Texas Instruments SN74CB3T16210DGGR
- Part No.:
- SN74CB3T16210DGGR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 48-TFSOP (0.240", 6.10mm Width)
- Datasheet:
-
SN74CB3T16210DGGR.pdf
- Description:
- IC BUS SWITCH 10 X 1:1 48TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:2,403
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Product details
Overview
SN74CB3T16210 from Texas Instruments is a 20-bit FET bus switch IC with dual 10-bit configurable switching, 5-V-tolerant I/Os, 5 Ω typical ON-state resistance, and mixed-mode level translation supporting 2.5 V/3.3 V VCC with 0–5 V signaling on all data ports. It enables bidirectional signal routing in PCI, USB, and memory-interleaved systems.
For engineers reviewing the SN74CB3T16210 datasheet, SN74CB3T16210 pinout, SN74CB3T16210 application, or SN74CB3T16210 equivalent, key selection considerations include its 2.3–3.6 V supply range, Ioff partial-power-down support, near-zero propagation delay (0.15 ns), 5 pF OFF-state I/O capacitance, and TSSOP-48 package compatibility with high-density PCB layouts.
Technical Context
The SN74CB3T16210 implements two independent 10-bit FET bus switches controlled by separate OE inputs (1OE, 2OE), enabling either dual 10-bit or unified 20-bit operation. Each switch provides bidirectional conduction with voltage translation that tracks VCC - e.g., 5-V input to 3.3-V output when VCC = 3.3 V.
Its architecture supports true 5-V tolerance on all I/Os regardless of power state, includes undershoot clamp diodes on data/control inputs, and guarantees latch-up immunity >250 mA per JESD 17. The device uses zero-threshold FETs to achieve low ron and minimal loading, with Ioff preventing backflow during partial power-down.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.3 V to 3.6 V - defines minimum system rail compatibility for low-voltage logic domains |
| ron (Typ) | 5 Ω - ensures minimal signal attenuation and voltage drop across active switch paths |
| Cio(OFF) (Typ) | 5 pF - reduces capacitive loading on upstream drivers and improves signal integrity in high-speed buses |
| tpd (Max) | 0.25 ns at VCC = 2.5 V - enables sub-nanosecond timing-critical applications like DDR memory isolation |
| Ioff | 10 μA max at VCC = 0 V - prevents damaging current flow during hot-insertion or partial power-down sequences |
| VI/O Range | 0 V to 5.5 V - allows interoperability between 5-V TTL, 3.3-V LVTTL, and 2.5-V CMOS subsystems without external level shifters |
| ICC (Max) | 40 μA - supports ultra-low static power in battery-powered portable equipment |
Pinout & Package
TSSOP-48 (DGG) package: 12.6 mm × 6.2 mm × 1.2 mm body, 0.5 mm pitch, lead-free NiPdAu finish, MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A1–1A10, 2A1–2A10 | Input/Output Port A (Group 1 & 2) | Bidirectional data terminals for first and second 10-bit switch banks; 5-V tolerant, support mixed-voltage signaling |
| 1B1–1B10, 2B1–2B10 | Input/Output Port B (Group 1 & 2) | Complementary bidirectional data terminals; electrically identical to corresponding A pins, fully interchangeable |
| 1OE, 2OE | Active-Low Output Enable | Independent control of each 10-bit switch; low = ON (A↔B connected), high = high-Z isolation |
| VCC | Positive Supply | Single 2.3–3.6 V rail powering internal FET gates and control logic; determines output voltage translation level |
| GND | Ground Reference | Four dedicated ground pins (pins 7, 16, 25, 37) minimize ground bounce and improve noise immunity in high-speed switching |
| NC | No Internal Connection | Pins 1, 4, 12, 13, 24, 36, 47, 48 - must remain unconnected; no internal circuitry or ESD protection |
Key Features
| Feature | Design Value |
|---|---|
| 5-V-tolerant I/Os with powered-down safety | Guarantees robust interface to legacy 5-V peripherals even when VCC = 0 V, eliminating need for external clamping |
| Mixed-mode level translation tracking VCC | Automatically scales output voltage to match VCC (e.g., 5-V input → ~3.3-V output at VCC = 3.3 V), removing discrete translator ICs |
| Ioff partial-power-down support | Blocks reverse current flow during board-level power sequencing, protecting live backplane signals from unpowered sections |
| Low 5 pF OFF-state I/O capacitance | Minimizes signal degradation and crosstalk in high-frequency parallel buses such as address/data lines in microprocessor interfaces |
| Bidirectional zero-delay switching | Enables transparent signal pass-through in both directions without direction control logic or added latency |
Applications
| PCI Express Slot Isolation | USB 2.0 Data Line Switching |
|---|---|
Use Scenario: Isolating PCIe root complex from add-in cards during hot-plug events while maintaining 5-V-tolerant signaling. IC Role / Device Role / Timing Role: Bidirectional 20-bit bus switch providing galvanic isolation and level translation between 3.3-V controller and 5-V peripheral slots. Use Value: Eliminates need for separate level translators and isolators; supports seamless hot-swap compliance with <0.25 ns added delay. | Use Scenario: Sharing USB 2.0 D+/D− lines between multiple host controllers in embedded docking stations. IC Role / Device Role / Timing Role: Dual 10-bit switch routing differential data pairs with matched trace lengths and minimal skew. Use Value: Preserves USB 2.0 signal integrity up to 480 Mbps via 5 Ω ron and 5 pF Cio(OFF), avoiding eye-diagram closure. |
| Memory Interleaving Interface | Low-Power Portable System Bus |
Use Scenario: Connecting two 10-bit memory banks to a single 20-bit data bus in DDR SDRAM controllers with dynamic bank selection. IC Role / Device Role / Timing Role: Configurable 20-bit switch enabling time-multiplexed access to interleaved memory modules without bus contention. Use Value: Reduces PCB layer count by replacing dual 10-bit multiplexers; maintains <10 ps skew across all 20 bits. | Use Scenario: Enabling/disabling peripheral subsystems (e.g., display, audio) in smartphones and tablets to extend battery life. IC Role / Device Role / Timing Role: Low-quiescent-current (40 μA max) bus switch isolating inactive peripherals from active SoC domains. Use Value: Achieves sub-μA system standby current via Ioff and OE-controlled high-Z states, meeting Energy Star requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FET bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBTD16210DGGR | Higher VCC range (4.5–5.5 V); no 2.5-V operation; 7 Ω ron; lacks Ioff | Designed for pure 5-V systems only; unsuitable for mixed-voltage or partial-power-down use cases | Select only if operating exclusively at 5 V and Ioff is not required |
| SN74LVC16245ADGGR | 3-state buffer (not FET switch); 3.3-V only; 24 mA drive; no 5-V tolerance; higher propagation delay (~5 ns) | Requires direction control and external level shifters for 5-V interfacing; adds timing overhead | Choose only when driving terminated transmission lines or needing push-pull output strength over passive switching |
Compared with SN74CB3T16210, SN74CBTD16210 offers higher voltage headroom but sacrifices low-voltage flexibility and power-down safety, while SN74LVC16245A provides stronger drive capability at the cost of latency, voltage compatibility, and passive transparency.
Availability
SN74CB3T16210 is available at Aetrix Electronics and suitable for PCI interface isolation, USB 2.0 line sharing, and memory-interleaved bus architectures requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for SN74CB3T16210 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of expertise in high-speed interface and power-efficient logic design.
The SN74CB3T16210 belongs to TI's Widebus™ family of advanced bus switches, engineered specifically for low-latency, mixed-voltage signal routing in computing, communications, and portable electronics.
FAQ
What is the maximum operating temperature range for the SN74CB3T16210?
The SN74CB3T16210 is rated for continuous operation from –40°C to +85°C ambient temperature. This industrial-grade range ensures reliable performance in embedded computing, networking equipment, and automotive infotainment systems where thermal margins are critical. All electrical specifications in the datasheet are guaranteed across this full range.
Does the SN74CB3T16210 support true bidirectional signal flow without direction control?
Yes, the SN74CB3T16210 provides fully bidirectional signal conduction between A and B ports with no direction pin required. When enabled (OE low), current flows equally well from A-to-B or B-to-A due to its symmetrical FET structure. This eliminates timing skew and control logic overhead found in directional transceivers, making it ideal for transparent bus isolation in protocols like USB and PCI.
Can the SN74CB3T16210 be used with a 2.5-V supply while interfacing to 5-V signals?
Yes, the SN74CB3T16210 supports 2.5-V VCC operation while accepting 0–5-V inputs on all I/O pins. With VCC = 2.5 V, it translates 5-V inputs down to ~2.5-V outputs, enabling direct connection between legacy 5-V peripherals and modern 2.5-V logic domains without external level shifters - a core feature confirmed in Figure 1 and the DC translation characteristics section.
How does the Ioff feature protect the SN74CB3T16210 during partial power-down?
The Ioff feature limits current to ≤10 μA when VCC = 0 V and any I/O is biased to 0–5.5 V, preventing damaging backflow through the device. In systems with staggered power rails - such as hot-pluggable modules or multi-rail SoCs - this ensures that powered-down sections of the SN74CB3T16210 do not load or disrupt active signal paths, preserving signal integrity and system reliability.
What is the recommended pull-up resistor value for OE pins on the SN74CB3T16210?
Texas Instruments recommends tying OE pins to VCC through a pull-up resistor to ensure high-impedance state during power-up or power-down. The minimum resistor value depends on the driver's current-sinking capability; for standard CMOS drivers, 10 kΩ is typical. This prevents undefined switch states and avoids bus contention before firmware initializes the enable control logic in the SN74CB3T16210.
SN74CB3T16210DGGR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CB
- Package/Case:
- 48-TFSOP (0.240", 6.10mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Bus Switch
- Circuit:
- 10 x 1:1
- Independent Circuits:
- 2
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSSOP
SN74CB3T16210DGGR FAQ
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7.What is the process for return or replacement of SN74CB3T16210DGGR?
All SN74CB3T16210DGGR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CB3T16210DGGR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CB3T16210DGGR part is unused and in its original packaging.
Return procedure for SN74CB3T16210DGGR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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