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Texas Instruments SN74CB3T16211DGGR
- Part No.:
- SN74CB3T16211DGGR
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 56-TFSOP (0.240", 6.10mm Width)
- Datasheet:
-
SN74CB3T16211DGGR.pdf
- Description:
- IC BUS SWITCH 12 X 1:1 56TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:4,808
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Product details
Overview
SN74CB3T16211 from Texas Instruments is a 24-bit FET bus switch IC with dual 12-bit configurable channels, 5-V tolerant I/Os, 2.3–3.6 V supply range, 5 Ω typical ON-state resistance, and bidirectional near-zero-delay signal routing for mixed-voltage system interconnects.
For engineers reviewing the SN74CB3T16211 datasheet, SN74CB3T16211 pinout, SN74CB3T16211 application, or SN74CB3T16211 equivalent, key selection considerations include voltage translation capability across 0–5 V signaling levels, partial-power-down (Ioff) support, 56-pin TSSOP (DGG) package compatibility, and TTL/CMOS-compatible control input drive requirements.
Technical Context
The SN74CB3T16211 implements two independent 12-bit FET-based analog switches controlled by separate OE inputs (1OE, 2OE), enabling either dual 12-bit or unified 24-bit bus isolation. Each channel supports bidirectional data flow with no direction pin required.
Its voltage-translation architecture tracks VCC, allowing 5-V inputs to be level-shifted down to 2.5-V or 3.3-V outputs depending on VCC setting, while maintaining 5-V tolerance on all I/Os regardless of power state - critical for hot-swap and mixed-supply system interoperability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.3 V to 3.6 V - enables operation in both 2.5-V and 3.3-V system domains |
| ron (Typ) | 5 Ω - ensures minimal insertion loss and signal integrity for high-speed digital buses |
| Ioff Support | Yes - prevents backflow current during partial power-down, protecting unpowered subsystems |
| Cio(OFF) (Typ) | 5 pF - reduces capacitive loading on driven lines, preserving edge rates up to ~500 MHz |
| tpd (Max) | 0.25 ns at 3.3 V - delivers near-transparent propagation for timing-critical interconnects |
| I/O Voltage Range | 0 V to 5.5 V - supports interoperability between 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5 V logic families |
| ICC (Max) | 70 μA - enables use in battery-powered portable equipment without significant quiescent drain |
Pinout & Package
TSSOP-56 (DGG) package: 13.9 mm × 6.0 mm × 1.2 mm body, 0.5 mm pitch, exposed metal-free thermal pad, RoHS-compliant NiPdAu lead finish, MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A1–1A12, 2A1–2A12 | Input/Output Port A (Channel 1 & 2) | Bidirectional data terminals for first and second 12-bit switch banks |
| 1B1–1B12, 2B1–2B12 | Input/Output Port B (Channel 1 & 2) | Corresponding bidirectional data terminals connected through FET when OE active |
| 1OE, 2OE | Output Enable (Active-Low) | Independent control per 12-bit bank; low = ON (A↔B conductive), high = high-Z isolation |
| VCC | Supply Voltage | Single 2.3–3.6 V rail powering internal gate drivers and level-shifting circuitry |
| GND | Ground Reference | Common return path for all switching and control circuits; multiple pins reduce ground bounce |
| NC | No Internal Connection | Pins 1 and 56 - mechanical alignment only; must remain unconnected |
Key Features
| Feature | Design Value |
|---|---|
| Output voltage translation | Tracks VCC - enables automatic 5-V-to-3.3-V or 5-V-to-2.5-V downshift without external components |
| Mixed-mode signal operation | Supports simultaneous 0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5 V signaling on same device |
| 5-V tolerant I/Os | Operates safely with 5-V signals applied while powered at 2.5 V or 3.3 V, or even during full power-down |
| Bidirectional zero-delay routing | No internal logic or buffering - signal passes through FET switch with <0.25 ns propagation delay |
| Undershoot clamp diodes | Integrated protection on all data and control inputs - suppresses negative transients below –1.2 V |
Applications
| PCI Express Interconnect Isolation | Multi-Rail FPGA I/O Bridging |
|---|---|
Use Scenario: Isolating legacy PCI slots from modern 3.3-V or 2.5-V host controllers while retaining 5-V signaling compatibility. IC Role / Device Role / Timing Role: Bidirectional bus switch providing hot-plug-safe, level-translating isolation between mismatched voltage domains. Use Value: Eliminates need for discrete level shifters and buffers; maintains sub-nanosecond timing alignment across PCIe Gen1/Gen2 links. | Use Scenario: Connecting heterogeneous FPGA I/O banks (1.2 V, 1.8 V, 2.5 V) to external memory or peripheral interfaces operating at 3.3 V or 5 V. IC Role / Device Role / Timing Role: Configurable 24-bit voltage translator enabling per-bank enable/disable for dynamic I/O domain partitioning. Use Value: Reduces PCB layer count by consolidating translation functions into single DGG56 package; supports simultaneous multi-standard signaling. |
| Low-Power Industrial Sensor Hub | USB 2.0 Data Line Level Translation |
Use Scenario: Aggregating analog and digital sensor outputs (1.8 V/2.5 V) into a 3.3-V microcontroller subsystem with power-gating capability. IC Role / Device Role / Timing Role: Power-aware bus switch enabling selective isolation of sensor clusters during sleep mode via Ioff. Use Value: Cuts system standby current by blocking leakage paths; maintains 5-V tolerant wake-up signal routing without additional protection circuitry. | Use Scenario: Adapting USB 2.0 D+/D− lines between 3.3-V PHY and 5-V legacy hub controllers in embedded docking stations. IC Role / Device Role / Timing Role: Low-capacitance (<5 pF OFF), low-ron (5 Ω) analog switch preserving USB 2.0 eye diagram integrity up to 480 Mbps. Use Value: Avoids signal degradation from series resistors or active repeaters; supports plug-and-play compatibility without firmware reconfiguration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FET bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBTLV3245PWR | 8-bit, non-level-shifting, 3.3-V only, no 5-V tolerance | Limited to uniform 3.3-V systems; lacks mixed-voltage translation | Select when only 3.3-V isolation is needed and board space is constrained |
| TS3DV642RHAT | 24-bit, 3.3-V supply, 5-V tolerant, but higher ron (8 Ω typ) and Cio(OFF) (10 pF) | Higher insertion loss and capacitive loading limit usable frequency to ~200 MHz | Choose if TI's Widebus™ ecosystem integration is not required and cost is primary driver |
Compared with SN74CB3T16211, SN74CBTLV3245PWR offers smaller footprint but no voltage translation, while TS3DV642RHAT provides similar channel count and tolerance but trades off signal integrity for lower unit cost - making SN74CB3T16211 optimal for high-fidelity, mixed-rail interconnects demanding sub-ns timing and ultra-low loading.
Availability
SN74CB3T16211 is available at Aetrix Electronics and suitable for PCI interface isolation, FPGA I/O bridging, and low-power sensor hub designs requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for SN74CB3T16211 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in high-reliability, high-performance silicon solutions.
The SN74CB3T16211 belongs to TI's Widebus™ family of high-speed bus switches, designed specifically for voltage-domain bridging and signal integrity preservation in mixed-supply digital systems such as communications infrastructure, industrial automation, and portable computing.
FAQ
What is the maximum operating frequency supported by the SN74CB3T16211?
The SN74CB3T16211 does not specify a hard maximum frequency, but its 5 pF OFF-state capacitance and 0.25 ns max propagation delay support clean signal transmission up to approximately 500 MHz in well-terminated 50-Ω environments. Real-world bandwidth depends on PCB layout, load capacitance, and drive strength - verified in TI's application note SBAA222 for high-speed bus switch design.
Does the SN74CB3T16211 require external pull-up resistors on its I/O lines?
The SN74CB3T16211 includes internal pull-up current sources that maintain output voltage at VCC when enabled and input ≥ VCC – 1 V. However, if an I/O port connects to a pulldown resistor, output voltage may drop below VCC at low frequencies; a pullup to VCC is recommended in such cases. No external pull-ups are needed for standard CMOS interfacing.
Can the SN74CB3T16211 be used for analog signal switching?
Yes - the SN74CB3T16211 is a passive FET-based switch with rail-to-rail analog capability, supporting DC-coupled signals from 0 V to 5.5 V. Its 5 Ω ron and 5 pF Cio(OFF) make it suitable for low-distortion analog routing up to ~100 MHz, provided signal swing remains within absolute maximum ratings and VI/O limits.
How does the Ioff feature function in the SN74CB3T16211 during system power sequencing?
The Ioff feature in the SN74CB3T16211 actively disables current flow between A and B ports when VCC = 0 V, preventing damaging back-current from live I/O lines into unpowered circuitry. This allows safe hot-insertion and staggered power-up/down sequences in modular systems - validated per JESD 78 with <10 μA leakage at 5.5 V I/O and 0 V VCC.
Is the SN74CB3T16211 pin-compatible with other devices in the SN74CB3T family?
Yes - the SN74CB3T16211 shares identical 56-pin TSSOP (DGG), SSOP (DL), and TVSOP (DGV) footprints and pinout with SN74CB3T16210 and SN74CB3T16245, differing only in channel count and enable configuration. This enables drop-in replacement in existing layouts when upgrading from 12-bit or 24-bit variants with shared control architecture.
SN74CB3T16211DGGR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CB
- Package/Case:
- 56-TFSOP (0.240", 6.10mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Bus Switch
- Circuit:
- 12 x 1:1
- Independent Circuits:
- 2
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSSOP
SN74CB3T16211DGGR FAQ
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6.How does Aetrix verify that SN74CB3T16211DGGR is sourced from the original manufacturer or authorized distributors?
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7.What is the process for return or replacement of SN74CB3T16211DGGR?
All SN74CB3T16211DGGR units undergo pre-shipment inspection (PSI). If there is an issue with SN74CB3T16211DGGR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74CB3T16211DGGR part is unused and in its original packaging.
Return procedure for SN74CB3T16211DGGR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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