTLV3245PWR only when budget constraints outweigh performance needs and 5-V tolerance is not mandatory. |
Compared with IDTQS3VH384, SN74CB3Q3245 offers identical electrical performance and TI's extended lifecycle support; versus SN74CBTLV3245PWR, it delivers superior bandwidth, flatter ron, and true 0–5 V signal handling - making it the preferred choice for high-fidelity, mixed-voltage interconnects.
Availability
SN74CB3Q3245RGYR is available at Aetrix Electronics and suitable for PCI interface design, memory subsystem routing, and bus isolation applications requiring stable component supply, long-term manufacturability, and RoHS-compliant packaging.
Supply support for SN74CB3Q3245RGYR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in high-reliability silicon solutions.
The SN74CB3Q3245 belongs to TI's CB3Q family of high-bandwidth FET bus switches, engineered specifically for low-distortion, rail-to-rail signal routing in broadband communications, networking infrastructure, and data-intensive computing platforms.
FAQ
What is the maximum operating frequency supported by the SN74CB3Q3245?
The SN74CB3Q3245 supports up to 500 MHz bandwidth in its data path due to low 4 Ω ON-state resistance and 3.5 pF OFF-state capacitance. Its OE control input operates up to 20 MHz, enabling rapid bus enable/disable cycles. These values are measured under recommended conditions (VCC = 3.3 V, TA = 25°C) and reflect actual signal integrity performance - not theoretical limits.
Does the SN74CB3Q3245 require external level shifters when interfacing 1.8 V and 5 V systems?
No, the SN74CB3Q3245 does not require external level shifters. Its 0–5.5 V data I/O voltage range and 5-V-tolerant inputs allow direct connection between 1.2 V, 1.8 V, 2.5 V, 3.3 V, and 5 V logic domains while powered from 2.5 V or 3.3 V. This capability is inherent to its FET architecture and charge-pump design - confirmed in the absolute maximum ratings and recommended operating conditions tables.
How does the Ioff feature protect circuits during partial power-down?
The Ioff feature in the SN74CB3Q3245 limits current flow to ≤1 µA when VCC = 0 V and any I/O is biased between 0–5.5 V. This prevents damaging back-current from live buses into unpowered sections - a critical requirement for hot-swap, modular systems, and power-gated SoC domains. The specification is validated per JESD78 Class II latch-up testing and applies regardless of OE state.
What is the purpose of the exposed thermal pad (Pin 21) on the RGY package of the SN74CB3Q3245?
The exposed thermal pad (Pin 21) on the SN74CB3Q3245RGYR's VQFN package must be soldered to a PCB copper pour for thermal dissipation and mechanical stability. It is electrically connected to GND internally and improves thermal resistance (θJA = 37°C/W) - essential for maintaining junction temperature within safe limits during sustained 64 mA per channel operation. Layout guidelines specify minimum solder coverage (78%) and optional thermal vias.
Can the SN74CB3Q3245 be used for analog signal switching, such as audio or clock distribution?
Yes, the SN74CB3Q3245 is qualified for analog signal switching including clock distribution and low-frequency audio paths. Its rail-to-rail operation, flat 4 Ω ron, low 3.5 pF OFF-capacitance, and absence of body-diode conduction (enabled by charge pump) preserve signal linearity and edge integrity. TI explicitly lists "support for both digital and analog applications" in the device description, and characterization data confirms consistent performance across 0–5 V input ranges.
SN74CB3Q3245RGYR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CB
- Package/Case:
- 20-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Bus Switch
- Circuit:
- 8 x 1:1
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-VQFN (3.5x4.5)
SN74CB3Q3245RGYR FAQ
1.How can I place an order for SN74CB3Q3245RGYR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CB3Q3245RGYR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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6.How does Aetrix verify that SN74CB3Q3245RGYR is sourced from the original manufacturer or authorized distributors?
All SN74CB3Q3245RGYR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CB3Q3245RGYR meets industry standards.
7.What is the process for return or replacement of SN74CB3Q3245RGYR?
All SN74CB3Q3245RGYR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CB3Q3245RGYR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CB3Q3245RGYR part is unused and in its original packaging.
Return procedure for SN74CB3Q3245RGYR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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