My Inquiry
My Account
Texas Instruments SN74CB3Q3253DGVR
- Part No.:
- SN74CB3Q3253DGVR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 16-TFSOP (0.173", 4.40mm Width)
- Datasheet:
-
SN74CB3Q3253DGVR.pdf
- Description:
- IC MUX/DEMUX 2 X 4:1 16TVSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,621
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SN74CB3Q3253DGVR from Texas Instruments is a dual 1-of-4 FET bus switch optimized for high-bandwidth signal routing in 2.5-V to 3.3-V systems. It provides bidirectional rail-to-rail switching (0–5 V with 3.3-V VCC), 4 Ω typical ON-state resistance, <0.18 ns propagation delay, and 500 MHz bandwidth-enabling low-distortion USB interface and video broadcast signal gating.
For engineers reviewing the SN74CB3Q3253DGVR datasheet, SN74CB3Q3253DGVR pinout, SN74CB3Q3253DGVR application, or SN74CB3Q3253DGVR equivalent, key selection criteria include its 5-V tolerant I/Os during power-up/down, Ioff-enabled partial-power-down operation, and TVSOP-16 package compatibility with high-density PCB layouts.
Technical Context
The SN74CB3Q3253DGVR integrates two independent 1-of-4 multiplexer/demultiplexer channels, each controlled by active-low OE (1OE/2OE) and 2-bit binary select (S0/S1). Its charge-pump gate drive ensures flat ron across voltage and temperature, enabling consistent signal integrity up to 500 MHz.
Each channel supports bidirectional data flow with near-zero propagation delay, 3.5 pF typical OFF-state I/O capacitance, and undershoot clamp diodes on all control inputs. The device operates from 2.3 V to 3.6 V and maintains 5-V tolerance on I/O ports regardless of VCC state.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.3 V to 3.6 V - Enables interoperability with 2.5-V and 3.3-V logic domains without level shifters. |
| ron (Typical) | 4 Ω at VCC = 2.5 V - Minimizes insertion loss and voltage drop in high-speed analog/digital signal paths. |
| Bandwidth | Up to 500 MHz - Supports HDMI, USB 2.0, and high-definition video signal routing without attenuation. |
| Cio(OFF) | 3.5 pF (B port) - Reduces capacitive loading on source/sink nodes to preserve signal edge rate and timing margin. |
| Ioff | 1 µA at VCC = 0 - Prevents backflow current during system power sequencing, enabling safe hot-swap operation. |
| Propagation Delay | 0.12–0.18 ns - Enables sub-nanosecond timing alignment critical for parallel bus and clock distribution applications. |
| ESD Rating | 2000-V HBM - Meets industrial-grade robustness requirements without external protection circuitry. |
Pinout & Package
SN74CB3Q3253DGVR uses a 16-pin TVSOP (DGV) package measuring 3.60 mm × 4.40 mm with exposed thermal pad, optimized for automated assembly and thermal dissipation in space-constrained designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1OE, 2OE | Active-low output enable | Individually disables Channel 1 or Channel 2; high-impedance state isolates A/B ports when asserted high. |
| S0, S1 | Binary channel select | Configures 1-of-4 path selection per channel (L/L → B1, L/H → B2, H/L → B3, H/H → B4). |
| 1A, 2A | Common input/output port | Bidirectional hub connecting to system bus or controller; supports rail-to-rail voltage translation. |
| 1B1–1B4, 2B1–2B4 | Channel I/O terminals | Four selectable bidirectional paths per channel; 5-V tolerant with no external clamping required. |
| VCC | Power supply | Supplies internal charge pump and logic; powers I/O buffers while maintaining 5-V I/O tolerance. |
| GND | Ground reference | Return path for all internal circuits and I/O current; must be low-impedance for signal integrity. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail switching | Supports 0–5 V signals with 3.3-V VCC or 0–3.3 V with 2.5-V VCC, eliminating need for external level translators. |
| 5-V tolerant I/Os | Operates safely with 5-V signals applied to any I/O pin regardless of VCC state (powered up/down), simplifying mixed-voltage system design. |
| Charge-pump gate drive | Elevates pass-transistor gate voltage to ensure flat ron over full operating range, preserving signal fidelity across temperature and voltage. |
| Low OFF-state capacitance | 3.5 pF (B port) minimizes crosstalk and loading on adjacent traces, critical for high-frequency bus isolation. |
| Ioff partial-power-down | Prevents damaging current flow between powered and unpowered system domains during power sequencing or hot-swap events. |
Applications
| USB 2.0 Signal Routing | Video Broadcast Multiplexing |
|---|---|
Use Scenario: Selecting between two USB host controllers sharing a single downstream port in embedded test equipment. IC Role / Device Role / Timing Role: Dual-channel bidirectional bus switch enabling dynamic reconfiguration of D+/D− lines without signal degradation. Use Value: Maintains USB 2.0 eye diagram integrity at 480 Mbps due to 500 MHz bandwidth and 3.5 pF Cio(OFF). |
Use Scenario: Multiplexing SDI or HDMI video streams from multiple encoders to a single IP-based transcoder in broadcast infrastructure. IC Role / Device Role / Timing Role: High-fidelity analog/digital signal gate supporting rail-to-rail 0–3.3 V video data with sub-0.2 ns propagation delay. Use Value: Preserves video timing skew and reduces jitter accumulation across multiple switching stages in multi-format workflows. |
| Differential Bus Isolation | Low-Distortion Test Signal Gating |
Use Scenario: Isolating differential clock or data buses during functional testing of FPGA-based communication subsystems. IC Role / Device Role / Timing Role: Bidirectional 1-of-4 MUX/DEMUX providing channel-selectable break-before-make switching with minimal added capacitance. Use Value: Eliminates ground-loop interference and prevents signal reflection via 4 Ω ron and matched trace impedance preservation. |
Use Scenario: Gating precision analog test signals (e.g., DAC outputs) in automated test equipment without introducing harmonic distortion. IC Role / Device Role / Timing Role: Low-ron, low-Cio analog switch enabling clean signal injection into DUTs with minimal amplitude error. Use Value: Delivers <−70 dB THD performance due to flat ron and absence of body-diode conduction in bidirectional mode. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FET bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBT3253PWR | Higher ron (7 Ω typical), no charge pump, 3.3-V only operation, TSSOP-16 package. | Lacks 5-V I/O tolerance and rail-to-rail capability; unsuitable for mixed-voltage or hot-swap scenarios. | Choose for cost-sensitive 3.3-V-only systems where 500 MHz bandwidth is not required. |
| TS3DS10224RGTR | Single 1-of-4 switch, 3.5 Ω ron, 3.3-V operation, VQFN-16, no Ioff support. | Not dual-channel; lacks partial-power-down protection and 5-V tolerance on I/O pins. | Use when only one multiplexer channel is needed and board space permits VQFN packaging. |
Compared with SN74CB3Q3253DGVR, SN74CBT3253PWR trades bandwidth and voltage flexibility for lower cost, while TS3DS10224RGTR offers comparable ron in a smaller footprint but sacrifices dual-channel integration and Ioff safety.
Availability
SN74CB3Q3253DGVR is available at Aetrix Electronics and suitable for USB interface design, video broadcast multiplexing, and differential bus isolation requiring stable component supply across industrial and broadcast equipment lifecycles.
Supply support for SN74CB3Q3253DGVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of expertise in high-speed signal integrity and interface solutions.
The SN74CB3Q3253DGVR belongs to TI's CB3Q family of high-bandwidth FET bus switches, designed specifically for low-distortion, rail-to-rail signal routing in broadband communications, networking, and video infrastructure systems.
FAQ
What is the maximum signal frequency supported by the SN74CB3Q3253DGVR?
The SN74CB3Q3253DGVR supports up to 500 MHz bandwidth, verified under load conditions with 30 pF capacitance and 50 Ω source impedance. This enables reliable operation in USB 2.0, HDMI, and high-definition video signal paths without measurable attenuation or phase distortion. The SN74CB3Q3253DGVR achieves this via low 4 Ω ron and 3.5 pF Cio(OFF), minimizing RC time constants that limit high-frequency response.
Does the SN74CB3Q3253DGVR support 5-V signals when powered from 2.5 V?
Yes, the SN74CB3Q3253DGVR supports 0–5 V signals on all I/O pins (A and B ports) regardless of VCC voltage (2.3–3.6 V), including during power-down. This 5-V tolerance is achieved through internal clamping and process design-not external components-making the SN74CB3Q3253DGVR ideal for mixed-voltage systems like legacy peripheral interfacing or hot-plug expansion slots.
How does the charge pump in the SN74CB3Q3253DGVR improve performance?
The integrated charge pump elevates the gate voltage of the internal FET pass transistors, ensuring flat ON-state resistance (ron) across the full 0–5 V I/O swing and operating temperature range. This eliminates ron variation-induced signal distortion and preserves timing margins-critical for the SN74CB3Q3253DGVR's role in high-fidelity video and USB 2.0 applications where signal integrity is non-negotiable.
Can the SN74CB3Q3253DGVR be used in partial-power-down mode?
Yes, the SN74CB3Q3253DGVR features Ioff circuitry that limits leakage to 1 µA when VCC = 0 V, preventing damaging back-current flow between powered and unpowered system domains. This allows safe use in hot-swap modules, modular test equipment, and power-gated subsystems-key reliability advantages built into the SN74CB3Q3253DGVR's architecture.
What is the thermal performance of the SN74CB3Q3253DGVR in TVSOP package?
In its TVSOP-16 (DGV) package, the SN74CB3Q3253DGVR has a junction-to-board thermal resistance (RθJB) of 57.8 °C/W and junction-to-ambient (RθJA) of 126 °C/W. With proper PCB copper pour under the thermal pad, it sustains continuous operation at 85°C ambient while delivering 64 mA per channel-validated in TI's SCDS145C datasheet under recommended operating conditions for the SN74CB3Q3253DGVR.
SN74CB3Q3253DGVR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CB
- Package/Case:
- 16-TFSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Multiplexer/Demultiplexer
- Circuit:
- 2 x 4:1
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-TVSOP
SN74CB3Q3253DGVR FAQ
1.How can I place an order for SN74CB3Q3253DGVR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CB3Q3253DGVR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74CB3Q3253DGVR reliable?
The price and inventory of SN74CB3Q3253DGVR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CB3Q3253DGVR is usually 5 days.
3.What payment methods are accepted for SN74CB3Q3253DGVR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74CB3Q3253DGVR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SN74CB3Q3253DGVR?
SN74CB3Q3253DGVR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74CB3Q3253DGVR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74CB3Q3253DGVR?
For technical support, including SN74CB3Q3253DGVR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CB3Q3253DGVR requirements.
6.How does Aetrix verify that SN74CB3Q3253DGVR is sourced from the original manufacturer or authorized distributors?
All SN74CB3Q3253DGVR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CB3Q3253DGVR meets industry standards.
7.What is the process for return or replacement of SN74CB3Q3253DGVR?
All SN74CB3Q3253DGVR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CB3Q3253DGVR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CB3Q3253DGVR part is unused and in its original packaging.
Return procedure for SN74CB3Q3253DGVR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SN74CB3Q3253DGVR Tags
-
SN74HC138DR
Texas Instruments
-
TC7SB3157CFU,LF(CT
Toshiba Semiconductor and Storage
-
74CBTLV3257PW,118
Nexperia USA Inc.
-
SN74CBTLV3257PWR
Texas Instruments
-
74CBTLV3257GUX
Nexperia USA Inc.
-
74HC154BQ,118
Nexperia USA Inc.
-
P3S0200GMX
NXP USA Inc.
-
SN74CB3Q3245PWR
Texas Instruments
-
SN74CB3Q3257RGYR
Texas Instruments
-
TCA9543APWR
Texas Instruments
-
TCA9546APWR
Texas Instruments
-
SN74HC138N
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
