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Texas Instruments SN74CB3T16210DGG
- Part No.:
- SN74CB3T16210DGG
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- -
- Datasheet:
-
SN74CB3T16210DGG.pdf
- Description:
- SN74CB3T16210 20-BIT FET BUS SWI
- Quantity:
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Inventory:8,440
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Product details
Overview
SN74CB3T16210DGG from Texas Instruments is a 20-bit FET bus switch IC with dual 10-bit configurable switching, 5-V-tolerant I/Os, 5 Ω typical ON-state resistance, and mixed-mode level translation supporting 2.5 V/3.3 V VCC with 0–5 V signaling on all data ports. It enables bidirectional isolation in PCI, USB, and memory-interleaved bus architectures.
For engineers reviewing the SN74CB3T16210DGG datasheet, SN74CB3T16210DGG pinout, SN74CB3T16210DGG application, or SN74CB3T16210DGG equivalent, key selection criteria include its 2.3–3.6 V supply range, near-zero propagation delay (0.15 ns), Ioff partial-power-down support, 5 pF OFF-state capacitance, and TSSOP-48 package compatibility with high-density PCB layouts.
Technical Context
The SN74CB3T16210DGG implements two independent 10-bit FET-based bus switches controlled by separate OE inputs (1OE, 2OE), enabling flexible partitioning as either two 10-bit or one 20-bit switch. Its voltage-tracking output translation ensures VOH ≈ VCC across 2.5 V and 3.3 V operation while maintaining 5-V tolerance on all I/Os regardless of power state.
Each switch channel uses low-threshold FETs with ron = 5 Ω typical, delivering sub-nanosecond propagation delay and minimal RC loading (Cio(OFF) = 5 pF). The device supports undervoltage clamp diodes, JESD 17 latch-up immunity (>250 mA), and operates from –40°C to 85°C with ICC ≤ 40 μA max.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.3 V to 3.6 V - Enables interoperability across 2.5 V and 3.3 V system domains without external level shifters. |
| ron (Typ) | 5 Ω - Minimizes voltage drop and signal distortion during high-speed bidirectional data transfer. |
| Cio(OFF) (Typ) | 5 pF - Reduces capacitive loading on upstream drivers and improves signal integrity in high-frequency buses. |
| tpd (Max) | 0.25 ns at VCC = 2.5 V - Supports >1 GHz effective switching rates with negligible timing skew. |
| Ioff Support | Yes - Prevents backflow current during partial power-down, protecting powered-down subsystems in hot-swap applications. |
| 5-V Tolerance | On all I/Os, powered up or down - Allows safe interfacing with legacy 5-V peripherals without external protection circuitry. |
| Operating Temp | –40°C to +85°C - Qualified for industrial and extended-temperature embedded systems deployment. |
Pinout & Package
TSSOP-48 (DGG) package: 12.6 mm × 6.1 mm × 1.2 mm body, 0.5 mm pitch, lead-free NIPDAU finish, MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A1–1A10, 2A1–2A10 | Input/Output Port A (Group 1 & 2) | Bidirectional data terminals for first and second 10-bit switch banks; 5-V tolerant, support mixed-voltage signaling. |
| 1B1–1B10, 2B1–2B10 | Input/Output Port B (Group 1 & 2) | Corresponding bidirectional data terminals mirroring Port A; electrically isolated when OE is high. |
| 1OE, 2OE | Active-Low Enable Inputs | Individually control ON/OFF state of each 10-bit switch bank; require pull-up to VCC for power-up high-impedance safety. |
| VCC | Supply Voltage Input | Single 2.3–3.6 V rail powering internal logic and FET gate drive; defines output voltage translation reference. |
| GND (Pins 7, 16, 25, 36) | Ground Reference | Four dedicated ground pins minimize ground bounce and ensure stable return paths for all 20 channels. |
| NC (Pins 1, 48) | No Internal Connection | Unbonded pads; must remain unconnected per TI design - no routing or thermal relief required. |
Key Features
| Feature | Design Value |
|---|---|
| Mixed-mode level translation | Supports simultaneous 5-V, 3.3-V, and 2.5-V signaling on same bus via VCC-tracked VOH - eliminates discrete translators in multi-voltage systems. |
| Bidirectional zero-delay switching | Sub-0.25 ns tpd enables transparent pass-through for DDR, PCIe, and USB 2.0 clock/data pairs without added latency or skew. |
| Ioff partial-power-down protection | Blocks reverse current flow when VCC = 0 V - critical for hot-plug expansion slots and modular backplane designs. |
| 5-V-tolerant I/Os | Withstands 5.5 V input regardless of VCC state - simplifies interface to legacy controllers and reduces BOM count in mixed-supply boards. |
| Low capacitive loading | 5 pF Cio(OFF) minimizes signal reflection and crosstalk in dense 20-bit parallel buses operating above 100 MHz. |
Applications
| PCI Express Slot Interface | USB 2.0 Hub Isolation |
|---|---|
Use Scenario: Isolating host controller from add-in cards in embedded PC/104+ systems with mixed 3.3 V and 5 V signaling requirements. IC Role / Device Role / Timing Role: Dual 10-bit bidirectional bus switch providing hot-plug-safe isolation between PCIe root complex and endpoint devices. Use Value: Eliminates need for discrete level shifters and enables seamless 5-V legacy card support under 3.3-V host domain using single VCC rail. | Use Scenario: Enabling dynamic USB device enumeration and power management in industrial docking stations with multiple downstream ports. IC Role / Device Role / Timing Role: 20-bit reconfigurable switch isolating upstream PHY from downstream port clusters during suspend/resume cycles. Use Value: Ioff prevents backfeed into powered-down USB transceivers, meeting USB 2.0 suspend current <500 µA requirement without auxiliary circuitry. |
| Memory Interleaving Controller | Industrial Fieldbus Bridge |
Use Scenario: Arbitrating access between dual SDRAM banks in real-time motion control systems requiring deterministic memory latency. IC Role / Device Role / Timing Role: Low-latency 20-bit data path switch enabling time-multiplexed access to interleaved memory modules. Use Value: 0.25 ns tpd preserves setup/hold timing margins at 133 MHz bus speeds, avoiding pipeline stalls in hard real-time firmware. | Use Scenario: Bridging Modbus RTU (5 V) and CAN FD (3.3 V) networks in programmable logic controller I/O modules. IC Role / Device Role / Timing Role: Voltage-translating bus switch isolating field-side 5-V RS-485 transceivers from 3.3-V microcontroller domain. Use Value: 5-V-tolerant I/Os and 2.5 V/3.3 V VCC compatibility allow direct connection to both bus standards without external resistive dividers or translators. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FET bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBTLV3245APWR | 8-bit, 3.3-V only, no 5-V tolerance, ron = 4 Ω typical, Cio(OFF) = 4 pF | Limited to single-voltage 3.3-V systems; lacks mixed-mode translation and Ioff | Select when only 3.3-V isolation is needed and board space permits multiple packages for 20-bit coverage. |
| SN74AVC16T245DGGR | 16-bit, dual-supply (VCCA/VCCB), 1.2–3.6 V, direction-controlled, not bidirectional by default | Requires external direction control logic; supports asymmetric voltage translation but adds complexity | Choose for asymmetric voltage bridging (e.g., 1.8 V ↔ 3.3 V) where independent supply rails are available and directionality is managed externally. |
Compared with SN74CB3T16210DGG, SN74CBTLV3245APWR offers lower ron but lacks 5-V tolerance and Ioff, limiting use in hot-swap or mixed-voltage environments; SN74AVC16T245DGGR provides flexible dual-rail translation but requires additional control signals and cannot match the SN74CB3T16210DGG's true bidirectional zero-delay operation across 20 bits.
Availability
SN74CB3T16210DGG is available at Aetrix Electronics and suitable for PCI Express slot interfaces, USB 2.0 hub isolation, and memory interleaving controllers requiring stable component supply, long-term industrial lifecycle support, and RoHS-compliant TSSOP packaging.
Supply support for SN74CB3T16210DGG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in industrial, automotive, and communications markets.
The SN74CB3T16210DGG belongs to TI's Widebus™ family of high-speed bus switches, engineered specifically for low-latency, mixed-voltage signal routing in computing, storage, and industrial control infrastructure.
FAQ
What is the maximum data rate supported by the SN74CB3T16210DGG?
The SN74CB3T16210DGG does not specify a maximum data rate in Mbps/Gbps, but its 0.25 ns maximum propagation delay (tpd) and 5 pF OFF-state capacitance enable reliable operation with NRZ signals up to ~1.5 Gbps in well-terminated 50-Ω environments. Actual achievable rate depends on PCB layout, driver strength, and load capacitance - verified in USB 2.0 (480 Mbps) and PCI-X (1066 Mbps) reference designs using SN74CB3T16210DGG.
Does the SN74CB3T16210DGG require external pull-up resistors on OE pins?
Yes, TI recommends tying 1OE and 2OE to VCC through pull-up resistors to ensure high-impedance state during power-up and power-down sequences. The minimum resistor value depends on the driving source's current-sinking capability; typical values range from 4.7 kΩ to 10 kΩ. This prevents undefined switch states that could cause bus contention or excessive current draw before firmware initializes the control lines.
Can the SN74CB3T16210DGG be used for level shifting between 1.8 V and 3.3 V domains?
No - the SN74CB3T16210DGG is specified only for VCC = 2.3 V to 3.6 V and supports input signaling levels from 0 V to 5.5 V, but its output voltage translation tracks VCC. To translate 1.8 V logic to 3.3 V, VCC must be set to 3.3 V, and the 1.8 V input must meet VIH/VIL thresholds for 3.3 V CMOS (VIH ≥ 2.0 V). Since 1.8 V falls below that threshold, it cannot reliably drive the SN74CB3T16210DGG as a 1.8 V → 3.3 V translator without external conditioning.
Is the SN74CB3T16210DGG pin-compatible with the SN74CB3T16210DGVR?
Yes - both SN74CB3T16210DGG (TSSOP-48) and SN74CB3T16210DGVR (TVSOP-48) share identical pinout, electrical specifications, and functional behavior. The only difference is package footprint: DGG has 6.1 mm width and 1.2 mm max height; DGVR is narrower (4.4 mm) and slightly taller (1.2 mm), requiring separate PCB land patterns. No logic or timing changes are needed when substituting between them.
What is the thermal performance of the SN74CB3T16210DGG in continuous operation?
The SN74CB3T16210DGG has a junction-to-ambient thermal resistance (θJA) of 70°C/W in the TSSOP-48 (DGG) package. At maximum rated ICC = 40 μA and worst-case ambient temperature (85°C), self-heating is negligible (<0.003°C). Even under full 20-bit switching with 128 mA per channel (per absolute max rating), localized heating remains within safe limits due to low ron and distributed power dissipation - validated in TI's thermal simulation reports for industrial derating curves.
SN74CB3T16210DGG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- *
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- Packaging:
- Bulk
- Product Status:
- Active
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- Independent Circuits:
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- Current - Output High, Low:
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- Voltage - Supply:
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SN74CB3T16210DGG FAQ
1.How can I place an order for SN74CB3T16210DGG through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74CB3T16210DGG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74CB3T16210DGG reliable?
The price and inventory of SN74CB3T16210DGG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74CB3T16210DGG is usually 5 days.
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5.How can I obtain technical support or documentation for SN74CB3T16210DGG?
For technical support, including SN74CB3T16210DGG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74CB3T16210DGG requirements.
6.How does Aetrix verify that SN74CB3T16210DGG is sourced from the original manufacturer or authorized distributors?
All SN74CB3T16210DGG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74CB3T16210DGG meets industry standards.
7.What is the process for return or replacement of SN74CB3T16210DGG?
All SN74CB3T16210DGG units undergo pre-shipment inspection (PSI). If there is an issue with SN74CB3T16210DGG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CB3T16210DGG part is unused and in its original packaging.
Return procedure for SN74CB3T16210DGG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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