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Texas Instruments SN74CB3Q3306APW
- Part No.:
- SN74CB3Q3306APW
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 8-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
SN74CB3Q3306APW.pdf
- Description:
- IC BUS SWITCH 1 X 1:1 8TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,893
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Product details
Overview
SN74CB3Q3306APW from Texas Instruments is a dual 1-bit FET bus switch IC designed for high-bandwidth signal routing in low-voltage digital systems. It features rail-to-rail 0–5 V switching capability with 2.5 V/3.3 V supply operation, 4 Ω typical ON-state resistance, <0.2 ns propagation delay, and 5-V-tolerant I/Os-enabling use in USB interface isolation and differential signal gating applications.
For engineers reviewing the SN74CB3Q3306APW datasheet, SN74CB3Q3306APW pinout, SN74CB3Q3306APW application, or SN74CB3Q3306APW equivalent, key selection considerations include its bidirectional 1-bit dual-switch architecture, partial-power-down Ioff support, low 3.5 pF OFF-state I/O capacitance, and TSSOP-8 package compatibility with high-speed PCB layout requirements.
Technical Context
The SN74CB3Q3306APW implements two independent FET-based analog/digital bus switches, each controlled by dedicated OE inputs (1OE, 2OE), enabling selective isolation of A↔B data paths. Its internal charge pump elevates gate voltage to maintain flat, low ron across input voltages from 0 V to 5 V.
Each switch supports bidirectional signal flow with near-zero propagation delay and rail-to-rail voltage translation-e.g., 0–3.3 V signaling with 2.5 V VCC or 0–5 V with 3.3 V VCC. The device meets JESD 78 Class II latch-up immunity (>100 mA) and JESD 22 ESD ratings (2000-V HBM, 1000-V CDM).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.3 V to 3.6 V - enables interoperability with 2.5 V and 3.3 V logic domains without level shifters |
| ron (Typ) | 4 Ω at VCC = 3.3 V - minimizes voltage drop and signal distortion under 30 mA load |
| Cio(OFF) | 3.5 pF typical - reduces capacitive loading on high-speed buses like USB 2.0 or PCIe Gen1 |
| Propagation Delay | <0.2 ns - supports >500 MHz bandwidth signal paths with negligible timing skew |
| Ioff | 1 mA max at VCC = 0 V - prevents backflow current during partial power-down, protecting upstream drivers |
| Switching Frequency | 20 MHz max (fOE) - ensures reliable enable/disable control in burst-mode or gated-clock applications |
| ESD Rating | 2000-V HBM, 1000-V CDM - meets industrial-grade robustness requirements without external protection |
Pinout & Package
TSSOP-8 (PW) package: 3.0 mm × 4.4 mm body, 0.65 mm lead pitch, 1.2 mm max height, exposed pad not present, RoHS-compliant NiPdAu or Sn finish, MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | 1OE | Active-low enable for first 1-bit switch - drives A1↔B1 path when low; high-impedance when high |
| 2 | 1A | Data input/output port A of first switch - bidirectional, 5-V tolerant, low-capacitance node |
| 3 | 1B | Data input/output port B of first switch - electrically identical to 1A, forms isolated signal pair |
| 4 | GND | Power ground reference - must be low-inductance connection to minimize noise coupling into analog paths |
| 5 | VCC | Supply voltage (2.3–3.6 V) - powers internal charge pump and logic; bypass capacitor required |
| 6 | 2OE | Active-low enable for second 1-bit switch - independent control allows staggered or synchronized gating |
| 7 | 2A | Data input/output port A of second switch - supports separate signal domain from first switch |
| 8 | 2B | Data input/output port B of second switch - completes dual-channel isolation capability |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail 0–5 V switching | Operates with 2.5 V or 3.3 V VCC while passing full 0–5 V signals - eliminates need for external level translators |
| Charge-pump-enhanced ron | Maintains flat 4–8 Ω ON-resistance across VI/O range - ensures consistent signal integrity regardless of logic level |
| 5-V-tolerant I/Os | Withstands 0–7 V on data pins even when powered down - enables hot-swap and mixed-voltage system integration |
| Low I/O capacitance | 3.5 pF OFF-state capacitance - preserves signal rise/fall times in >200 Mbps digital interfaces |
| Partial-power-down support | Ioff limits reverse current to ≤1 mA when VCC = 0 - protects powered sections during firmware-controlled sleep modes |
Applications
| USB Interface Isolation | Differential Signal Gating |
|---|---|
Use Scenario: Isolating USB D+ and D− lines between host controller and peripheral during suspend/resume cycles. IC Role / Device Role / Timing Role: Dual 1-bit switch configured as two independent bidirectional gates, each handling one USB data line with sub-0.2 ns delay. Use Value: Prevents leakage current and signal corruption during low-power states while maintaining full-speed USB 2.0 timing compliance. | Use Scenario: Enabling/disabling LVDS or RSDS differential pairs in display timing controllers or FPGA I/O banks. IC Role / Device Role / Timing Role: Low-capacitance, rail-to-rail analog switch providing matched path delay for both P/N legs of differential signals. Use Value: Preserves common-mode rejection and differential skew below 10 ps, critical for 800+ Mbps serial links. |
| Bus Isolation in Mixed-Voltage Systems | Low-Distortion Signal Routing |
Use Scenario: Separating 3.3 V microcontroller GPIOs from 5 V sensor subsystems in industrial PLC modules. IC Role / Device Role / Timing Role: Voltage-agnostic bidirectional switch allowing safe 0–5 V signal transfer without level-shifting circuitry. Use Value: Reduces BOM count and board area versus discrete MOSFET + resistor solutions while supporting 20 MHz toggle rates. | Use Scenario: Routing audio clock or SPDIF signals through FPGA-based media processors with dynamic source selection. IC Role / Device Role / Timing Role: Low-distortion analog switch with 4 Ω ron and 3.5 pF Cio(OFF) minimizing jitter accumulation and amplitude droop. Use Value: Maintains <100 fs RMS jitter contribution and <0.1 dB insertion loss up to 100 MHz - meeting AES3 and I²S timing budgets. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FET bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CB3Q3306APWR | Tape-and-reel variant of same TSSOP-8 device; identical electrical specs and pinout | No functional difference - optimized for automated SMT assembly vs. tube packaging | Select SN74CB3Q3306APWR for volume production; SN74CB3Q3306APW is obsolete but may be available in legacy stock |
| SN74CB3Q3306ADCUR | VSSOP-8 (DCU) package: 2.3 mm × 2.0 mm, 0.5 mm pitch - 45% smaller footprint than TSSOP-8 | Higher density routing possible; thermal resistance 88°C/W vs. 70°C/W for PW - requires careful thermal design at >20 mA per switch | Choose SN74CB3Q3306ADCUR for space-constrained designs; verify PCB land pattern per DCU0008A outline |
Compared with SN74CB3Q3306APWR, the SN74CB3Q3306APW offers identical performance but limited availability; versus SN74CB3Q3306ADCUR, it trades compactness for easier hand-soldering and higher thermal margin - making it preferable for prototyping and thermally demanding 2-layer boards.
Availability
SN74CB3Q3306APW is available at Aetrix Electronics and suitable for USB interface isolation, differential signal gating, and bus isolation applications requiring stable component supply across industrial temperature ranges (–40°C to +85°C).
Supply support for SN74CB3Q3306APW includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in high-reliability electronic components.
The SN74CB3Q3306APW belongs to TI's CB3Q family of high-bandwidth FET bus switches, engineered specifically for low-distortion, rail-to-rail signal routing in broadband communications, networking infrastructure, and data-intensive computing systems.
FAQ
What is the maximum signal frequency supported by the SN74CB3Q3306APW?
The SN74CB3Q3306APW supports signal bandwidth up to 500 MHz, validated by its <0.2 ns propagation delay and 3.5 pF OFF-state I/O capacitance. This enables reliable operation in USB 2.0 (480 Mbps), DDR1 memory buses, and other high-speed digital interfaces where minimal signal degradation is critical. Performance remains consistent across 0–5 V signal swings with 2.5 V or 3.3 V supply.
Does the SN74CB3Q3306APW require external pull-up resistors on OE pins?
Yes - to ensure high-impedance state during power-up or power-down, OE pins (1OE, 2OE) should be tied to VCC via pull-up resistors. The minimum value depends on the driving source's current-sinking capability; TI recommends ≥10 kΩ for standard CMOS drivers. Leaving OE floating risks undefined switch states and potential bus contention.
Can the SN74CB3Q3306APW operate with a 2.5 V supply while switching 5 V signals?
Yes - the SN74CB3Q3306APW supports 0–5 V rail-to-rail switching with VCC = 2.5 V, as confirmed in the Recommended Operating Conditions table. Its charge-pump architecture maintains low, flat ON-resistance (5–9 Ω typical) across this configuration, enabling direct interfacing between 2.5 V logic and 5 V peripherals without external level shifters.
Is the SN74CB3Q3306APW compatible with hot-swap or live-insertion systems?
Yes - the SN74CB3Q3306APW features 5-V-tolerant I/Os and Ioff protection, allowing safe operation when VCC = 0 V and data pins are driven externally. With ≤1 mA reverse current under these conditions, it prevents damage to powered circuitry during hot-plug events in modular backplane or docking station designs.
What is the thermal resistance (θJA) of the SN74CB3Q3306APW in its TSSOP-8 package?
The SN74CB3Q3306APW in TSSOP-8 (PW) package has a junction-to-ambient thermal resistance (θJA) of 88°C/W, per TI's SCDS113E datasheet. This value assumes standard JEDEC 2-layer board conditions; actual thermal performance improves with copper pour, thermal vias, and proper PCB layout - critical when operating near maximum 64 mA per switch current rating.
SN74CB3Q3306APW Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CB
- Package/Case:
- 8-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Type:
- Bus Switch
- Circuit:
- 1 x 1:1
- Independent Circuits:
- 2
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-TSSOP
SN74CB3Q3306APW FAQ
1.How can I place an order for SN74CB3Q3306APW through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CB3Q3306APW on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74CB3Q3306APW reliable?
The price and inventory of SN74CB3Q3306APW are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CB3Q3306APW is usually 5 days.
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SN74CB3Q3306APW orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74CB3Q3306APW order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74CB3Q3306APW?
For technical support, including SN74CB3Q3306APW datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CB3Q3306APW requirements.
6.How does Aetrix verify that SN74CB3Q3306APW is sourced from the original manufacturer or authorized distributors?
All SN74CB3Q3306APW products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CB3Q3306APW meets industry standards.
7.What is the process for return or replacement of SN74CB3Q3306APW?
All SN74CB3Q3306APW units undergo pre-shipment inspection (PSI). If there is an issue with SN74CB3Q3306APW, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CB3Q3306APW part is unused and in its original packaging.
Return procedure for SN74CB3Q3306APW:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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